Renesas 70V3589S166BCG
- Part No.:
- 70V3589S166BCG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 256-LBGA
- Datasheet:
-
70V3589S166BCG.pdf
- Description:
- IC SRAM 2MBIT PARALLEL 256CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
70V3589S166BCG from IDT (now Renesas) is a high-speed 128K × 36-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location from independent left and right ports. It operates at 166MHz (6ns cycle time), delivers 12Gbps aggregate bandwidth, supports selectable pipelined or flow-through output modes, and features dual chip enables for seamless depth expansion in telecom switching fabric and network packet buffer applications.
For engineers reviewing the 70V3589S166BCG datasheet, 70V3589S166BCG pinout, 70V3589S166BCG application, or 70V3589S166BCG equivalent, key selection criteria include its 166MHz pipelined timing (tCD2 = 3.6ns), independent 3.3V/2.5V I/O voltage selection per port via OPT pins, JTAG IEEE 1149.1 compliance, and industrial-grade thermal stability up to +85°C - all critical for deterministic latency in real-time packet processing systems.
Technical Context
This device implements fully synchronous dual-port operation with registered address, data, and control inputs on both ports, enabling minimal setup/hold times (1.7ns setup, 0.5ns hold @ 166MHz). Its internal architecture includes dual independent address counters with repeat and enable features, separate byte-enable logic per 9-bit data group, and self-timed write cycles that maintain fast cycle performance without external timing constraints.
The memory supports JTAG boundary-scan testing and offers configurable I/O voltage domains: core VDD remains fixed at 3.3V ±150mV, while each port's VDDQ (and associated I/O/control signaling levels) is independently selectable between 3.3V (±150mV) and 2.5V (±100mV) via dedicated OPTL/OPTR pins - enabling interoperability with mixed-voltage SoC interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36 bits (4.608 Mbit total); supports independent concurrent access on left/right ports |
| Max Clock Frequency | 166MHz (6ns cycle time) - enables deterministic 12Gbps aggregate bandwidth in pipelined mode |
| Access Time (tCD2) | 3.6ns max (pipelined output) - defines minimum latency from clock edge to valid data out |
| I/O Voltage Support | Per-port selectable 3.3V or 2.5V - allows direct interfacing with legacy 3.3V and modern low-power 2.5V logic |
| Operating Temperature | Commercial grade only: 0°C to +70°C - validated for stable operation in controlled-environment telecom equipment |
| Supply Voltages | VDD = 3.3V ±150mV (core); VDDQL/VDDQR = 3.3V ±150mV or 2.5V ±100mV - decoupled power domains per port |
| JTAG Compliance | IEEE 1149.1 - enables in-system testability and boundary-scan diagnostics during board bring-up |
Pinout & Package
70V3589S166BCG is packaged in a 208-pin fine-pitch Ball Grid Array (fpBGA) with 0.8mm ball pitch and 15mm × 15mm body size. Pin functions are symmetrically distributed across left (L) and right (R) ports, with dedicated clock, address, data I/O, control, and power/ground terminals per side.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port-specific clock input | Synchronizes all registered inputs/outputs on respective port; enables precise timing control in pipelined or flow-through modes |
| A0L–A16L / A0R–A16R | Address inputs | 17-bit address bus per port; A16 is no-connect for 128K configuration - simplifies routing vs. full 18-bit addressing |
| I/O0L–I/O35L / I/O0R–I/O35R | Bidirectional data I/O | 36-bit parallel data path per port; supports byte-wise access via BE0–BE3 (9-bit granularity) |
| CE0L/CE1L / CE0R/CE1R | Dual chip enables | Independent port enable logic; allows depth expansion without external decode logic by cascading CE signals |
| PL/FTL / PL/FTR | Pipeline/Flow-through mode select | DC-level control (VIH/VIL) to configure output latency behavior per port - critical for system-level timing closure |
| OPTL / OPTR | I/O voltage option select | Configures VDDQX supply level (3.3V or 2.5V) and corresponding logic thresholds for associated port's I/Os and controls |
| TCK, TMS, TDI, TDO, TRST | JTAG test interface | Full IEEE 1149.1 boundary-scan support for production test and field diagnostics |
Key Features
| Feature | Design Value |
|---|---|
| True dual-port memory cells | Enables simultaneous, independent read/write access to identical addresses - essential for producer-consumer buffering in packet engines |
| Selectable pipelined or flow-through output | Reduces system latency variability: pipelined mode gives fixed 1-cycle delay; flow-through eliminates pipeline stage for lowest latency |
| Dual-cycle deselect (DCD) in pipelined mode | Ensures clean bus release during chip disable - prevents metastability when multiple devices share data buses |
| Separate byte controls (BE0–BE3) | Supports 9-bit sub-word writes without read-modify-write - improves efficiency in header/payload manipulation |
| Counter enable and repeat functionality | Automates sequential address generation and loop-back addressing - offloads CPU in burst-access scenarios like DMA transfers |
| LVTTL-compatible I/O with dual-voltage support | Eliminates level-shifting components when interfacing with heterogeneous ASIC/FPGA I/O banks operating at 3.3V or 2.5V |
Applications
| Telecom Switching Fabric | Network Packet Buffer |
|---|---|
Use Scenario: High-speed line cards in carrier-grade routers performing cut-through forwarding with strict jitter budgets. IC Role / Device Role / Timing Role: Dual-port SRAM acts as shared buffer between ingress and egress traffic managers, enabling zero-latency inter-port data transfer. Use Value: 3.6ns tCD2 and 6ns tCYC2 ensure sub-10ns deterministic read-after-write latency across ports - meeting ITU-T G.8261 phase error requirements. | Use Scenario: Deep packet inspection engines requiring concurrent access to packet headers and payloads for real-time classification. IC Role / Device Role / Timing Role: Left port accepts incoming packet data from MAC; right port feeds classifier engine - both accessing same memory space synchronously. Use Value: Independent 3.3V/2.5V I/O per port allows direct connection to 3.3V PHY and 2.5V FPGA logic - eliminating level shifters and reducing BOM cost. |
| Real-Time Signal Processing | Industrial Motion Control |
Use Scenario: Multi-axis servo drives executing synchronized position updates using shared trajectory tables. IC Role / Device Role / Timing Role: Stores motion profile data; left port updated by host controller, right port read by FPGA-based interpolator at 166MHz. Use Value: Pipelined output mode provides predictable 1-cycle latency, enabling jitter-free interpolation clocking aligned to system master clock. | Use Scenario: PLC backplane modules managing I/O mapping tables accessed concurrently by CPU and fieldbus interface. IC Role / Device Role / Timing Role: Serves as dual-access configuration memory - CPU writes parameter sets while fieldbus controller reads active values. Use Value: Dual chip enables (CE0/CE1) allow seamless expansion to 256K×36 using identical parts - preserving layout and firmware across product variants. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362KV18-167BZC | 144M × 18-bit organization (2.592 Mbit), 167MHz max, 2.5V core/I/O, no OPT pin flexibility | Lower density, fixed 2.5V interface - suitable only where voltage compatibility and smaller capacity suffice | Select if system uses exclusively 2.5V logic and requires lower power; avoid if 128K×36 capacity or mixed-voltage I/O is required |
| IDT70V3599S166BG | Same 128K×36 architecture and timing, but 256-pin BGA package (larger footprint, 1.0mm pitch) | Higher pin count enables more robust power/ground distribution - preferred for high-reliability industrial designs | Choose for enhanced thermal performance and signal integrity in extended-temperature environments; not drop-in compatible due to package mismatch |
Compared with CY7C1362KV18-167BZC and IDT70V3599S166BG, the 70V3589S166BCG uniquely balances 128K×36 capacity, 166MHz pipelined performance, per-port voltage configurability, and compact 208-pin fpBGA packaging - making it optimal for space-constrained, mixed-voltage telecom line cards.
Availability
70V3589S166BCG is available at Aetrix Electronics and suitable for telecom switching fabric, network packet buffer, real-time signal processing, industrial motion control, and PLC backplane applications requiring stable component supply across multi-year production cycles.
Supply support for 70V3589S166BCG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation (formerly Integrated Device Technology) is a global semiconductor leader specializing in microcontrollers, analog, power management, and high-performance memory solutions for industrial, automotive, and communications markets.
The IDT70V35xx family was designed specifically for ultra-low-latency, high-bandwidth dual-access memory applications in telecom infrastructure, network processors, and real-time embedded systems demanding deterministic timing and mixed-voltage interoperability.
FAQ
What is the maximum operating frequency of the 70V3589S166BCG in pipelined mode?
The 70V3589S166BCG supports a maximum clock frequency of 166MHz in pipelined output mode, achieving a 6ns clock cycle time and 3.6ns maximum clock-to-data-out delay (tCD2). This specification applies under commercial temperature conditions (0°C to +70°C) with VDD = 3.3V ±150mV and appropriate VDDQ supply. The 70V3589S166BCG is not rated for 166MHz operation in industrial temperature range.
Does the 70V3589S166BCG support independent I/O voltage selection on left and right ports?
Yes, the 70V3589S166BCG supports independent I/O voltage selection per port via dedicated OPTL and OPTR pins. Setting OPTL to VIH (3.3V) configures the left port's VDDQL and I/O logic levels for 3.3V operation; setting it to VIL (0V) selects 2.5V. The same applies to OPTR for the right port. This allows mixed-voltage interfacing - for example, connecting the left port to a 3.3V ASIC and the right port to a 2.5V FPGA - without external level shifters.
What is the function of the REPEAT and CNTEN pins on the 70V3589S166BCG?
The CNTEN pin enables the internal address counter on each port, advancing the address on every rising clock edge when asserted low. The REPEAT pin resets the counter to the last valid address loaded via ADS (Address Strobe Enable), enabling automatic looping over a defined memory block. These features are used together in burst-access applications such as DMA transfers or waveform generation, where the 70V3589S166BCG autonomously sequences through consecutive addresses without CPU intervention.
Is the 70V3589S166BCG pin-compatible with other members of the IDT70V35xx family?
No, the 70V3589S166BCG is not universally pin-compatible across the IDT70V35xx family. While it shares the same 208-pin fpBGA footprint with the 70V3589S133BCG, it differs from the 256-pin BGA variant (e.g., IDT70V3599S166BG) in pin count, ball map, and power/ground distribution. Always verify mechanical and electrical compatibility using the specific package drawing and pinout table for the exact 70V3589S166BCG before PCB layout.
What JTAG capabilities does the 70V3589S166BCG provide?
The 70V3589S166BCG implements full IEEE 1149.1 JTAG boundary-scan functionality via dedicated TCK, TMS, TDI, TDO, and TRST pins. This enables in-system testing of solder joints and interconnects, visibility into internal register states during debug, and standardized programming/test access - critical for high-reliability telecom hardware validation and field diagnostics. The 70V3589S166BCG's JTAG implementation is functionally identical to that specified in the IDT70V3599/89 datasheet.
70V3589S166BCG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 2Mbit
- Memory Organization:
- 64K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.6 ns
- Voltage - Supply:
- 3.15V ~ 3.45V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-CABGA (17x17)
70V3589S166BCG FAQ
1.How can I place an order for 70V3589S166BCG through Aetrix?
Please submit a Request for Quotation (RFQ) for 70V3589S166BCG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70V3589S166BCG reliable?
The price and inventory of 70V3589S166BCG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V3589S166BCG is usually 5 days.
3.What payment methods are accepted for 70V3589S166BCG?
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70V3589S166BCG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 70V3589S166BCG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70V3589S166BCG?
For technical support, including 70V3589S166BCG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V3589S166BCG requirements.
6.How does Aetrix verify that 70V3589S166BCG is sourced from the original manufacturer or authorized distributors?
All 70V3589S166BCG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V3589S166BCG meets industry standards.
7.What is the process for return or replacement of 70V3589S166BCG?
All 70V3589S166BCG units undergo pre-shipment inspection (PSI). If there is an issue with 70V3589S166BCG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70V3589S166BCG part is unused and in its original packaging.
Return procedure for 70V3589S166BCG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
70V3589S166BCG Tags

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