Renesas 70V3589S133BCI
- Part No.:
- 70V3589S133BCI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 256-LBGA
- Datasheet:
-
70V3589S133BCI.pdf
- Description:
- IC SRAM 2MBIT PARALLEL 256CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
70V3589S133BCI from IDT (now Renesas) is a high-speed 128K × 36-bit synchronous dual-port SRAM with independent left/right ports, 133MHz operation (7.5ns cycle time), pipelined or flow-through output modes, and industrial temperature support (–40°C to +85°C). It enables simultaneous read/write access to the same memory location in telecom switching fabrics, network packet buffers, and real-time DSP co-processing systems.
For engineers reviewing the 70V3589S133BCI datasheet, 70V3589S133BCI pinout, 70V3589S133BCI application, or 70V3589S133BCI equivalent, key selection criteria include dual-port timing latency (tCD2 ≤ 4.2ns), selectable 2.5V/3.3V I/O voltage per port via OPT pins, JTAG IEEE 1149.1 compliance, and depth expansion support using dual chip enables without external logic.
Technical Context
This device implements fully synchronous dual-port architecture with separate address, data, and control registers on both ports-enabling minimal setup (1.7ns) and hold (0.5ns) times at 133MHz. Its self-timed write mechanism maintains fast cycle time without external wait-state generation.
The memory supports independent voltage configuration: core VDD = 3.3V ±150mV, while each port's I/O and control voltage (VDDQ) is selectable between 2.5V (±100mV) and 3.3V (±150mV) via dedicated OPTL/OPTR pins-allowing mixed-voltage system interfacing without level shifters.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36 bits (4.608 Mbit), true dual-port cell array enabling concurrent access |
| Max Clock Frequency | 133MHz (7.5ns cycle time in pipelined mode), validated for industrial temperature range |
| Access Time | tCD2 ≤ 4.2ns (clock-to-data valid, pipelined), tCD1 ≤ 15ns (flow-through) |
| I/O Voltage Support | Per-port selectable: 2.5V (±100mV) or 3.3V (±150mV) via OPTL/OPTR pins |
| Operating Temperature | –40°C to +85°C (industrial grade), with full AC/DC specs guaranteed across range |
| Power Supply | VDD = 3.3V ±150mV (core); VDDQ independently configurable per port |
| JTAG Compliance | Fully IEEE 1149.1-compliant boundary-scan with TCK, TMS, TDI, TDO, TRST |
Pinout & Package
70V3589S133BCI is available in a 208-pin fine-pitch Ball Grid Array (fpBGA) package with 0.8mm ball pitch and 15mm × 15mm body size. Pin functions are symmetrically distributed across left (L) and right (R) ports, with dedicated clock, address, data I/O, byte enable, chip enable, and control signals per port.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port-specific clock input | Synchronous edge-triggered timing reference for all registered inputs/outputs on respective port |
| A0L–A16L / A0R–A16R | Address inputs | 17-bit address bus per port; A16 is no-connect for this variant (IDT70V3589) |
| I/O0L–I/O35L / I/O0R–I/O35R | Bidirectional data I/O | 36-bit parallel data path per port; supports byte-wise read/write via BE0–BE3 |
| CE0L/CE1L / CE0R/CE1R | Dual chip enables | Independent port activation; dual-enable logic allows seamless depth expansion without glue logic |
| PL/FTL / PL/FTR | Pipeline/Flow-Through mode select | DC-level control (VIH/VIL) to configure output latency behavior per port |
| OPTL / OPTR | I/O voltage option select | Configures VDDQX supply voltage level (2.5V or 3.3V) for corresponding port's I/Os and controls |
Key Features
| Feature | Design Value |
|---|---|
| True dual-port memory cells | Enables simultaneous, independent read/write operations on same address location-critical for lock-free inter-processor communication |
| Selectable output mode | Pipelined (1-cycle latency, 4.2ns tCD2) or flow-through (0-cycle latency, 15ns tCD1) per port-optimizes timing closure in mixed-criticality systems |
| Dual-cycle deselect (DCD) | Prevents metastability during rapid port disable in pipelined mode by requiring two clock cycles to exit active state |
| Separate byte controls | Four 9-bit byte enables (BE0–BE3) per port allow granular 8-bit/16-bit/24-bit/32-bit writes without masking logic |
| Counter enable & repeat | On-chip address counter with REPEAT latch enables burst sequential access without external address generation logic |
Applications
| Telecom Switch Fabric Buffer | Real-Time DSP Co-Processor Memory |
|---|---|
Use Scenario: Storing incoming/outgoing packet headers and payload fragments in a multi-stage ATM or Ethernet switch ASIC. IC Role / Device Role / Timing Role: Dual-port SRAM acts as shared buffer between ingress and egress pipeline stages, accepting writes from one port while simultaneously serving reads to the other. Use Value: 133MHz pipelined operation delivers 4.2ns tCD2 latency, enabling sub-10ns inter-stage handoff critical for 10G+ line-rate forwarding. | Use Scenario: Hosting coefficient tables and intermediate results between a fixed-point DSP core and an FPGA-based preprocessor. IC Role / Device Role / Timing Role: Provides zero-wait-state, low-latency shared memory accessible concurrently by both processing units-eliminating arbitration overhead. Use Value: Independent 2.5V/3.3V I/O per port allows direct interface to 2.5V DSP data bus and 3.3V FPGA I/O banks without level shifters. |
| Industrial Motion Controller FIFO | Radar Signal Processing Frame Buffer |
Use Scenario: Buffering position commands and sensor feedback between a real-time motion controller CPU and servo drive interface ASIC. IC Role / Device Role / Timing Role: Acts as deterministic, jitter-free command queue with simultaneous write (CPU) and read (ASIC) access under industrial temperature stress. Use Value: –40°C to +85°C guaranteed operation ensures reliability in uncooled cabinet environments; dual CE enables support multi-depth command stacks. | Use Scenario: Capturing and staging digitized radar return samples before FFT processing in phased-array antenna systems. IC Role / Device Role / Timing Role: Serves as ping-pong frame buffer-writing new ADC samples to one port while reading prior frame from the other for real-time FFT. Use Value: 36-bit wide I/O matches typical 12-bit × 3-channel ADC output; 133MHz bandwidth sustains >4 Gbps sustained throughput for L-band SAR imaging. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362KV18-133BZI | 128K × 18-bit organization; 18-bit data width vs. 36-bit; requires two devices for same data path width | Limited to narrower datapaths; suitable only when 18-bit granularity suffices or space permits dual-device layout | Select only if system design already uses Cypress 18-bit dual-port family and board area allows duplication |
| AS7C312836B-133BIN | Same 128K × 36 organization but lacks JTAG, pipelined/flow-through mode select, and dual CE logic | No IEEE 1149.1 test support; no per-port voltage selection; no depth-expansion optimization | Consider only for cost-sensitive, non-JTAG-requiring applications where simplified control logic is acceptable |
Compared with CY7C1362KV18-133BZI and AS7C312836B-133BIN, the 70V3589S133BCI uniquely delivers 36-bit width with per-port voltage flexibility, JTAG debug capability, and hardware-optimized depth expansion-making it the only choice for high-bandwidth, mixed-voltage, production-testable dual-port memory subsystems.
Availability
70V3589S133BCI is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, and radar signal processing applications requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for 70V3589S133BCI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics (formerly Integrated Device Technology, IDT) is a global semiconductor leader specializing in high-performance timing, memory, and analog solutions for communications, computing, and industrial markets.
The IDT70V3589 product line was engineered specifically for deterministic, low-latency dual-access memory in real-time networking and signal processing systems-emphasizing synchronous timing precision, voltage flexibility, and testability.
FAQ
What is the maximum guaranteed operating frequency of the 70V3589S133BCI across its full industrial temperature range?
The 70V3589S133BCI is rated for 133MHz operation (7.5ns cycle time) over the full –40°C to +85°C industrial temperature range. This specification is validated per AC Electrical Characteristics Table 11 in the official datasheet, with tCYC2 ≤ 7.5ns and tCD2 ≤ 4.2ns guaranteed under worst-case voltage and temperature conditions. The part does not support 166MHz operation in industrial grade.
How does the 70V3589S133BCI handle voltage mismatch between its left and right ports?
The 70V3589S133BCI supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL = VIL configures the left port for 2.5V I/O operation (with VDDQL = 2.5V), while OPTR = VIH configures the right port for 3.3V I/O (with VDDQR = 3.3V). This eliminates level-shifter requirements in mixed-voltage systems such as FPGA-DSP interfaces.
Does the 70V3589S133BCI support JTAG boundary-scan testing, and which pins are used?
Yes, the 70V3589S133BCI fully complies with IEEE 1149.1 JTAG boundary-scan. It uses five dedicated pins: TCK (pin E16 in fpBGA), TMS (pin P3), TDI (pin B4), TDO (pin A4), and TRST (pin P5). These signals operate at the VDDQ voltage of the port where they are physically located (typically tied to VDDQL or VDDQR depending on board routing).
What is the function of the REPEATL and REPEATR signals in the 70V3589S133BCI address counter?
REPEATL and REPEATR are asynchronous latch controls that reset the internal address counter to the last valid address loaded via ADSL or ADSR, respectively. When asserted, they enable burst sequential access without external address increment logic-critical for DMA-like transfers in packet buffering or FFT staging applications. The latch value is not preset at power-up and must be initialized via an ADS strobe.
Can the 70V3589S133BCI be used in depth-expanded configurations, and what pins enable this?
Yes, the 70V3589S133BCI supports depth expansion using dual chip enables (CE0L/CE1L and CE0R/CE1R). By tying CE0 of one device to CE1 of the next and cascading address lines, multiple devices can be stacked to increase memory depth without additional decoding logic. This is explicitly supported in the datasheet's Truth Table I and Multi-Device Timing Waveforms (Figures 08–09).
70V3589S133BCI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 2Mbit
- Memory Organization:
- 64K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 3.15V ~ 3.45V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-CABGA (17x17)
70V3589S133BCI FAQ
1.How can I place an order for 70V3589S133BCI through Aetrix?
Please submit a Request for Quotation (RFQ) for 70V3589S133BCI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70V3589S133BCI reliable?
The price and inventory of 70V3589S133BCI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V3589S133BCI is usually 5 days.
3.What payment methods are accepted for 70V3589S133BCI?
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4.How is shipping managed for 70V3589S133BCI?
70V3589S133BCI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 70V3589S133BCI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70V3589S133BCI?
For technical support, including 70V3589S133BCI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V3589S133BCI requirements.
6.How does Aetrix verify that 70V3589S133BCI is sourced from the original manufacturer or authorized distributors?
All 70V3589S133BCI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V3589S133BCI meets industry standards.
7.What is the process for return or replacement of 70V3589S133BCI?
All 70V3589S133BCI units undergo pre-shipment inspection (PSI). If there is an issue with 70V3589S133BCI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70V3589S133BCI part is unused and in its original packaging.
Return procedure for 70V3589S133BCI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
70V3589S133BCI Tags

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M24C02-WMN6TP
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