Renesas 70V3589S133DRGI
- Part No.:
- 70V3589S133DRGI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 208-BFQFP
- Datasheet:
-
70V3589S133DRGI.pdf
- Description:
- IC SRAM 2MBIT PARALLEL 208PQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
70V3589S133DRGI from IDT (now Renesas) is a high-speed 128K x 36-bit synchronous dual-port static RAM with true dual-port architecture enabling simultaneous read/write access to the same memory location from independent left and right ports. It operates at 133MHz (7.5ns cycle time), supports selectable pipelined or flow-through output modes, and features dual chip enables for seamless depth expansion in telecom packet buffering applications.
For engineers reviewing the 70V3589S133DRGI datasheet, 70V3589S133DRGI pinout, 70V3589S133DRGI application, or 70V3589S133DRGI equivalent, key selection criteria include its 133MHz industrial-grade timing, independent 2.5V/3.3V I/O voltage support per port, JTAG IEEE 1149.1 compliance, and 208-pin fpBGA package with validated pin mapping for high-density PCB layouts.
Technical Context
This device implements fully synchronous dual-port operation with register-controlled address, data, and control inputs on both ports-enabling minimal setup (1.7ns) and hold (0.5ns) times at 133MHz. Its self-timed write architecture achieves fast 4.2ns clock-to-data-out in pipelined mode while maintaining full port independence.
The memory integrates dual byte-enable groups (BE0–BE3 per port) for 9-bit granularity, counter-enabled sequential addressing with repeat functionality, and Dual Cycle Deselect (DCD) for pipelined output stability. JTAG boundary-scan support enables in-system testability without requiring external test fixtures.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K x 36-bit (4.6 Mbit), true dual-port SRAM array |
| Max Clock Frequency | 133MHz (7.5ns cycle time) for industrial temperature range (−40°C to +85°C) |
| Access Time | 4.2ns max clock-to-data-out (tCD2) in pipelined mode at 133MHz |
| I/O Voltage Support | Per-port selectable: 3.3V (±150mV) or 2.5V (±100mV) via OPTL/OPTR pins |
| Core Supply | 3.3V ±150mV (VDD), independent of I/O voltage selection |
| Operating Temperature | Industrial grade: −40°C to +85°C ambient |
| JTAG Compliance | Fully IEEE 1149.1-compliant boundary-scan with TCK, TMS, TDI, TDO, TRST |
Pinout & Package
70V3589S133DRGI is packaged in a 208-pin fine-pitch Ball Grid Array (fpBGA) with 0.8mm ball pitch and 15mm × 15mm body size. All VDD pins require 3.3V supply; VDDQL/VDDQR must match selected I/O voltage (2.5V or 3.3V) per port based on OPTL/OPTR logic level.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port clock input | Synchronous edge-triggered timing reference for left/right port operations |
| CE0L/CE1L, CE0R/CE1R | Dual chip enable inputs | Enable depth expansion without external logic; CE0=low + CE1=high activates port |
| PL/FTL / PL/FTR | Pipeline/Flow-Through mode select | DC-configurable output latency: pipelined (1-cycle delay) or flow-through (0-cycle delay) |
| ADSL / ADSR | Address strobe enable | Latches external address into internal counter; enables burst-mode sequential access |
| REPEATL / REPEATR | Counter repeat control | Resets address counter to last valid ADS-loaded address-critical for circular buffer reuse |
| OPTL / OPTR | I/O voltage option select | VIH = 3.3V I/O mode; VIL = 2.5V I/O mode; sets required VDDQL/VDDQR supply voltage |
| TCK, TMS, TDI, TDO, TRST | JTAG boundary-scan interface | Enables in-system test, interconnect verification, and debug without physical probe access |
Key Features
| Feature | Design Value |
|---|---|
| True dual-port memory cells | Enables concurrent read/write to identical addresses-eliminates arbitration logic in shared-memory systems |
| Selectable pipelined or flow-through output | Reduces system latency (flow-through) or improves timing margin (pipelined) without hardware change |
| Dual chip enables per port | Supports seamless memory depth expansion up to 256K×36 or larger using multiple devices |
| Separate byte controls (BE0–BE3) | Enables 9-bit granular writes across multiplexed buses-reduces bus contention and power spikes |
| Self-timed write architecture | Maintains 7.5ns cycle time regardless of process/voltage/temperature variation-no external wait-state logic needed |
Applications
| Packet Buffering in Network Switches | Real-Time DSP Data Exchange |
|---|---|
Use Scenario: Storing ingress/egress packet headers and payloads in Layer 2/3 switches with line-rate throughput. IC Role / Device Role / Timing Role: Dual-port SRAM acting as non-blocking shared memory between ingress parser and egress scheduler engines. Use Value: Simultaneous 133MHz access from both ports eliminates serialization bottlenecks-enabling 12Gbps aggregate bandwidth (6Gbps per port). | Use Scenario: Exchanging filter coefficients and streaming audio samples between two independent DSP cores. IC Role / Device Role / Timing Role: Synchronization-free memory bridge allowing one core to write while the other reads updated data in real time. Use Value: Pipelined output mode delivers deterministic 4.2ns read latency-critical for sub-microsecond loop timing in adaptive noise cancellation. |
| Industrial PLC I/O Mapping | Radar Signal Processing Buffers |
Use Scenario: Holding real-time sensor inputs and actuator outputs in programmable logic controllers with deterministic scan cycles. IC Role / Device Role / Timing Role: Dual-port RAM serving as mirrored I/O image memory-left port updated by CPU, right port scanned by I/O controller. Use Value: Industrial temperature rating (−40°C to +85°C) and 133MHz operation ensure reliable performance in uncooled control cabinets. | Use Scenario: Buffering ADC samples and FFT results in phased-array radar front-ends with strict timing closure. IC Role / Device Role / Timing Role: High-bandwidth memory staging area between high-speed ADC interface and FPGA-based beamforming engine. Use Value: 2.5V/3.3V I/O flexibility allows direct interfacing to mixed-voltage FPGA banks-reducing level-shifter count and board area. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-133BZI | 64K x 36 organization; 133MHz max; 2.5V-only I/O; no JTAG; 208-pin TQFP package | Limited memory depth; lacks per-port voltage flexibility and boundary-scan test capability | Choose when lower density suffices and JTAG/testability is not required |
| AS7C3256A-133JCIN | 128K x 32 organization; 133MHz; 3.3V-only I/O; no counter/repeat features; 208-pin PQFP | 32-bit width (not 36-bit); missing ADS/REPEAT for burst addressing; no JTAG or dual-voltage I/O | Choose only if 32-bit data path is acceptable and advanced addressing features are unnecessary |
Compared with CY7C1362BV33-133BZI and AS7C3256A-133JCIN, the 70V3589S133DRGI uniquely delivers full 128K×36 capacity, per-port 2.5V/3.3V I/O selection, integrated JTAG, and counter-repeat functionality-making it the only option supporting scalable, testable, and flexible-width shared memory in demanding industrial and telecom designs.
Availability
70V3589S133DRGI is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and radar signal processing applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for 70V3589S133DRGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics (formerly Integrated Device Technology) is a global semiconductor leader specializing in high-performance memory, timing, and analog solutions for communications and industrial markets.
The 70V3589S133DRGI belongs to IDT's high-speed synchronous dual-port SRAM product line, engineered specifically for deterministic, low-latency shared memory in packet-switched networks and real-time embedded systems.
FAQ
What is the maximum operating frequency of the 70V3589S133DRGI in industrial temperature range?
The 70V3589S133DRGI is rated for 133MHz operation (7.5ns cycle time) across the full industrial temperature range of −40°C to +85°C. This is confirmed in the AC Electrical Characteristics table (Table 11) under the "70V3599/89S133 Com'l & Ind" column, where tCYC2 (Pipelined Clock Cycle Time) has a maximum of 7.5ns. The device does not support 166MHz operation in industrial grade.
Does the 70V3589S133DRGI support independent I/O voltage selection on left and right ports?
Yes, the 70V3589S133DRGI supports independent I/O voltage selection: OPTL configures the left port's I/O voltage (2.5V or 3.3V), and OPTR configures the right port's I/O voltage. When OPTL = VIH (3.3V), VDDQL must be 3.3V; when OPTL = VIL (0V), VDDQL must be 2.5V-and similarly for OPTR/VDDQR. This enables mixed-voltage system interfacing without external level shifters.
What is the function of the REPEAT pin on the 70V3589S133DRGI?
The REPEATL and REPEATR pins on the 70V3589S133DRGI reset the internal address counter to the last valid address loaded via ADSL or ADSR. This enables efficient circular buffer implementation-e.g., in packet FIFOs-where the counter automatically wraps after reaching the end of a defined address range. The repeat address is not preset at power-up and must be initialized via an ADS strobe during system startup.
Is JTAG boundary-scan supported on the 70V3589S133DRGI, and which pins are used?
Yes, the 70V3589S133DRGI fully supports IEEE 1149.1 JTAG boundary-scan. The required pins are TCK (Test Clock), TMS (Test Mode Select), TDI (Test Data In), TDO (Test Data Out), and TRST (Test Reset). These signals are dedicated and do not share functions with memory control pins-ensuring robust in-system testability without compromising memory operation.
What package type is used for the 70V3589S133DRGI, and what are its mechanical dimensions?
The 70V3589S133DRGI uses a 208-pin fine-pitch Ball Grid Array (fpBGA) package with 0.8mm ball pitch. Its body measures approximately 15mm × 15mm × 1.4mm. This package is distinct from the 208-pin PQFP and 256-pin BGA variants-confirmed in the Pin Configuration section (page 3) where "BF208(6)" and "BFG208(6)" denote the fpBGA variant used for the "DRGI" suffix part.
70V3589S133DRGI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 208-BFQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 2Mbit
- Memory Organization:
- 64K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 3.15V ~ 3.45V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 208-PQFP (28x28)
70V3589S133DRGI FAQ
1.How can I place an order for 70V3589S133DRGI through Aetrix?
Please submit a Request for Quotation (RFQ) for 70V3589S133DRGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70V3589S133DRGI reliable?
The price and inventory of 70V3589S133DRGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V3589S133DRGI is usually 5 days.
3.What payment methods are accepted for 70V3589S133DRGI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70V3589S133DRGI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 70V3589S133DRGI?
70V3589S133DRGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 70V3589S133DRGI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70V3589S133DRGI?
For technical support, including 70V3589S133DRGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V3589S133DRGI requirements.
6.How does Aetrix verify that 70V3589S133DRGI is sourced from the original manufacturer or authorized distributors?
All 70V3589S133DRGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V3589S133DRGI meets industry standards.
7.What is the process for return or replacement of 70V3589S133DRGI?
All 70V3589S133DRGI units undergo pre-shipment inspection (PSI). If there is an issue with 70V3589S133DRGI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70V3589S133DRGI part is unused and in its original packaging.
Return procedure for 70V3589S133DRGI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
70V3589S133DRGI Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
Microchip Technology

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24AA02UIDT-I/OT
Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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