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Renesas 70V3589S133BCI8

Name: 70V3589S133BCI8
Brand: Renesas
SKU: 70V3589S133BCI8
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 70V3589S133BCI8

Manufacturer:: Renesas

Category:: Memory

Package:: 256-LBGA

Datasheet:: 70V3589S133BCI8.pdf

Description:: IC SRAM 2MBIT PARALLEL 256CABGA

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Product details

Overview

70V3589S133BCI8 from IDT (now Renesas) is a high-speed 128K × 36-bit synchronous dual-port static RAM with true dual-port architecture enabling simultaneous read/write access to the same memory location from independent left and right ports. It operates at 133MHz (7.5ns cycle time), supports selectable pipelined or flow-through output modes, features dual chip enables for depth expansion, and delivers 12Gbps aggregate bandwidth. It is used in real-time packet buffering for telecom line cards and FPGA co-processor memory interfaces.

For engineers reviewing the 70V3589S133BCI8 datasheet, 70V3589S133BCI8 pinout, 70V3589S133BCI8 application, or 70V3589S133BCI8 equivalent, key selection criteria include guaranteed 133MHz industrial-grade timing, independent 2.5V/3.3V I/O voltage support per port, JTAG IEEE 1149.1 compliance, and 208-pin fpBGA packaging with verified pin mapping for PCB layout.

Technical Context

This device implements fully synchronous dual-port operation with registered address, data, and control inputs on both ports-enabling 1.7ns setup and 0.5ns hold times at 166MHz. Its internal architecture includes dual independent clock domains (CLKL/CLKR), separate byte-enable logic (BE0–BE3 per port), and an address counter with repeat and enable functions for burst-mode addressing.

The memory supports two distinct output timing modes: pipelined (tCD2 = 4.2ns max, tCYC2 = 7.5ns min) and flow-through (tCD1 = 15ns max, tCYC1 = 25ns min), selected per port via PL/FTL and PL/FTR pins. Dual-cycle deselect (DCD) is active only in pipelined mode, and automatic power-down is controlled independently per port via CE0/CE1.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Organization	128K × 36 bits (4.608 Mbit); supports 128K-word depth with 36-bit parallel I/O per port
Max Clock Frequency	133MHz (industrial grade); enables 7.5ns minimum cycle time in pipelined mode
Access Time (tCD2)	4.2ns max (pipelined); defines worst-case clock-to-valid-data delay for timing-critical read paths
I/O Voltage Support	Selectable 2.5V or 3.3V per port via OPTL/OPTR pins; allows mixed-voltage system interfacing
Operating Temperature	−40°C to +85°C; qualified for industrial environments without derating
Package	208-pin fine-pitch BGA (fpBGA); 15mm × 15mm body, 0.8mm ball pitch, RoHS-compliant
JTAG Compliance	IEEE 1149.1 boundary-scan support with TCK, TMS, TDI, TDO, TRST; enables in-system testability

Pinout & Package

208-pin fine-pitch Ball Grid Array (fpBGA), 15mm × 15mm × 1.4mm, 0.8mm ball pitch. All VDD pins require 3.3V ±150mV; VDDQ pins must match OPT pin logic level (3.3V if OPT = VIH, 2.5V if OPT = VIL).

Pin/Terminal	Circuit Role	Design Meaning
CLKL / CLKR	Port clock inputs	Synchronous edge-triggered clocks for left/right ports; independent timing domains enable asynchronous inter-port communication
A0L–A16L / A0R–A16R	Address inputs	17-bit address buses; A16 is no-connect for 128K×36 configuration (max address = A15)
I/O0L–I/O35L / I/O0R–I/O35R	Bidirectional data I/O	36-bit parallel data path per port; supports byte-wise write masking via BE0–BE3
CE0L/CE1L / CE0R/CE1R	Dual chip enables	Two-level enable hierarchy per port; CE0=low + CE1=high enables memory; enables depth expansion without external logic
R/WL / R/WR	Read/write control	Active-high write enable; determines direction of data transfer on respective port's I/O bus
OEL / OER	Output enable	Asynchronous control; places I/O pins in high-impedance state regardless of clock or CE state
PL/FTL / PL/FTR	Output mode select	DC-level input selecting pipelined (VIH) or flow-through (VIL) output timing per port
OPTL / OPTR	I/O voltage option	DC-level input setting VDDQX supply voltage: VIH → 3.3V, VIL → 2.5V; configures interface voltage per port

Key Features

Feature	Design Value
True dual-port memory cells	Enables concurrent read and write to identical addresses across ports-critical for lock-free FIFOs and shared-memory inter-processor communication
Separate byte controls (BE0–BE3)	Allows independent 9-bit byte write masking per port, supporting multiplexed bus protocols and partial-word updates without read-modify-write cycles
Dual-cycle deselect (DCD)	Prevents metastability during fast port disable in pipelined mode by requiring two consecutive clock cycles to deassert CE before output tristate
Counter enable & repeat logic	Hardware address counter with REPEAT latch enables burst transfers without external address generation logic-reducing FPGA resource usage
Self-timed write cycle	Internal write timing control eliminates need for external write pulse width management, simplifying timing closure in high-speed designs

Applications

Telecom Packet Buffering	FPGA Co-Processor Memory
Use Scenario: Line card ASIC buffers incoming/outgoing Ethernet or SONET packets with strict latency requirements. IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-latency shared buffer between ingress and egress traffic managers. Use Value: Simultaneous port access eliminates arbitration delays; 133MHz industrial timing ensures deterministic throughput under thermal stress.	Use Scenario: High-performance FPGA-based vision processing system requires low-latency memory for frame buffers and coefficient tables. IC Role / Device Role / Timing Role: Provides synchronized memory interface between FPGA fabric and external DSP or AI accelerator. Use Value: Independent 2.5V/3.3V I/O per port matches mixed-voltage FPGA banks; pipelined mode achieves sub-5ns read latency critical for real-time pixel pipelines.
Industrial Motion Controller	Avionics Data Recorder
Use Scenario: CNC controller synchronizes servo position updates and trajectory calculations using shared memory. IC Role / Device Role / Timing Role: Serves as deterministic shared memory between real-time motion CPU and safety-monitoring MCU. Use Value: −40°C to +85°C operation guarantees reliability in uncooled enclosures; JTAG boundary scan enables field-testable memory integrity verification.	Use Scenario: Flight data recorder captures sensor telemetry at 100+ kHz with guaranteed non-volatile write persistence. IC Role / Device Role / Timing Role: Acts as high-speed write buffer between analog front-end and flash controller, absorbing burst writes. Use Value: Dual chip enables allow seamless depth expansion to meet extended recording duration; self-timed write ensures consistent write timing across temperature.

Telecom Packet Buffering

FPGA Co-Processor Memory

Use Scenario: Line card ASIC buffers incoming/outgoing Ethernet or SONET packets with strict latency requirements.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-latency shared buffer between ingress and egress traffic managers.

Use Value: Simultaneous port access eliminates arbitration delays; 133MHz industrial timing ensures deterministic throughput under thermal stress.

Use Scenario: High-performance FPGA-based vision processing system requires low-latency memory for frame buffers and coefficient tables.

IC Role / Device Role / Timing Role: Provides synchronized memory interface between FPGA fabric and external DSP or AI accelerator.

Use Value: Independent 2.5V/3.3V I/O per port matches mixed-voltage FPGA banks; pipelined mode achieves sub-5ns read latency critical for real-time pixel pipelines.

Industrial Motion Controller

Avionics Data Recorder

Use Scenario: CNC controller synchronizes servo position updates and trajectory calculations using shared memory.

IC Role / Device Role / Timing Role: Serves as deterministic shared memory between real-time motion CPU and safety-monitoring MCU.

Use Value: −40°C to +85°C operation guarantees reliability in uncooled enclosures; JTAG boundary scan enables field-testable memory integrity verification.

Use Scenario: Flight data recorder captures sensor telemetry at 100+ kHz with guaranteed non-volatile write persistence.

IC Role / Device Role / Timing Role: Acts as high-speed write buffer between analog front-end and flash controller, absorbing burst writes.

Use Value: Dual chip enables allow seamless depth expansion to meet extended recording duration; self-timed write ensures consistent write timing across temperature.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CY7C1362BV33-133BZI	128K × 36, 133MHz, 2.5V core/I/O, 256-pin BGA; lacks JTAG, no voltage-selectable I/O	Requires fixed 2.5V I/O; no per-port voltage flexibility; no boundary-scan test support	Choose when JTAG and mixed-voltage I/O are unnecessary and larger BGA footprint is acceptable.
AS7C312836P-133BIN	128K × 36, 133MHz, 3.3V-only I/O, 208-pin PQFP; no pipelined mode, no counter/repeat features	Limited to flow-through timing only (15ns tCD1); no hardware address counter; PQFP limits high-frequency signal integrity	Choose for cost-sensitive industrial designs where pipelined latency and burst addressing are not required.

Compared with CY7C1362BV33-133BZI and AS7C312836P-133BIN, the 70V3589S133BCI8 uniquely combines per-port I/O voltage selection, IEEE 1149.1 JTAG, and hardware address counter-making it optimal for mixed-voltage, testable, burst-oriented embedded systems.

Availability

70V3589S133BCI8 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, and avionics data acquisition requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 70V3589S133BCI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics (formerly Integrated Device Technology) is a global semiconductor leader specializing in high-performance memory, timing, and connectivity solutions for industrial, automotive, and communications markets.

The IDT70V3589 product line was designed specifically for deterministic, low-latency dual-port memory applications in real-time embedded systems requiring simultaneous multi-processor access and industrial-grade reliability.

FAQ

What is the maximum guaranteed operating frequency of the 70V3589S133BCI8?

The 70V3589S133BCI8 is rated for guaranteed operation up to 133MHz across the full industrial temperature range (−40°C to +85°C). This corresponds to a minimum clock cycle time of 7.5ns in pipelined output mode. The device also supports 166MHz operation in commercial grade variants, but the 70V3589S133BCI8 part number explicitly denotes the 133MHz industrial version.

Does the 70V3589S133BCI8 support independent I/O voltage selection on each port?

Yes, the 70V3589S133BCI8 supports independent I/O voltage selection per port via the OPTL and OPTR pins. Setting OPTL to VIH (3.3V) configures the left port's I/Os and controls for 3.3V operation with VDDQL = 3.3V; setting it to VIL (0V) configures for 2.5V operation with VDDQL = 2.5V. The right port operates identically and independently using OPTR and VDDQR.

What package type is used for the 70V3589S133BCI8?

The 70V3589S133BCI8 uses a 208-pin fine-pitch Ball Grid Array (fpBGA) package with a 15mm × 15mm body and 0.8mm ball pitch. This package is distinct from the 208-pin PQFP and 256-pin BGA variants offered in the same family-the "BCI8" suffix specifically denotes the fpBGA industrial-grade variant.

How does the address counter function in the 70V3589S133BCI8?

The 70V3589S133BCI8 includes a hardware address counter per port, enabled by CNTENL/CNTENR. When asserted, the counter advances on each rising CLK edge, generating sequential addresses independent of external address bus changes. The REPEATL/REPEATR signal resets the counter to the last valid address loaded via ADSL/ADSR, enabling efficient burst transfers without continuous address updates from the host processor.

Is JTAG boundary-scan supported on the 70V3589S133BCI8?

Yes, the 70V3589S133BCI8 fully supports IEEE 1149.1 JTAG boundary-scan with dedicated TCK, TMS, TDI, TDO, and TRST pins. This enables in-system testing of solder joints and interconnects, verification of memory initialization sequences, and diagnostic access to internal registers-critical for high-reliability industrial and avionics applications.

70V3589S133BCI8 Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Series:: -

Package/Case:: 256-LBGA

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: SRAM

Technology:: SRAM - Dual Port, Synchronous

Memory Size:: 2Mbit

Memory Organization:: 64K x 36

Memory Interface:: Parallel

Clock Frequency:: 133 MHz

Write Cycle Time - Word, Page:: -

Access Time:: 4.2 ns

Voltage - Supply:: 3.15V ~ 3.45V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 256-CABGA (17x17)

70V3589S133BCI8 FAQ

1.How can I place an order for 70V3589S133BCI8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 70V3589S133BCI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70V3589S133BCI8 reliable?

The price and inventory of 70V3589S133BCI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V3589S133BCI8 is usually 5 days.

3.What payment methods are accepted for 70V3589S133BCI8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70V3589S133BCI8 transactions.

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4.How is shipping managed for 70V3589S133BCI8?

70V3589S133BCI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70V3589S133BCI8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70V3589S133BCI8?

For technical support, including 70V3589S133BCI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V3589S133BCI8 requirements.

6.How does Aetrix verify that 70V3589S133BCI8 is sourced from the original manufacturer or authorized distributors?

All 70V3589S133BCI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V3589S133BCI8 meets industry standards.

7.What is the process for return or replacement of 70V3589S133BCI8?

All 70V3589S133BCI8 units undergo pre-shipment inspection (PSI). If there is an issue with 70V3589S133BCI8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70V3589S133BCI8 part is unused and in its original packaging.

Return procedure for 70V3589S133BCI8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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