Renesas 70V3589S133BFI8
- Part No.:
- 70V3589S133BFI8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 208-LFBGA
- Datasheet:
-
70V3589S133BFI8.pdf
- Description:
- IC SRAM 2MBIT PARALLEL 208CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
70V3589S133BFI8 from IDT (now Renesas) is a high-speed 128K × 36-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location from independent left and right ports. It operates at 133MHz (7.5ns cycle time), supports selectable pipelined or flow-through output modes, and features dual chip enables for depth expansion - used in telecom line cards requiring deterministic low-latency inter-processor communication.
For engineers reviewing the 70V3589S133BFI8 datasheet, 70V3589S133BFI8 pinout, 70V3589S133BFI8 application, or 70V3589S133BFI8 equivalent, key selection criteria include its 133MHz industrial-grade timing (–40°C to +85°C), independent 2.5V/3.3V I/O voltage per port via OPT pins, JTAG IEEE 1149.1 compliance, and support for burst-mode unidirectional/bidirectional data flow in packet buffering systems.
Technical Context
This device implements fully synchronous operation on both ports with registered address, data, byte enable, and control inputs - delivering 1.7ns setup and 0.5ns hold times at 166MHz. Its self-timed write architecture enables fast cycle time without external wait-state logic.
The memory integrates dual address counters with CNTEN/REPEAT controls per port, allowing automatic sequential addressing and repeat-to-last-address functionality. Dual Cycle Deselect (DCD) ensures predictable deactivation in pipelined mode, while separate byte enables (BE0–BE3) support 9-bit byte granularity for multiplexed bus compatibility.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36 bits (4.608 Mbit), true dual-port cell array enabling concurrent access |
| Max Clock Frequency | 133MHz (7.5ns cycle time) - guaranteed over industrial temperature range (–40°C to +85°C) |
| Access Time | 4.2ns (max) at 133MHz - defines minimum clock-to-data-out latency in pipelined mode |
| I/O Voltage Support | Selectable 3.3V (±150mV) or 2.5V (±100mV) per port via OPTL/OPTR pins - enables mixed-voltage system interfacing |
| Operating Temperature | Industrial grade: –40°C to +85°C - qualified for base station and industrial control environments |
| JTAG Compliance | IEEE 1149.1 boundary-scan support - enables in-system testability and debug of memory subsystems |
| Power Supply | 3.3V ±150mV core (VDD); independent VDDQL/VDDQR for I/O - decouples core and interface power domains |
Pinout & Package
70V3589S133BFI8 is packaged in a 208-pin fine-pitch Ball Grid Array (fpBGA) with 0.8mm ball pitch and 15mm × 15mm body size. Pin functions are symmetrically distributed across left (L) and right (R) ports, with dedicated clocks (CLKL/CLKR), chip enables (CE0L/CE1L, CE0R/CE1R), address (A0L–A16L, A0R–A16R), 36-bit bidirectional I/Os (I/O0L–I/O35L, I/O0R–I/O35R), and control signals including PL/FTL/PL/FTR, ADS, CNTEN, REPEAT, and BE0–BE3 per port.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port-specific synchronous clock input | Registers all address, data, and control inputs on rising edge - enables deterministic timing at 133MHz |
| CE0L/CE1L, CE0R/CE1R | Dual chip enable pair per port | Allows depth expansion without external logic; CE0=low + CE1=high enables port operation |
| A0L–A16L / A0R–A16R | Address inputs (17-bit) | A16 is no-connect for 128K×36 configuration - simplifies address decoding |
| I/O0L–I/O35L / I/O0R–I/O35R | 36-bit bidirectional data bus | Supports byte-wise access via BE0–BE3; each byte = 9 bits - matches standard telecom data bus widths |
| PL/FTL / PL/FTR | Pipeline/Flow-Through mode select | DC-level control (VIH/VIL) selecting output latency mode - determines tCD2 (3.6ns) vs tCD1 (12ns) path |
| OPTL / OPTR | I/O voltage option select | Configures VDDQL/VDDQR supply level: VIH = 3.3V, VIL = 2.5V - enables mixed-voltage interoperation |
Key Features
| Feature | Design Value |
|---|---|
| True dual-port memory cells | Enables simultaneous independent read/write to identical addresses - eliminates arbitration overhead in co-processor systems |
| Self-timed write architecture | Removes need for external write-strobe generation - reduces PCB routing complexity and timing margin pressure |
| Dual-cycle deselect (DCD) | Ensures clean, glitch-free port disable in pipelined mode - prevents metastability during rapid enable/disable transitions |
| Separate byte enables (BE0–BE3) | Permits 9-bit sub-word writes without masking logic - critical for ATM/SONET cell payload alignment |
| Counter enable and repeat controls | Automates sequential address generation and loop-back to last ADS-loaded address - accelerates burst packet buffering |
Applications
| Telecom Line Card Buffering | Network Processor Interfacing |
|---|---|
Use Scenario: Storing and forwarding variable-length packets between ingress and egress ASICs in a 10Gbps line card. IC Role / Device Role / Timing Role: Dual-port SRAM acts as a non-blocking, low-latency first-in-first-out (FIFO) buffer with independent read/write clocks. Use Value: 133MHz operation and 4.2ns tCD2 enable sub-8ns round-trip latency for packet header inspection and rewrite. | Use Scenario: Providing shared instruction/data memory between two tightly coupled network processors executing parallel packet classification tasks. IC Role / Device Role / Timing Role: Serves as coherent shared memory with simultaneous access capability - eliminating software locks or hardware semaphores. Use Value: True dual-port architecture allows one processor to write while the other reads the same address - increasing effective throughput by >30% vs single-port alternatives. |
| Industrial PLC Data Exchange | Radar Signal Processing Buffer |
Use Scenario: Exchanging real-time sensor fusion data between safety-critical motion controller and vision processing unit in factory automation. IC Role / Device Role / Timing Role: Acts as deterministic, lock-free shared memory with industrial temperature qualification (–40°C to +85°C). Use Value: Dual chip enables and independent 2.5V/3.3V I/O support allow seamless integration with legacy 2.5V FPGAs and modern 3.3V microcontrollers. | Use Scenario: Temporarily storing digitized radar return samples before FFT processing in airborne phased-array systems. IC Role / Device Role / Timing Role: Provides high-bandwidth, low-jitter memory buffer synchronized to ADC sampling clock on one port and DSP processing clock on the other. Use Value: Pipelined output mode delivers 3.6ns clock-to-data-out - minimizing pipeline stalls in real-time signal chain. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-133BZI | 128K × 36, 133MHz, 3.3V-only I/O (no 2.5V option), different pinout (256-BGA only) | Lacks independent I/O voltage selection - requires full 3.3V system design | Choose when board already uses 3.3V-only interfaces and BGA footprint permits |
| AS7C312836B-133BIN | 128K × 36, 133MHz, supports 2.5V/3.3V I/O but no JTAG or counter repeat feature | No IEEE 1149.1 test support - limits in-system debug capability | Choose when JTAG is not required and cost sensitivity outweighs advanced control features |
Compared with CY7C1362BV33-133BZI and AS7C312836B-133BIN, the 70V3589S133BFI8 uniquely combines industrial temperature rating, per-port 2.5V/3.3V I/O flexibility, JTAG testability, and hardware address counter repeat - making it optimal for upgradable telecom and defense platforms requiring long-term supply stability and field serviceability.
Availability
70V3589S133BFI8 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial control, and aerospace avionics applications requiring stable component supply, extended temperature operation, and long-lifecycle support.
Supply support for 70V3589S133BFI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics (formerly Integrated Device Technology, IDT) is a global semiconductor leader specializing in high-performance memory, timing, and connectivity solutions for communications, computing, and industrial markets.
The IDT70V3589 product line was designed specifically for deterministic, low-latency dual-ported memory applications in telecom switching fabrics, network processors, and real-time embedded systems demanding simultaneous multi-master access.
FAQ
What is the maximum guaranteed operating frequency of the 70V3589S133BFI8?
The 70V3589S133BFI8 is rated for guaranteed operation at 133MHz across the full industrial temperature range (–40°C to +85°C), with a maximum clock cycle time of 7.5ns. This specification applies to both pipelined and flow-through output modes and is validated under worst-case voltage (3.15V VDD) and temperature conditions.
Does the 70V3589S133BFI8 support mixed-voltage operation between its left and right ports?
Yes, the 70V3589S133BFI8 supports independent I/O voltage selection per port: OPTL configures the left port's VDDQL supply (3.3V or 2.5V), and OPTR configures the right port's VDDQR supply (3.3V or 2.5V). This allows one port to interface with a 2.5V FPGA while the other connects to a 3.3V microcontroller - without level-shifting components.
How does the REPEAT function operate in the 70V3589S133BFI8?
In the 70V3589S133BFI8, asserting REPEATL or REPEATR resets the internal address counter to the last valid address loaded via ADSL or ADSR, respectively. This occurs independently per port and is not initialized at power-up - a known address must be loaded via ADS during system initialization to establish the repeat target.
What package type is used for the 70V3589S133BFI8?
The 70V3589S133BFI8 is supplied in a 208-pin fine-pitch Ball Grid Array (fpBGA) package with 0.8mm ball pitch and a 15mm × 15mm body size. This fpBGA variant (package code BFI8) is distinct from the PQFP and 256-BGA options offered in the same family and is optimized for high-density, thermally demanding applications.
Is JTAG boundary-scan supported on the 70V3589S133BFI8?
Yes, the 70V3589S133BFI8 includes full IEEE 1149.1-compliant JTAG boundary-scan functionality with dedicated TCK, TMS, TDI, TDO, and TRST pins. This enables in-system testing of solder joints, interconnects, and logic states - critical for high-reliability telecom and aerospace assemblies where physical probe access is limited.
70V3589S133BFI8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 208-LFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 2Mbit
- Memory Organization:
- 64K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 3.15V ~ 3.45V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 208-CABGA (15x15)
70V3589S133BFI8 FAQ
1.How can I place an order for 70V3589S133BFI8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 70V3589S133BFI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70V3589S133BFI8 reliable?
The price and inventory of 70V3589S133BFI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V3589S133BFI8 is usually 5 days.
3.What payment methods are accepted for 70V3589S133BFI8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70V3589S133BFI8 transactions.
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4.How is shipping managed for 70V3589S133BFI8?
70V3589S133BFI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 70V3589S133BFI8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70V3589S133BFI8?
For technical support, including 70V3589S133BFI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V3589S133BFI8 requirements.
6.How does Aetrix verify that 70V3589S133BFI8 is sourced from the original manufacturer or authorized distributors?
All 70V3589S133BFI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V3589S133BFI8 meets industry standards.
7.What is the process for return or replacement of 70V3589S133BFI8?
All 70V3589S133BFI8 units undergo pre-shipment inspection (PSI). If there is an issue with 70V3589S133BFI8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70V3589S133BFI8 part is unused and in its original packaging.
Return procedure for 70V3589S133BFI8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
70V3589S133BFI8 Tags

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M24C02-WMN6TP
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AT24C02C-XHM-T
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M24C02-FMC6TG
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AT24C04C-SSHM-T
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