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Renesas 70V3579S6BCI8

Part No.:
70V3579S6BCI8
Manufacturer:
Renesas
Category:
Memory
Package:
256-LBGA
Datasheet:
Aetrix70V3579S6BCI8.pdf
Description:
IC SRAM 1.125MBIT PAR 256CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,917

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Product details

Overview

70V3579S6BCI8 from Integrated Device Technology is a high-speed 32K × 36-bit synchronous dual-port static RAM with pipelined output mode, 6 ns max clock-to-data access, 7.5 ns cycle time (133 MHz), and industrial temperature support (–40°C to +85°C). It enables simultaneous read/write access to the same memory location from independent left/right ports and is used in real-time packet buffering for telecom line cards.

For engineers reviewing the 70V3579S6BCI8 datasheet, 70V3579S6BCI8 pinout, 70V3579S6BCI8 application, or 70V3579S6BCI8 equivalent, key selection criteria include pipelined latency timing, dual-voltage I/O support (3.3 V/2.5 V per port), counter-enabled burst addressing, and 208-pin PQFP package compatibility with depth-expansion logic.

Technical Context

The 70V3579S6BCI8 implements full synchronous operation on both ports using edge-triggered registers for address, data, and control inputs-enabling 1.8 ns setup and 0.7 ns hold times at 133 MHz. Its true dual-port architecture allows concurrent access without arbitration logic.

It supports independent voltage selection per port via OPTL/OPTR pins (3.3 V or 2.5 V I/O), with core VDD fixed at 3.3 V. The integrated address counter-enabled by CNTEN and reset by CNTRST-provides burst-mode sequential access without external sequencing logic.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 32K × 36 bits (1.152 Mbit); supports independent 36-bit parallel access on left and right ports
Clock Cycle Time 7.5 ns min (133 MHz); defines minimum clock period for pipelined read/write operations
Max Clock-to-Data (tCD2) 6 ns (commercial grade S6); determines worst-case latency from CLK rise to valid output data
Operating Temperature –40°C to +85°C (industrial grade); validated for embedded systems in uncontrolled thermal environments
I/O Voltage Support Selectable 3.3 V or 2.5 V per port via OPT pins; enables mixed-voltage system interfacing without level shifters
Power Supply VDD = 3.3 V ± 150 mV (core); VDDQ = 3.3 V ± 150 mV or 2.5 V ± 125 mV (I/O); decoupling required per port
Standby Current (ISB3) 6 mA typ / 15 mA max (both ports fully disabled); critical for low-power idle states in always-on systems

Pinout & Package

70V3579S6BCI8 is packaged in a 208-pin Plastic Quad Flatpack (PQFP) with 0.5 mm lead pitch and 28 mm × 28 mm body size. All VDD pins require 3.3 V supply; VDDQL/VDDQR must match OPTL/OPTR logic levels (3.3 V for VIH, 2.5 V for VIL); all VSS pins connect to ground.

Pin/Terminal Circuit Role Design Meaning
CLKL / CLKR Port-synchronous clock input Edge-triggered register control for all inputs/outputs on respective port; no internal clock distribution delay
A0L–A14L / A0R–A14R Address inputs (15-bit) Directly select one of 32K locations per port; ADSL/ADSR enable asynchronous address latching
I/O0L–I/O35L / I/O0R–I/O35R Bidirectional data bus (36-bit) Supports byte-wise access via BE0–BE3; each byte enables 9-bit segment for partial writes
CE0L/CE1L / CE0R/CE1R Chip enable pair Dual-enable logic: CE0 = VIL & CE1 = VIH activates port; enables depth expansion without external gating
R/WL / R/WR Read/write direction control Synchronous active-low signal; controls data flow direction on respective port during clock cycle
OEL / OER Output enable Asynchronous control; places I/O bus in high-impedance state independent of clock edge
OPTL / OPTR I/O voltage select DC-level input (VIH = 3.3 V, VIL = 0 V) that configures VDDQL/VDDQR supply requirement and interface voltage
CNTRSTL / CNTRSTR Counter reset Asynchronous reset of internal address counter to 0; no dead cycle-immediate access to address 0
CNTENL / CNTENR Counter enable Enables automatic address increment on rising CLK when ADS = VIH; eliminates external address sequencer

Key Features

Feature Design Value
True dual-port memory cells Enables simultaneous, independent read/write access to identical addresses-eliminates arbitration overhead in co-processor or DMA architectures
Pipelined output mode Delivers deterministic 1-cycle latency between clock and output data, enabling predictable timing closure in high-speed bus designs
Separate byte controls (BE0–BE3) Allows 9-bit granularity writes across 36-bit bus, reducing bus contention and enabling efficient protocol header/payload updates
Dual chip enables (CE0/CE1) Permits seamless depth expansion (e.g., 64K × 36) using multiple devices without external decode logic or glue ICs
Self-timed write cycle Internal write timing control ensures reliable data capture across voltage/temperature corners without external timing adjustment
Automatic power-down mode Reduces dynamic current to ≤15 mA (ISB3) when both CE pairs are inactive-critical for thermal management in dense PCB layouts

Applications

Telecom Packet Buffering Real-Time DSP Co-Processing

Use Scenario: Storing and forwarding variable-length Ethernet/IP packets between ingress and egress MAC interfaces in carrier-grade switches.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-latency shared memory between two independent traffic engines-one writing incoming frames, the other reading for classification and forwarding.

Use Value: Simultaneous access avoids FIFO bottlenecks; 133 MHz bandwidth (9.6 Gbps) sustains line-rate 10G Ethernet processing without backpressure.

Use Scenario: Providing shared coefficient and sample memory between a main CPU and dedicated DSP engine in radar signal processing units.

IC Role / Device Role / Timing Role: Left port interfaces to ARM-based controller for coefficient loading; right port feeds streaming ADC samples to TI C6000 DSP core at 133 MHz.

Use Value: Pipelined tCD2 ≤ 6 ns ensures deterministic sample-to-computation latency; counter mode enables burst FFT windowing without address generation overhead.

Industrial Motion Control Avionics Data Acquisition

Use Scenario: Synchronizing position feedback from multiple servo drives and issuing coordinated PWM commands in CNC machine controllers.

IC Role / Device Role / Timing Role: Acts as time-critical shared buffer between FPGA motion planner (writing trajectory points) and microcontroller safety monitor (reading status).

Use Value: Industrial temp range (–40°C to +85°C) and 6 ns access guarantee real-time response in harsh factory environments; dual CE enables watchdog-triggered memory freeze.

Use Scenario: Capturing high-resolution sensor telemetry (IMU, pressure, temperature) across redundant flight control channels in UAVs.

IC Role / Device Role / Timing Role: Right port acquires 36-bit sensor fusion data from ADC array; left port streams validated results to flight computer via synchronized DMA.

Use Value: 2.5 V/3.3 V I/O flexibility interfaces directly to mixed-voltage avionics ASICs; low ISB3 current extends battery life during standby monitoring.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1362BV33-167BZXI 32K × 36, 167 MHz (6 ns), but only 3.3 V I/O; no 2.5 V option or OPT pin control Lacks per-port voltage selection-requires external level translation when interfacing to 2.5 V FPGAs Choose when maximum speed (167 MHz) is prioritized over mixed-voltage flexibility and industrial temp is not required.
AS7C33256PFSIG 32K × 36, 10 ns access, 100 MHz; CMOS-compatible 3.3 V only; no pipelined mode or address counter No pipelining or burst counter-requires external address sequencer and adds 1–2 cycle latency per access Choose for cost-sensitive, lower-bandwidth applications where deterministic latency and burst efficiency are non-critical.

Compared with CY7C1362BV33-167BZXI and AS7C33256PFSIG, the 70V3579S6BCI8 uniquely delivers industrial temperature support, per-port 2.5 V/3.3 V I/O configurability, and integrated address counter-reducing BOM count and PCB area in high-reliability, mixed-voltage embedded systems.

Availability

70V3579S6BCI8 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, and avionics data acquisition requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 70V3579S6BCI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.

The 70V3579S6BCI8 belongs to IDT's high-speed synchronous dual-port SRAM product line, engineered specifically for deterministic, low-latency shared-memory applications in telecom line cards, radar processors, and real-time control systems.

FAQ

What is the maximum operating frequency of the 70V3579S6BCI8?

The 70V3579S6BCI8 supports a 133 MHz clock rate with a minimum 7.5 ns cycle time (tCYC2) in pipelined mode. This is validated for the S6 speed grade across the industrial temperature range (–40°C to +85°C), delivering 9.6 Gbps aggregate bandwidth across its 36-bit dual ports.

Does the 70V3579S6BCI8 support mixed-voltage operation between its two ports?

Yes, the 70V3579S6BCI8 supports independent I/O voltage selection per port: OPTL configures the left port for either 3.3 V or 2.5 V operation, and OPTR does the same for the right port. This allows direct interfacing with heterogeneous logic families-such as a 2.5 V FPGA and a 3.3 V microcontroller-without external level shifters.

How does the address counter function in the 70V3579S6BCI8?

The 70V3579S6BCI8 integrates an on-chip address counter controlled by CNTENL/CNTENR and CNTRSTL/CNTRSTR. When CNTEN = VIL and ADS = VIH, the counter advances automatically on each rising CLK edge, generating sequential addresses for burst transfers. CNTRST asynchronously resets the counter to address 0, enabling rapid reinitialization without software overhead.

What package type is used for the 70V3579S6BCI8?

The 70V3579S6BCI8 is supplied in a 208-pin Plastic Quad Flatpack (PQFP) with 0.5 mm lead pitch and 28 mm × 28 mm body size. This RoHS-compliant, green package is optimized for automated assembly and thermal dissipation in high-density industrial PCBs.

Can the 70V3579S6BCI8 be used in depth-expanded memory configurations?

Yes, the 70V3579S6BCI8 supports depth expansion using its dual chip enable (CE0/CE1) architecture. By tying CE0L/CE1L of one device to CE0R/CE1R of another and sharing clocks/addresses, designers can construct wider memory arrays (e.g., 64K × 36) without additional logic gates or address decoding circuitry.

70V3579S6BCI8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
256-LBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
1.125Mbit
Memory Organization:
32K x 36
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
6 ns
Voltage - Supply:
3.15V ~ 3.45V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
256-CABGA (17x17)

70V3579S6BCI8 FAQ

1.How can I place an order for 70V3579S6BCI8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 70V3579S6BCI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70V3579S6BCI8 reliable?

The price and inventory of 70V3579S6BCI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V3579S6BCI8 is usually 5 days.

3.What payment methods are accepted for 70V3579S6BCI8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70V3579S6BCI8 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70V3579S6BCI8?

70V3579S6BCI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70V3579S6BCI8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70V3579S6BCI8?

For technical support, including 70V3579S6BCI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V3579S6BCI8 requirements.

6.How does Aetrix verify that 70V3579S6BCI8 is sourced from the original manufacturer or authorized distributors?

All 70V3579S6BCI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V3579S6BCI8 meets industry standards.

7.What is the process for return or replacement of 70V3579S6BCI8?

All 70V3579S6BCI8 units undergo pre-shipment inspection (PSI). If there is an issue with 70V3579S6BCI8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70V3579S6BCI8 part is unused and in its original packaging.

Return procedure for 70V3579S6BCI8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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