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Renesas 70V3589S166BF

Part No.:
70V3589S166BF
Manufacturer:
Renesas
Category:
Memory
Package:
208-LFBGA
Datasheet:
Aetrix70V3589S166BF.pdf
Description:
IC SRAM 2MBIT PARALLEL 208CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,099

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Product details

Overview

70V3589S166BF from IDT (Integrated Device Technology) is a high-speed 128K × 36-bit synchronous dual-port static RAM with true dual-port architecture enabling simultaneous read/write access to the same memory location from independent left and right ports. It operates at 166MHz with 3.6ns clock-to-data-out (pipelined mode), supports selectable 3.3V or 2.5V I/O interfaces per port, and delivers 12Gbps aggregate bandwidth. It is used in real-time packet buffering for telecom line cards and FPGA-based protocol accelerators.

For engineers reviewing the 70V3589S166BF datasheet, 70V3589S166BF pinout, 70V3589S166BF application, or 70V3589S166BF equivalent, key selection criteria include pipelined vs. flow-through output timing, independent VDDQ voltage selection per port, dual chip enable depth expansion capability, JTAG IEEE 1149.1 compliance, and industrial-grade (-40°C to +85°C) operation at 133MHz.

Technical Context

This device implements fully synchronous dual-port SRAM architecture with separate address, data, and control registers on both ports-enabling minimal 1.7ns setup and 0.5ns hold times at 166MHz. Its self-timed write logic and dual-cycle deselect (DCD) feature optimize cycle time in pipelined mode.

The memory supports independent I/O voltage configuration via OPTL/OPTR pins, allowing one port at 3.3V and the other at 2.5V simultaneously. Address counter functionality-including CNTEN, ADS, and REPEAT signals-enables burst-mode sequential addressing without external logic.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density128K × 36 bits (4.608 Mbit); supports 128K-word addressing with 36-bit parallel I/O per port
Max Clock Frequency166MHz (commercial grade); enables 6ns cycle time and 12Gbps total bandwidth
Access Time3.6ns (pipelined mode, 166MHz); defines minimum clock-to-valid-output delay for timing-critical systems
I/O Voltage SupportSelectable 3.3V (±150mV) or 2.5V (±100mV) per port via OPTL/OPTR; allows mixed-voltage system interfacing
Operating Temperature-40°C to +85°C (industrial grade at 133MHz); validated for extended-temperature embedded networking hardware
Power SupplyCore VDD = 3.3V ±150mV; independent VDDQL/VDDQR required per port's selected I/O voltage
JTAG ComplianceIEEE 1149.1 boundary-scan support with TCK, TMS, TDI, TDO, TRST; enables in-system test and debug

Pinout & Package

70V3589S166BF is packaged in a 208-pin fine-pitch Ball Grid Array (fpBGA) with 0.8mm ball pitch and 15mm × 15mm body size. Pin functions are symmetrically distributed across left (L) and right (R) ports, with dedicated power/ground balls and JTAG test pads.

Pin/TerminalCircuit RoleDesign Meaning
CLKL / CLKRPort-synchronous clock inputEdge-triggered master clock for all register transfers on respective port; requires matched trace length for skew control
A0L–A16L / A0R–A16RAddress inputs17-bit address bus per port; A16 is no-connect for 128K×36 configuration
I/O0L–I/O35L / I/O0R–I/O35RBidirectional data I/O36-bit parallel data path per port; byte-enable controlled (BE0–BE3) for 9-bit granularity writes
CE0L/CE1L / CE0R/CE1RDual chip enablesTwo independent enables per port allow seamless depth expansion without external logic or address decoding
PL/FTL / PL/FTRPipeline/Flow-through mode selectDC-level control (VIH/VIL) selecting output latency mode; determines tCD2 (3.6ns) vs. tCD1 (12ns) timing path
OPTL / OPTRI/O voltage option controlDC-level input selecting 3.3V or 2.5V interface voltage for corresponding port's VDDQ supply rail

Key Features

FeatureDesign Value
True dual-port memory cellsEnables concurrent read/write access to identical addresses-critical for lock-free inter-processor communication
Selectable pipelined or flow-through outputReduces critical-path latency by 8.4ns (vs. flow-through) in pipelined mode, improving system throughput
Dual chip enables per portEliminates need for external decode logic when stacking multiple devices for wider or deeper memory configurations
Independent I/O voltage per portSupports heterogeneous system integration-e.g., 3.3V FPGA core interfacing to 2.5V ASIC side via same device
Address counter with repeat functionEnables automatic burst addressing for DMA engines without external counter or address generation logic

Applications

Telecom Packet BufferingFPGA-Based Protocol Acceleration

Use Scenario: Line card buffers for OC-192/STM-64 packet switching where ingress and egress paths require concurrent memory access.

IC Role / Device Role / Timing Role: Dual-port SRAM serving as shared FIFO between ingress MAC and egress scheduler-left port accepts packets, right port services transmit engine.

Use Value: 166MHz operation and 3.6ns tCD2 enable sub-6ns read-after-write turnaround, meeting strict jitter budgets in SONET/SDH timing recovery.

Use Scenario: Offloading TCP/IP checksum, encryption, or header parsing in reconfigurable compute platforms using Xilinx Kintex Ultrascale+ FPGAs.

IC Role / Device Role / Timing Role: High-bandwidth scratchpad memory co-located with FPGA fabric-left port feeds processed data to PCIe subsystem, right port receives raw packet streams from Ethernet PHY.

Use Value: Independent 3.3V/2.5V I/O per port matches FPGA bank voltages and ASIC PHY levels, eliminating level-shifters and reducing BOM count.

Industrial Real-Time ControlAvionics Data Concentration

Use Scenario: Deterministic motion controller requiring synchronized sensor sampling and actuator command updates within 1µs jitter window.

IC Role / Device Role / Timing Role: Shared memory buffer between dual-core ARM Cortex-R5 processors-one core handles PID loop execution, the other manages CAN FD communication stack.

Use Value: Full synchronous operation with 1.7ns setup/0.5ns hold ensures reliable timing closure at 166MHz even under temperature variation (-40°C to +85°C).

Use Scenario: ARINC 664 (AFDX) end-system aggregating data from multiple LRUs in fly-by-wire avionics networks.

IC Role / Device Role / Timing Role: Time-triggered memory hub-left port ingests deterministic AFDX virtual link frames, right port supplies frame metadata to safety-critical monitoring processor.

Use Value: JTAG IEEE 1149.1 compliance enables built-in self-test and fault injection during DO-254 qualification, reducing certification effort.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1362BV33-166AXC128K × 36, 166MHz, 3.3V-only I/O, no OPT pin; uses 256-pin BGA packageLacks per-port voltage selection and fpBGA footprint compatibility; requires PCB redesignChoose only if system uses uniform 3.3V signaling and board layout accommodates larger 256-pin BGA
AS7C3256A-166JC128K × 32, 166MHz, 3.3V core/I/O, no JTAG, PQFP-208 package32-bit width (not 36-bit), no dual-voltage I/O or boundary-scan; lower pin count but incompatible data busConsider only for non-critical cost-sensitive designs where 4-bit truncation is acceptable and JTAG is unnecessary

Compared with CY7C1362BV33-166AXC and AS7C3256A-166JC, the 70V3589S166BF uniquely supports mixed-voltage interfacing and offers JTAG testability in a compact fpBGA-making it optimal for space-constrained, safety-certifiable, and heterogeneous-voltage systems.

Availability

70V3589S166BF is available at Aetrix Electronics and suitable for telecom infrastructure, FPGA acceleration, industrial control, and avionics data concentration requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 70V3589S166BF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, specializes in high-performance timing, memory, and interface ICs for communications, computing, and industrial markets.

The 70V3589S166BF belongs to IDT's high-speed synchronous dual-port SRAM product line, designed specifically for deterministic, low-latency inter-processor and FPGA-ASIC bridging in real-time networking and control systems.

FAQ

What is the maximum operating frequency of the 70V3589S166BF and under what conditions is it guaranteed?

The 70V3589S166BF is rated for 166MHz operation in commercial temperature range (0°C to +70°C) with 3.6ns clock-to-data-out in pipelined mode. This performance is guaranteed with VDD = 3.3V ±150mV, VDDQ = 3.3V or 2.5V per port, and proper signal integrity design including 1.7ns setup/0.5ns hold timing margins. Industrial-grade operation is specified up to 133MHz at -40°C to +85°C.

Does the 70V3589S166BF support independent I/O voltage selection on left and right ports?

Yes, the 70V3589S166BF supports independent I/O voltage selection via OPTL and OPTR pins. Setting OPTL to VIH (3.3V) configures the left port for 3.3V I/O operation with VDDQL = 3.3V; setting OPTR to VIL (0V) configures the right port for 2.5V I/O with VDDQR = 2.5V. Both ports can operate at the same or different voltages simultaneously.

How does the address counter function work on the 70V3589S166BF and what signals control it?

The 70V3589S166BF implements an internal address counter controlled by CNTENL/CNTENR, ADSL/ADSR, and REPEATL/REPEATR. When CNTENX = VIL, the counter advances on each CLKX rising edge. ADSX loads the current address into the counter; REPEATX resets the counter to the last ADSX-loaded address. This enables autonomous burst addressing without external logic-ideal for DMA or streaming applications.

What package options are available for the 70V3589S166BF and which one corresponds to the 'BF' suffix?

The 70V3589S166BF is offered in three packages: 208-pin PQFP (DRG208), 208-pin fpBGA (BF208/BFG208), and 256-pin BGA (BC256/BCG256). The 'BF' in the part number explicitly denotes the 208-pin fine-pitch Ball Grid Array (fpBGA) variant with 0.8mm ball pitch and 15mm × 15mm body size-verified in the official IDT documentation.

Is JTAG boundary-scan supported on the 70V3589S166BF and which pins are used?

Yes, the 70V3589S166BF supports IEEE 1149.1 JTAG boundary-scan. Dedicated pins include TCK (Test Clock), TMS (Test Mode Select), TDI (Test Data In), TDO (Test Data Out), and TRST (Test Reset). These signals are electrically compatible with standard JTAG controllers and enable in-system test, debug, and programming verification without requiring additional test fixtures.

70V3589S166BF Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
208-LFBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
2Mbit
Memory Organization:
64K x 36
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.6 ns
Voltage - Supply:
3.15V ~ 3.45V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
208-CABGA (15x15)

70V3589S166BF FAQ

1.How can I place an order for 70V3589S166BF through Aetrix?

Please submit a Request for Quotation (RFQ) for 70V3589S166BF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70V3589S166BF reliable?

The price and inventory of 70V3589S166BF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V3589S166BF is usually 5 days.

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70V3589S166BF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70V3589S166BF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70V3589S166BF?

For technical support, including 70V3589S166BF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V3589S166BF requirements.

6.How does Aetrix verify that 70V3589S166BF is sourced from the original manufacturer or authorized distributors?

All 70V3589S166BF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V3589S166BF meets industry standards.

7.What is the process for return or replacement of 70V3589S166BF?

All 70V3589S166BF units undergo pre-shipment inspection (PSI). If there is an issue with 70V3589S166BF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70V3589S166BF part is unused and in its original packaging.

Return procedure for 70V3589S166BF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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