Renesas 70V3599S133BF
- Part No.:
- 70V3599S133BF
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 208-LFBGA
- Datasheet:
-
70V3599S133BF.pdf
- Description:
- IC SRAM 4.5MBIT PAR 208CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
70V3599S133BF from IDT (now Renesas) is a high-speed 128K × 36-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location from independent left and right ports. It operates at 133MHz (7.5ns cycle time), supports selectable pipelined or flow-through output modes, and features dual 3.3V/2.5V I/O voltage capability per port - used in high-bandwidth packet buffering for telecom line cards and FPGA co-processor interconnects.
For engineers reviewing the 70V3599S133BF datasheet, 70V3599S133BF pinout, 70V3599S133BF application, or 70V3599S133BF equivalent, key selection criteria include guaranteed 133MHz operation across industrial temperature (−40°C to +85°C), JTAG IEEE 1149.1 compliance, dual chip enable depth expansion, and separate byte enables for 9-bit-wide data bus matching in burst-mode systems.
Technical Context
This device implements fully synchronous dual-port operation with registered address, data, and control inputs on both ports - delivering 1.7ns setup and 0.5ns hold times at 166MHz. Its internal architecture includes independent address counters with repeat and enable features, self-timed write logic, and Dual Cycle Deselect (DCD) for pipelined mode stability.
The memory supports mixed-voltage interfacing: core VDD = 3.3V ±150mV, while each port's I/O voltage (VDDQ) is independently configurable to either 3.3V or 2.5V via OPTL/OPTR pins - enabling seamless integration with 2.5V FPGAs and 3.3V processors without level shifters.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36 bits (4.608 Mbit), supporting independent concurrent access on left/right ports |
| Max Clock Frequency | 133MHz (7.5ns cycle time) - validated for industrial temperature range (−40°C to +85°C) |
| Access Time | 4.2ns (max) in flow-through mode - determines minimum latency for single-cycle read operations |
| I/O Voltage Support | Per-port selectable 3.3V or 2.5V (via OPTL/OPTR) - eliminates external level translation in mixed-voltage systems |
| Power Supply | VDD = 3.3V ±150mV (core); VDDQ = 2.5V ±100mV or 3.3V ±150mV (I/O) - decoupled domains reduce noise coupling |
| Operating Temperature | Industrial grade: −40°C to +85°C - qualified for base station, industrial control, and avionics applications |
| JTAG Compliance | IEEE 1149.1 boundary-scan support - enables in-system testability and debug of memory interconnects |
Pinout & Package
70V3599S133BF is packaged in a 208-pin fine-pitch Ball Grid Array (fpBGA) with 0.8mm ball pitch and 15mm × 15mm body size. Pin functions are symmetrically distributed across left (L) and right (R) ports, with dedicated clock, address, data I/O, control, and power/ground balls.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port-synchronous clock input | Registers all address/data/control inputs on rising edge - enables deterministic timing closure in high-speed designs |
| A0L–A16L / A0R–A16R | Address inputs | 17-bit address bus per port - supports full 128K depth; A16 is no-connect for 64K variants |
| I/O0L–I/O35L / I/O0R–I/O35R | Bidirectional data I/O | 36-bit parallel interface per port - segmented into four 9-bit bytes for granular write masking |
| BE0L–BE3L / BE0R–BE3R | Byte enable controls | Independent 9-bit write enable per port - allows partial writes without read-modify-write cycles |
| CE0L/CE1L / CE0R/CE1R | Dual chip enables | Enables depth expansion up to 4× without external logic - CE0 active low, CE1 active high |
| PL/FTL / PL/FTR | Pipeline/flow-through mode select | DC-level control (VIH/VIL) - selects output register staging: pipelined (1-cycle latency) or flow-through (0-cycle latency) |
| OPTL / OPTR | I/O voltage option select | Configures VDDQL/VDDQR supply voltage: VIH = 3.3V, VIL = 2.5V - sets I/O logic thresholds and drive strength |
| TCK/TMS/TDI/TDO/TRST | JTAG test interface | IEEE 1149.1-compliant TAP controller - supports boundary scan testing and in-circuit debugging |
Key Features
| Feature | Design Value |
|---|---|
| True dual-port memory cells | Enables simultaneous read/write to identical addresses - critical for real-time data exchange between independent processors or cores |
| Selectable pipelined or flow-through output | Reduces system latency (flow-through) or improves timing margin (pipelined) - configurable per port without hardware change |
| Dual chip enables (CE0/CE1) | Supports seamless depth expansion up to 4 devices - eliminates need for external decode logic in large memory arrays |
| Separate byte controls (4 × 9-bit) | Enables precise 9-bit write masking - avoids destructive overwrites in multiplexed bus architectures and reduces bus contention |
| Counter enable and repeat functionality | Automates sequential address generation and loop-back addressing - offloads address management from host controllers |
| Self-timed write operation | Guarantees reliable write completion independent of clock skew - simplifies timing analysis in multi-clock-domain systems |
Applications
| Telecom Packet Buffering | FPGA Co-Processor Interconnect |
|---|---|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in line-rate switching ASICs. IC Role / Device Role / Timing Role: Dual-port SRAM acts as shared buffer between ingress parser and egress scheduler - left port accepts packet data, right port delivers formatted frames. Use Value: Simultaneous access enables zero-latency handoff; 133MHz bandwidth sustains 4.8 Gbps aggregate throughput (36-bit × 133MHz). | Use Scenario: High-speed data exchange between Xilinx Kintex FPGA and ARM-based control processor in radar signal processing. IC Role / Device Role / Timing Role: Memory bridge providing deterministic latency for DMA transfers - FPGA writes processed samples, processor reads results. Use Value: Pipelined mode ensures predictable 1-cycle latency; independent 2.5V/3.3V I/O allows direct connection to FPGA banks and processor buses. |
| Industrial Motion Controller | Avionics Data Acquisition |
Use Scenario: Real-time coordination of multiple servo axes using interpolated trajectory data stored in shared memory. IC Role / Device Role / Timing Role: Shared memory resource accessed concurrently by motion algorithm core (left port) and safety monitor core (right port). Use Value: Industrial temperature rating (−40°C to +85°C) ensures reliability in motor cabinets; dual CE enables safe memory partitioning. | Use Scenario: Capturing synchronized sensor streams (IMU, pressure, temperature) in flight data recorders with deterministic timestamping. IC Role / Device Role / Timing Role: Buffering high-rate ADC outputs (left port) while feeding compressed data to encryption engine (right port). Use Value: JTAG boundary scan enables in-flight verification of memory integrity; flow-through mode minimizes acquisition-to-processing delay. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-133BZI | 64K × 36 organization; 133MHz max; 2.5V-only I/O; no JTAG; different pinout | Limited depth for large buffers; requires level shifters for 3.3V interfaces | Choose when cost sensitivity outweighs depth and voltage flexibility needs |
| AS7C3256B-133BIN | 128K × 32 organization; 133MHz; 3.3V-only I/O; no counter/repeat features; no JTAG | 32-bit data width limits bandwidth vs. 36-bit; lacks advanced addressing modes | Choose for simpler, lower-cost designs where byte granularity and address automation are unnecessary |
Compared with CY7C1362BV33-133BZI and AS7C3256B-133BIN, the 70V3599S133BF provides greater memory depth, per-port voltage configurability, integrated address counter logic, and JTAG testability - making it optimal for complex, high-reliability embedded systems requiring flexible memory interfacing and debug support.
Availability
70V3599S133BF is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, avionics data acquisition, and FPGA-based signal processing applications requiring stable component supply and long-term lifecycle assurance.
Supply support for 70V3599S133BF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics (formerly Integrated Device Technology) is a global semiconductor leader specializing in microcontrollers, analog, power management, and high-performance memory solutions for automotive, industrial, and communications markets.
The 70V3599S133BF belongs to IDT's high-speed synchronous dual-port SRAM product line, designed specifically for deterministic, low-latency memory sharing between independent processors, FPGAs, and ASICs in real-time embedded systems.
FAQ
What is the maximum guaranteed operating frequency of the 70V3599S133BF across its full industrial temperature range?
The 70V3599S133BF is guaranteed to operate at 133MHz (7.5ns cycle time) over the full industrial temperature range of −40°C to +85°C. This specification is validated per AC Electrical Characteristics Table 11 in the official datasheet and applies to both pipelined and flow-through output modes under specified supply and loading conditions.
Does the 70V3599S133BF support independent I/O voltage selection for its left and right ports?
Yes, the 70V3599S133BF supports independent I/O voltage selection: OPTL configures the left port's VDDQL supply (3.3V or 2.5V), and OPTR configures the right port's VDDQR supply (3.3V or 2.5V). This allows one port to interface with a 2.5V FPGA bank while the other connects to a 3.3V microcontroller - without external level shifters.
How does the Dual Cycle Deselect (DCD) feature function in the 70V3599S133BF's pipelined output mode?
In pipelined output mode (PL/FTX = VIH), chip enables CE0 and CE1 are double-buffered - meaning a deselect command takes two clock cycles to propagate through the internal pipeline. This prevents metastability and ensures clean output disable timing during rapid port enable/disable sequences, improving signal integrity in high-speed depth-expanded memory systems.
Can the 70V3599S133BF be used in flow-through output mode for zero-latency reads, and what are the timing trade-offs?
Yes, setting PL/FTL or PL/FTR to VIL configures the corresponding port for flow-through output mode, delivering data within one clock cycle (tCD1 ≤ 15ns max). However, this mode increases minimum cycle time to 25ns (40MHz effective) versus 7.5ns (133MHz) in pipelined mode - trading latency for bandwidth depending on system timing constraints.
What is the role of the REPEAT and CNTEN signals in the 70V3599S133BF's address counter functionality?
CNTEN enables the internal address counter on the rising edge of CLK; when asserted (VIL), the counter increments automatically. REPEAT resets the counter to the last valid address loaded via ADS - enabling circular buffer behavior. Both signals operate independently per port and are asynchronous to memory access, allowing deterministic address sequencing without host CPU intervention.
70V3599S133BF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 208-LFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 3.15V ~ 3.45V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 208-CABGA (15x15)
70V3599S133BF FAQ
1.How can I place an order for 70V3599S133BF through Aetrix?
Please submit a Request for Quotation (RFQ) for 70V3599S133BF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70V3599S133BF reliable?
The price and inventory of 70V3599S133BF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V3599S133BF is usually 5 days.
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5.How can I obtain technical support or documentation for 70V3599S133BF?
For technical support, including 70V3599S133BF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V3599S133BF requirements.
6.How does Aetrix verify that 70V3599S133BF is sourced from the original manufacturer or authorized distributors?
All 70V3599S133BF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V3599S133BF meets industry standards.
7.What is the process for return or replacement of 70V3599S133BF?
All 70V3599S133BF units undergo pre-shipment inspection (PSI). If there is an issue with 70V3599S133BF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70V3599S133BF part is unused and in its original packaging.
Return procedure for 70V3599S133BF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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