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Renesas 70V3589S166BFG

Part No.:
70V3589S166BFG
Manufacturer:
Renesas
Category:
Memory
Package:
208-LFBGA
Datasheet:
Aetrix70V3589S166BFG.pdf
Description:
IC SRAM 2MBIT PARALLEL 208CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,432

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Product details

Overview

70V3589S166BFG from IDT (now Renesas) is a high-speed 128K × 36-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location from independent left and right ports. It operates at 166MHz with 3.6ns clock-to-data-out (pipelined), supports selectable 3.3V or 2.5V I/O interfaces per port, and delivers 12Gbps aggregate bandwidth. It is used in real-time packet buffering for telecom line cards and FPGA co-processor memory interfacing.

For engineers reviewing the 70V3589S166BFG datasheet, 70V3589S166BFG pinout, 70V3589S166BFG application, or 70V3589S166BFG equivalent, key selection criteria include pipelined vs. flow-through output timing, independent VDDQ voltage selection per port, JTAG IEEE 1149.1 compliance, dual chip enable depth expansion capability, and industrial-grade operation up to +85°C at 133MHz.

Technical Context

This device implements fully synchronous dual-port operation with register-controlled address, data, and control inputs on both ports-enabling minimal 1.7ns setup and 0.5ns hold times at 166MHz. Its dual-cycle deselect (DCD) feature in pipelined mode ensures deterministic bus release timing during multi-device depth expansion.

The memory integrates independent address counters per port with repeat and counter-enable logic, allowing burst-mode sequential addressing without external sequencers. Each port supports independent OPT-pin-configurable I/O voltage (3.3V or 2.5V), while the core VDD remains fixed at 3.3V ±150mV-enabling mixed-voltage system integration.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization128K × 36 bits (4.608 Mbit); enables 36-bit wide parallel data paths for high-throughput inter-processor communication
Max Clock Frequency166MHz (commercial grade); achieves 6ns cycle time and 12Gbps total bandwidth across both ports
Access Time3.6ns (pipelined output, 166MHz); guarantees sub-4ns valid data delivery after clock edge for tight-timing control loops
I/O Voltage SupportSelectable 3.3V or 2.5V per port via OPT pins; allows direct interface to both LVTTL and low-voltage FPGA I/O banks
Operating TemperatureCommercial: 0°C to +70°C; Industrial variant available at 133MHz (–40°C to +85°C)
Package208-pin fine-pitch BGA (BFG208); 15mm × 15mm body with 0.8mm ball pitch for high-density PCB layout
JTAG ComplianceIEEE 1149.1 boundary-scan support with TCK, TMS, TDI, TDO, TRST; enables in-system testability and debug visibility

Pinout & Package

208-pin fine-pitch Ball Grid Array (fpBGA), package code BFG208. Body size: 15mm × 15mm × 1.4mm, 0.8mm ball pitch. All VDD pins require 3.3V supply; VDDQ pins must match OPT pin logic level (3.3V if OPT = VIH, 2.5V if OPT = VIL).

Pin/TerminalCircuit RoleDesign Meaning
CLKL / CLKRPort-specific clock inputSynchronous edge-triggered timing reference for all registered inputs/outputs on respective port
CE0L/CE1L, CE0R/CE1RDual chip enables per portEnable depth expansion without external logic: CE0X = active-low, CE1X = active-high decode
PL/FTL / PL/FTRPipeline/Flow-through mode selectDC-level control (VIH = pipelined, VIL = flow-through); determines 1-cycle vs. 0-cycle output latency
OPTL / OPTRI/O voltage option controlConfigures VDDQX supply voltage: VIH → 3.3V I/O, VIL → 2.5V I/O; independent per port
ADSL / ADSRAddress strobe enableLatches current address into internal counter; enables burst-mode sequential addressing without external address generation
I/O0L–I/O35L, I/O0R–I/O35R36-bit bidirectional data busByte-wise controllable (BE0–BE3) for 9-bit granularity; supports partial writes and multiplexed bus compatibility

Key Features

FeatureDesign Value
True dual-port memory cellsEnables concurrent read/write to identical addresses-critical for lock-free inter-processor communication and FIFO emulation
Self-timed write architectureEliminates external write pulse generation; internal timing control ensures minimum cycle time compliance without external delay tuning
Dual-cycle deselect (DCD)Guarantees two-cycle deactivation of outputs in pipelined mode-prevents bus contention during multi-chip depth expansion
Separate byte controls (BE0–BE3)Allows 9-bit sub-word writes across 36-bit bus; reduces power and simplifies protocol handling in packet-processing applications
Automatic power-downEach port enters ultra-low standby (<30mA) when both CE0X = VIH and CE1X = VIL-ideal for dynamic power gating in burst-traffic systems

Applications

Telecom Line Card BufferingFPGA Co-Processor Memory

Use Scenario: Real-time buffering of OC-192/STM-64 packet streams between SERDES and traffic manager ASICs.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-latency shared memory between ingress and egress processing pipelines.

Use Value: Simultaneous access eliminates arbitration delays; 166MHz operation sustains >10Gbps line-rate throughput with sub-4ns read latency.

Use Scenario: High-bandwidth data exchange between Xilinx Virtex FPGA and ARM-based control processor in radar signal processing.

IC Role / Device Role / Timing Role: Serves as synchronized scratchpad memory with independent clock domains for FPGA logic and CPU subsystem.

Use Value: Pipelined output mode provides deterministic 3.6ns data delivery; separate 2.5V/3.3V I/O rails match mixed-voltage FPGA bank requirements.

Industrial Motion ControllerAvionics Data Concentrator

Use Scenario: Storing interpolated trajectory points and sensor fusion results in real-time CNC motion controllers.

IC Role / Device Role / Timing Role: Dual-port RAM buffers position commands (left port) and feedback samples (right port) with atomic cross-port visibility.

Use Value: True dual-port architecture enables lock-free updates; industrial temperature rating (–40°C to +85°C) ensures reliability in harsh enclosures.

Use Scenario: Aggregating ARINC 429 and MIL-STD-1553B sensor data for flight control computers in unmanned aerial vehicles.

IC Role / Device Role / Timing Role: Acts as time-deterministic message queue between multiple legacy avionics buses and modern processing unit.

Use Value: JTAG IEEE 1149.1 support enables in-flight boundary-scan diagnostics; 133MHz industrial-grade operation meets DO-254 timing assurance requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1362BV33-166AXC128K × 36, 166MHz, 3.3V-only I/O, no OPT pin; uses 256-pin BGA (1.0mm pitch)Lacks per-port I/O voltage flexibility; requires external level-shifting for mixed-voltage systemsChoose when system uses only 3.3V I/O and board layout accommodates larger 256-pin footprint
AS7C33128A-166BIN128K × 36, 166MHz, 3.3V core/I/O, no pipelined mode; flow-through only, no JTAGNo pipelined output or IEEE 1149.1 support; simpler timing but less flexible for high-speed burst protocolsChoose for cost-sensitive designs where JTAG testability and sub-4ns pipelined latency are not required

Compared with CY7C1362BV33-166AXC and AS7C33128A-166BIN, the 70V3589S166BFG uniquely supports per-port 2.5V/3.3V I/O selection and pipelined output mode-enabling tighter timing closure in FPGA-based systems and eliminating external level shifters in mixed-voltage architectures.

Availability

70V3589S166BFG is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, avionics data concentrators, and FPGA-accelerated embedded systems requiring stable component supply and long-term lifecycle support.

Supply support for 70V3589S166BFG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics (formerly Integrated Device Technology) is a global semiconductor leader specializing in high-performance memory, timing, and analog solutions for communications, computing, and industrial markets.

The IDT70V3589 product line was designed for ultra-low-latency, high-bandwidth dual-port memory applications in real-time networking, test equipment, and digital signal processing systems requiring deterministic access and mixed-voltage interoperability.

FAQ

What is the maximum operating frequency of the 70V3589S166BFG and under what conditions?

The 70V3589S166BFG operates at up to 166MHz in commercial grade (0°C to +70°C) with pipelined output mode enabled. This requires VDD = 3.3V ±150mV, VDDQ = 3.3V or 2.5V per port (set by OPT pins), and all AC timing parameters met-including 1.7ns address setup and 3.6ns clock-to-data-out. Industrial-grade operation is rated at 133MHz (–40°C to +85°C).

Does the 70V3589S166BFG support independent I/O voltage selection on left and right ports?

Yes, the 70V3589S166BFG supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL = VIH configures left-port I/Os for 3.3V operation (requiring VDDQL = 3.3V), while OPTL = VIL configures them for 2.5V (requiring VDDQL = 2.5V). The same applies independently to the right port using OPTR and VDDQR. The core VDD remains fixed at 3.3V.

How does the pipelined versus flow-through output mode affect timing in the 70V3589S166BFG?

In pipelined mode (PL/FTL = VIH), the 70V3589S166BFG delivers data with 3.6ns clock-to-data-out and 6ns minimum cycle time. In flow-through mode (PL/FTL = VIL), it delivers data with 12ns clock-to-data-out and 20ns minimum cycle time. Pipelined mode adds one-cycle latency but enables higher throughput; flow-through offers zero-cycle latency for critical real-time reads.

Can the 70V3589S166BFG be used for depth expansion, and how is it implemented?

Yes, the 70V3589S166BFG supports depth expansion using dual chip enables (CE0X and CE1X) per port. By decoding address MSBs externally to drive CE0X/CE1X across multiple devices, designers can expand memory depth without additional logic gates. The dual-cycle deselect (DCD) feature ensures clean bus release timing during deselection in pipelined mode.

What JTAG features are supported by the 70V3589S166BFG and how are they accessed?

The 70V3589S166BFG supports full IEEE 1149.1 JTAG boundary-scan functionality via dedicated pins: TCK (10MHz test clock), TMS (test mode select), TDI (test data in), TDO (test data out), and TRST (reset). These signals are accessible on the 208-pin fpBGA package and enable in-system testing, interconnect verification, and debug visibility without requiring special programming hardware beyond standard JTAG adapters.

70V3589S166BFG Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
208-LFBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
2Mbit
Memory Organization:
64K x 36
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.6 ns
Voltage - Supply:
3.15V ~ 3.45V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
208-CABGA (15x15)

70V3589S166BFG FAQ

1.How can I place an order for 70V3589S166BFG through Aetrix?

Please submit a Request for Quotation (RFQ) for 70V3589S166BFG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70V3589S166BFG reliable?

The price and inventory of 70V3589S166BFG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V3589S166BFG is usually 5 days.

3.What payment methods are accepted for 70V3589S166BFG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70V3589S166BFG transactions.

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70V3589S166BFG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70V3589S166BFG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70V3589S166BFG?

For technical support, including 70V3589S166BFG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V3589S166BFG requirements.

6.How does Aetrix verify that 70V3589S166BFG is sourced from the original manufacturer or authorized distributors?

All 70V3589S166BFG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V3589S166BFG meets industry standards.

7.What is the process for return or replacement of 70V3589S166BFG?

All 70V3589S166BFG units undergo pre-shipment inspection (PSI). If there is an issue with 70V3589S166BFG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70V3589S166BFG part is unused and in its original packaging.

Return procedure for 70V3589S166BFG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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