Renesas 70V3599S166BC
- Part No.:
- 70V3599S166BC
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 256-LBGA
- Datasheet:
-
70V3599S166BC.pdf
- Description:
- IC SRAM 4.5MBIT PAR 256CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
70V3599S166BC from IDT (now Renesas) is a high-speed 128K × 36-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location from independent left and right ports. It operates at 166MHz with 3.6ns clock-to-data-out (pipelined), supports selectable 3.3V or 2.5V I/O interfaces per port, and delivers 12Gbps aggregate bandwidth. It is used in high-throughput packet buffering, FPGA co-processor memory, and telecom line-card data path acceleration.
For engineers reviewing the 70V3599S166BC datasheet, 70V3599S166BC pinout, 70V3599S166BC application, or 70V3599S166BC equivalent, key selection criteria include pipelined vs. flow-through output timing, independent VDDQ voltage selection per port, JTAG IEEE 1149.1 compliance, industrial-grade temperature support up to +85°C, and depth-expansion capability using dual chip enables without external logic.
Technical Context
The 70V3599S166BC implements fully synchronous operation on both ports with registered address, data, and control inputs-enabling minimal setup/hold times (1.7ns setup, 0.5ns hold @ 166MHz). Its dual-port memory array allows concurrent access without arbitration logic, while the integrated address counter with repeat and enable features supports burst-mode sequential addressing.
Each port features independent power domains: 3.3V core (VDD) and selectable 3.3V/2.5V I/O (VDDQX controlled by OPTL/OPTR pins), supporting mixed-voltage system interfacing. The device supports JTAG boundary-scan testing and includes Dual Cycle Deselect (DCD) for reliable pipelined output mode deactivation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36 bits (4.608 Mbit), true dual-port SRAM array |
| Max Clock Frequency | 166MHz (6ns cycle time, pipelined mode) |
| Access Time | 3.6ns clock-to-data-out (tCD2, pipelined, commercial grade) |
| I/O Voltage Support | Per-port selectable: 3.3V (±150mV) or 2.5V (±100mV) via OPTL/OPTR |
| Operating Temperature | Commercial: 0°C to +70°C; Industrial variant available up to +85°C |
| Package Options | 208-pin fpBGA (BF208), 256-pin BGA (BC256), 208-pin PQFP (DRG208) |
| JTAG Compliance | Fully IEEE 1149.1-compliant test access port (TCK, TMS, TDI, TDO, TRST) |
Pinout & Package
70V3599S166BC is packaged in a 208-pin fine-pitch Ball Grid Array (fpBGA, code BF208) with 0.8mm ball pitch and 15mm × 15mm body size. All VDD pins require 3.3V supply; VDDQL/VDDQR must match OPTL/OPTR logic levels (3.3V if VIH, 2.5V if VIL).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port clock input | Synchronous edge-triggered clock for left/right port registers; all inputs sampled on rising edge |
| A0L–A16L / A0R–A16R | Address inputs | 17-bit address bus per port; A16 is no-connect for 64K variants but functional for 128K |
| I/O0L–I/O35L / I/O0R–I/O35R | Bidirectional data I/O | 36-bit data bus per port; byte-enable controlled (BE0–BE3, 9-bit granularity) |
| CE0L/CE1L / CE0R/CE1R | Chip enable pairs | Dual enables allow depth expansion: CE0 active low + CE1 active high enables port; independent per port |
| R/WL / R/WR | Read/write direction control | Active-high write enable; synchronous with CLK; determines data flow direction per access |
| OEL / OER | Output enable | Asynchronous control of output drivers; high-Z when asserted high |
| PL/FTL / PL/FTR | Pipeline/flow-through mode select | DC-level control (VIH = pipelined, VIL = flow-through); sets tCD timing behavior per port |
| OPTL / OPTR | I/O voltage option select | DC-level input selecting VDDQX voltage: VIH → 3.3V I/O, VIL → 2.5V I/O |
Key Features
| Feature | Design Value |
|---|---|
| True dual-port memory cells | Enables simultaneous, independent read/write access to identical addresses-eliminates arbitration overhead in real-time inter-processor communication |
| Selectable pipelined or flow-through output | Configurable latency: pipelined (3.6ns tCD2, 6ns tCYC2) for maximum throughput; flow-through (12ns tCD1, 20ns tCYC1) for deterministic zero-cycle-read timing |
| Dual chip enables per port | Allows seamless depth expansion across multiple devices without external decode logic-reduces PCB routing complexity and gate count |
| Independent per-port I/O voltage selection | OPTL/OPTR pins configure VDDQL/VDDQR to 3.3V or 2.5V independently-enables direct interfacing with mixed-voltage FPGAs or ASICs |
| Integrated address counter with repeat | CNTENL/R and REPEATL/R enable burst-address generation and automatic wrap-around-reduces address bus traffic in streaming applications like packet buffers |
| JTAG boundary-scan support | IEEE 1149.1-compliant TAP controller (TCK/TMS/TDI/TDO/TRST) enables in-system testability and debug visibility without additional test fixtures |
Applications
| Telecom Line Card Buffering | FPGA Co-Processor Memory |
|---|---|
Use Scenario: High-speed packet buffering in 10G/25G Ethernet line cards where ingress and egress data paths require concurrent access to shared memory. IC Role / Device Role / Timing Role: Dual-port SRAM acts as a non-blocking, low-latency buffer between MAC and switch fabric; left port handles ingress writes, right port serves egress reads at full line rate. Use Value: 166MHz pipelined operation delivers 12Gbps bandwidth-matching OC-192/STM-64 interface rates without bottlenecking; dual chip enables simplify multi-chip buffer banks. | Use Scenario: Offloading compute-intensive tasks (e.g., encryption, filtering) from an FPGA fabric using tightly coupled memory for intermediate result storage. IC Role / Device Role / Timing Role: Serves as low-latency, deterministic scratchpad memory accessible simultaneously by FPGA logic (left port) and embedded soft-core processor (right port). Use Value: True dual-port architecture eliminates memory contention stalls; 3.6ns tCD2 ensures single-cycle data availability for pipeline-critical operations. |
| Industrial Motion Control | Real-Time Signal Processing |
Use Scenario: Synchronizing position feedback and command updates between servo drives and motion controllers in CNC machines requiring sub-microsecond determinism. IC Role / Device Role / Timing Role: Acts as a shared register file between two real-time microcontrollers-one writing sensor data, the other reading actuator commands-both accessing same memory locations concurrently. Use Value: Industrial temperature range (−40°C to +85°C) and 133MHz guaranteed operation ensure reliability in harsh environments; self-timed write enables fast cycle time without external timing constraints. | Use Scenario: Storing time-domain samples and filter coefficients in radar or ultrasound beamforming systems where ADC/DAC streams and DSP engines operate on overlapping data windows. IC Role / Device Role / Timing Role: Provides ping-pong buffer memory: one port feeds incoming ADC samples, the other supplies processed data to DAC-coordinated via ADS strobes and address counters. Use Value: Address counter with REPEATL/R enables automatic circular buffer addressing; separate byte enables (BE0–BE3) allow partial-word updates without disturbing adjacent data. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-166AXC | 128K × 36, 166MHz, 3.3V-only I/O (no 2.5V option), 208-pin TQFP package | Lacks per-port VDDQ selection; requires external level-shifting for mixed-voltage designs | Choose when system uses only 3.3V interfaces and TQFP mechanical fit is required over BGA. |
| AS7C312836PFSI-166 | 128K × 36, 166MHz, 3.3V core/I/O, -40°C to +85°C industrial grade, 256-pin FBGA | No JTAG support; no pipelined/flow-through mode selection; fixed flow-through timing only | Choose when JTAG testability is unnecessary and simplified timing model suffices for deterministic latency requirements. |
Compared with CY7C1362BV33-166AXC and AS7C312836PFSI-166, the 70V3599S166BC uniquely supports per-port 2.5V/3.3V I/O selection and IEEE 1149.1 JTAG-critical for mixed-voltage FPGA-based systems requiring in-system testability and flexible voltage domain bridging.
Availability
70V3599S166BC is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, FPGA-accelerated computing, and real-time signal processing applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for 70V3599S166BC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.
The 70V3599S166BC belongs to IDT's high-speed synchronous dual-port SRAM product line, designed specifically for applications demanding concurrent, low-latency memory access between heterogeneous processors, FPGAs, or data-path subsystems.
FAQ
What is the maximum guaranteed operating frequency of the 70V3599S166BC?
The 70V3599S166BC is rated for 166MHz operation in commercial temperature range (0°C to +70°C) with 6ns clock cycle time in pipelined mode. At 133MHz, it is qualified for industrial temperature range (−40°C to +85°C). The 166MHz speed grade is not guaranteed under industrial conditions-designers requiring extended temperature support must use the 133MHz variant (70V3599S133BC).
How does the 70V3599S166BC handle mixed-voltage interfacing between its two ports?
The 70V3599S166BC supports independent I/O voltage selection per port via OPTL and OPTR pins: setting OPTL to VIH configures VDDQL for 3.3V operation, while VIL selects 2.5V; OPTR controls VDDQR identically. This allows the left port to interface with a 2.5V FPGA bank and the right port with a 3.3V microcontroller-without external level shifters-provided respective VDDQ supplies are correctly routed.
Does the 70V3599S166BC support JTAG boundary-scan, and what pins are required?
Yes, the 70V3599S166BC fully complies with IEEE 1149.1 JTAG boundary-scan. Required pins are TCK (Test Clock), TMS (Test Mode Select), TDI (Test Data In), TDO (Test Data Out), and TRST (Test Reset). These signals are dedicated and do not share functionality with memory I/O or control pins-enabling robust in-system testability without compromising memory operation.
What is the function of the REPEATL and REPEATR signals in the 70V3599S166BC?
REPEATL and REPEATR are asynchronous control inputs that reset the internal address counter to the last valid address loaded via ADSL or ADSR, respectively. When asserted, they cause the counter to repeat the most recently latched address-enabling efficient circular buffer or ping-pong memory access patterns without software intervention or external address generation logic.
Can the 70V3599S166BC be used in depth-expanded configurations, and how is this implemented?
Yes, the 70V3599S166BC supports depth expansion using its dual chip enables (CE0X and CE1X per port). By tying CE0 of one device to CE1 of the next and decoding higher-order address bits externally, designers can stack multiple devices to increase memory depth without adding glue logic. The datasheet confirms this capability is inherent to the device architecture and requires no special configuration.
70V3599S166BC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.6 ns
- Voltage - Supply:
- 3.15V ~ 3.45V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-CABGA (17x17)
70V3599S166BC FAQ
1.How can I place an order for 70V3599S166BC through Aetrix?
Please submit a Request for Quotation (RFQ) for 70V3599S166BC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70V3599S166BC reliable?
The price and inventory of 70V3599S166BC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V3599S166BC is usually 5 days.
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Once your 70V3599S166BC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70V3599S166BC?
For technical support, including 70V3599S166BC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V3599S166BC requirements.
6.How does Aetrix verify that 70V3599S166BC is sourced from the original manufacturer or authorized distributors?
All 70V3599S166BC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V3599S166BC meets industry standards.
7.What is the process for return or replacement of 70V3599S166BC?
All 70V3599S166BC units undergo pre-shipment inspection (PSI). If there is an issue with 70V3599S166BC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70V3599S166BC part is unused and in its original packaging.
Return procedure for 70V3599S166BC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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