Renesas 70V3599S133BCGI
- Part No.:
- 70V3599S133BCGI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 256-LBGA
- Datasheet:
-
70V3599S133BCGI.pdf
- Description:
- IC SRAM 4.5MBIT PAR 256CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
70V3599S133BCGI from IDT (now Renesas) is a high-speed 128K × 36-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location from independent left and right ports. It operates at 133 MHz (7.5 ns cycle time), supports selectable pipelined or flow-through output modes, and features dual 3.3 V/2.5 V I/O voltage capability per port for mixed-voltage system interfacing - used in telecom line cards and packet buffer applications.
For engineers reviewing the 70V3599S133BCGI datasheet, 70V3599S133BCGI pinout, 70V3599S133BCGI application, or 70V3599S133BCGI equivalent, key selection criteria include its 133 MHz industrial-grade timing (–40°C to +85°C), JTAG IEEE 1149.1 compliance, dual chip enable depth expansion support, and byte-selectable 9-bit-wide I/O lanes with independent counter/repeat logic per port.
Technical Context
This device implements fully synchronous dual-port operation with registered address, data, and control inputs on both ports - delivering 1.7 ns setup and 0.5 ns hold times at 166 MHz. Its internal architecture includes separate clock domains, dual address strobes (ADSL/ADSR), and independent counter-enable (CNTENL/CNTENR) and repeat (REPEATL/REPEATR) logic for burst-address generation without external counters.
The memory supports two distinct output timing modes: pipelined (6 ns cycle, 3.6 ns clock-to-data) and flow-through (25 ns cycle, 15 ns clock-to-data), selected per port via PL/FTL and PL/FTR pins. Each port's I/O voltage (3.3 V or 2.5 V) is independently configured using OPTL/OPTR pins, with corresponding VDDQL/VDDQR supply rails.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36 bits (4.608 Mbit), true dual-port cell array enabling concurrent access |
| Max Clock Frequency | 133 MHz (7.5 ns cycle time) - guaranteed over industrial temperature range (–40°C to +85°C) |
| Access Time | 4.2 ns (max) at 133 MHz in pipelined mode - defines minimum clock-to-valid-data latency |
| I/O Voltage Support | Per-port selectable 3.3 V (±150 mV) or 2.5 V (±100 mV) - enables mixed-voltage interoperation with FPGAs/ASICs |
| Operating Temperature | –40°C to +85°C - qualified for industrial embedded systems requiring thermal robustness |
| JTAG Compliance | IEEE 1149.1 boundary-scan support with TCK, TMS, TDI, TDO, TRST - enables in-system testability |
| Power Supply | 3.3 V ±150 mV core (VDD); separate VDDQL/VDDQR rails for I/O - decouples core and interface power domains |
Pinout & Package
70V3599S133BCGI is packaged in a 208-pin fine-pitch Ball Grid Array (fpBGA) with 0.8 mm ball pitch and 15 mm × 15 mm body size. Pin functions are symmetrically distributed across left (L) and right (R) ports, each with dedicated clock, address, data I/O, control, and power terminals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port-synchronous clock input | Edge-triggered register control for all port inputs; determines timing domain boundaries |
| A0L–A16L / A0R–A16R | Address inputs | 17-bit address bus per port; A16 is no-connect for 64K variants but functional for 128K |
| I/O0L–I/O35L / I/O0R–I/O35R | Bidirectional data I/O | 36-bit parallel data path per port; organized as four 9-bit bytes for granular write masking |
| BE0L–BE3L / BE0R–BE3R | Byte enable controls | Independent 9-bit lane enables - allows partial writes without read-modify-write overhead |
| CE0L/CE1L / CE0R/CE1R | Dual chip enables | Two-level enable hierarchy enables seamless depth expansion across multiple devices without glue logic |
| PL/FTL / PL/FTR | Output mode select | DC-configurable pipelined (low latency, multi-cycle) or flow-through (single-cycle, higher latency) output behavior |
| OPTL / OPTR | I/O voltage option control | Directly configures VDDQL/VDDQR rail voltage level (3.3 V or 2.5 V) for corresponding port's I/O buffers |
| TCK, TMS, TDI, TDO, TRST | JTAG test interface | Full IEEE 1149.1 boundary-scan implementation - supports production test and debug visibility |
Key Features
| Feature | Design Value |
|---|---|
| True dual-port memory cells | Enables simultaneous, independent read/write operations on identical addresses - eliminates arbitration logic in shared-memory architectures |
| Dual-cycle deselect (DCD) | Prevents metastability during rapid chip enable toggling in pipelined mode - ensures deterministic output disable timing |
| Separate byte controls (9-bit) | Supports sub-word writes across four independent 9-bit lanes - critical for protocol header manipulation in networking buffers |
| Counter enable & repeat logic | Hardware address incrementing and automatic reload from last ADS-latched address - reduces CPU overhead in sequential burst transfers |
| Self-timed write cycle | Eliminates external write pulse generation - simplifies timing closure by embedding write completion detection in silicon |
| LVTTL-compatible I/O | Guaranteed DC compatibility with 3.3 V and 2.5 V LVTTL logic families - avoids level-shifter components in mixed-voltage designs |
Applications
| Telecom Line Card Buffering | Network Packet Processing |
|---|---|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets between ingress and egress PHY interfaces on a carrier-grade line card. IC Role / Device Role / Timing Role: Dual-port SRAM acts as a non-blocking, low-latency packet buffer - left port accepts incoming frames while right port services transmit scheduler. Use Value: 133 MHz pipelined operation delivers 4.2 ns clock-to-data, enabling sub-10 ns round-trip access for real-time packet inspection and modification. |
Use Scenario: Deep buffering of fragmented packets in a multi-core network processor ASIC with separate control and data plane engines. IC Role / Device Role / Timing Role: Serves as shared memory between traffic manager and classification engine - one port handles metadata, the other handles payload. Use Value: Independent 3.3 V/2.5 V I/O per port matches voltage domains of adjacent logic blocks, eliminating level shifters and reducing BOM count. |
| Industrial PLC Data Exchange | Radar Signal Processing FIFO |
Use Scenario: Real-time exchange of sensor data and actuator commands between deterministic motion controller and fieldbus interface module. IC Role / Device Role / Timing Role: Dual-port SRAM provides atomic read/write handshaking - left port writes sensor samples, right port reads for control loop execution. Use Value: Industrial temperature rating (–40°C to +85°C) and 133 MHz timing guarantee ensure reliable operation in uncontrolled cabinet environments. |
Use Scenario: High-throughput buffering of digitized IF samples between ADC and FFT accelerator in phased-array radar front-end. IC Role / Device Role / Timing Role: Functions as a ping-pong FIFO - one port streams ADC data, the other feeds processed results to beamformer. Use Value: 12 Gbps aggregate bandwidth (133 MHz × 36 bits × 2 ports) sustains continuous 12-bit @ 100 MSPS sampling without overflow. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-133AXC | 128K × 36, 133 MHz, 3.3 V only I/O (no 2.5 V option), no JTAG, PQFP/256-BGA only | Lacks per-port voltage flexibility and boundary-scan - suitable where mixed-voltage interfacing is unnecessary | Select when cost sensitivity outweighs need for JTAG testability and 2.5 V I/O compatibility |
| IDT70V27L15PF8 | 64K × 36, 15 ns access, 3.3 V only, no counter/repeat logic, no JTAG, 100-pin TQFP | Lower density, slower speed, no advanced addressing features - targets simpler legacy control applications | Choose for space-constrained designs where 128K capacity and 133 MHz throughput are not required |
Compared with CY7C1362BV33-133AXC and IDT70V27L15PF8, the 70V3599S133BCGI uniquely combines industrial-grade 133 MHz timing, per-port 2.5 V/3.3 V I/O selection, hardware address counter/repeat, and IEEE 1149.1 JTAG - making it optimal for next-generation telecom and signal processing systems demanding flexibility, testability, and thermal resilience.
Availability
70V3599S133BCGI is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and radar signal processing applications requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for 70V3599S133BCGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a semiconductor company specializing in high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.
The 70V3599S133BCGI belongs to IDT's high-speed synchronous dual-port SRAM product line, designed specifically for low-latency, deterministic memory sharing in real-time packet processing, baseband signal handling, and deterministic control systems.
FAQ
What is the maximum guaranteed operating frequency of the 70V3599S133BCGI?
The 70V3599S133BCGI is rated for 133 MHz operation across the full industrial temperature range (–40°C to +85°C), with a maximum clock cycle time of 7.5 ns in pipelined mode. This specification is production-tested and guaranteed - not a typical-only value - ensuring deterministic timing in mission-critical embedded systems.
Does the 70V3599S133BCGI support independent I/O voltage levels on its left and right ports?
Yes, the 70V3599S133BCGI supports independent I/O voltage selection per port via OPTL and OPTR pins. Each port can be configured for either 3.3 V (±150 mV) or 2.5 V (±100 mV) operation, with corresponding VDDQL and VDDQR supplies. This enables direct interfacing with heterogeneous logic families without external level shifters.
How does the counter enable and repeat functionality work in the 70V3599S133BCGI?
In the 70V3599S133BCGI, CNTENL/CNTENR enables automatic address incrementing on each clock edge, while REPEATL/REPEATR resets the internal counter to the last valid address loaded via ADSL/ADSR. This hardware-based addressing eliminates software overhead in burst transfers and ensures deterministic sequential access without CPU intervention.
What package options are available for the 70V3599S133BCGI, and which one is used for this part number?
The 70V3599S133BCGI is offered in three packages: 208-pin PQFP, 208-pin fpBGA, and 256-pin BGA. The "BCGI" suffix explicitly denotes the 208-pin fine-pitch Ball Grid Array (fpBGA) variant with 0.8 mm ball pitch and 15 mm × 15 mm footprint - optimized for high-density PCB layouts and thermal performance.
Is JTAG boundary-scan supported on the 70V3599S133BCGI, and what signals are required?
Yes, the 70V3599S133BCGI fully supports IEEE 1149.1 JTAG boundary-scan with dedicated TCK, TMS, TDI, TDO, and TRST pins. These signals enable in-system testability, fault isolation, and programming verification - critical for high-reliability telecom and industrial applications where post-assembly test coverage is mandatory.
70V3599S133BCGI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 3.15V ~ 3.45V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-CABGA (17x17)
70V3599S133BCGI FAQ
1.How can I place an order for 70V3599S133BCGI through Aetrix?
Please submit a Request for Quotation (RFQ) for 70V3599S133BCGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70V3599S133BCGI reliable?
The price and inventory of 70V3599S133BCGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V3599S133BCGI is usually 5 days.
3.What payment methods are accepted for 70V3599S133BCGI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70V3599S133BCGI transactions.
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4.How is shipping managed for 70V3599S133BCGI?
70V3599S133BCGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 70V3599S133BCGI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70V3599S133BCGI?
For technical support, including 70V3599S133BCGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V3599S133BCGI requirements.
6.How does Aetrix verify that 70V3599S133BCGI is sourced from the original manufacturer or authorized distributors?
All 70V3599S133BCGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V3599S133BCGI meets industry standards.
7.What is the process for return or replacement of 70V3599S133BCGI?
All 70V3599S133BCGI units undergo pre-shipment inspection (PSI). If there is an issue with 70V3599S133BCGI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70V3599S133BCGI part is unused and in its original packaging.
Return procedure for 70V3599S133BCGI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
70V3599S133BCGI Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

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24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

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24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
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