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Renesas 70V3599S166BF

Part No.:
70V3599S166BF
Manufacturer:
Renesas
Category:
Memory
Package:
208-LFBGA
Datasheet:
Aetrix70V3599S166BF.pdf
Description:
IC SRAM 4.5MBIT PAR 208CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,692

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Product details

Overview

70V3599S166BF from IDT (now Renesas) is a high-speed 128K × 36-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location from independent left and right ports. It operates at 166MHz with 3.6ns clock-to-data-out (pipelined), supports selectable 3.3V or 2.5V I/O interfaces per port, and delivers 12Gbps aggregate bandwidth. It is used in real-time packet buffering for telecom line cards and FPGA co-processor memory subsystems.

For engineers reviewing the 70V3599S166BF datasheet, 70V3599S166BF pinout, 70V3599S166BF application, or 70V3599S166BF equivalent, this page provides verified timing parameters, validated fpBGA-208 pin mapping, confirmed industrial-grade voltage flexibility (3.3V core / 2.5V or 3.3V I/O), JTAG-compliant test interface support, and direct alternatives for depth-expanded memory designs.

Technical Context

The 70V3599S166BF implements fully synchronous dual-port operation with independent clock domains (CLKL/CLKR), pipelined or flow-through output modes controlled by PL/FTL and PL/FTR pins, and self-timed write cycles enabling minimal cycle time. Its address counter supports ADS-triggered load and REPEAT-driven auto-increment, with CNTEN enabling burst address generation without external logic.

All control, data, and address inputs are registered-providing 1.7ns setup and 0.5ns hold times at 166MHz-and dual chip enables (CE0/CE1 per port) allow seamless depth expansion. The device integrates JTAG boundary-scan (IEEE 1149.1) with TCK, TMS, TDI, TDO, and TRST pins for production testability.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization128K × 36 bits (4.608 Mbit), true dual-port cell array
Max Clock Frequency166MHz (6ns cycle time, pipelined mode)
Access Time3.6ns clock-to-data-out (tCD2, pipelined, commercial grade)
I/O Voltage SupportSelectable 3.3V ±150mV or 2.5V ±100mV per port via OPTL/OPTR pins
Operating TemperatureCommercial: 0°C to +70°C (166MHz guaranteed)
Package208-pin fine-pitch Ball Grid Array (fpBGA), 0.8mm ball pitch, 15mm × 15mm body
JTAG ComplianceFully IEEE 1149.1-compliant with TCK, TMS, TDI, TDO, TRST signals

Pinout & Package

208-pin fpBGA (package code BF208), 0.8mm ball pitch, 15mm × 15mm × 1.4mm profile. All VDD pins require 3.3V ±150mV; VDDQL/VDDQR must match OPTL/OPTR logic level (3.3V for VIH, 2.5V for VIL).

Pin/Terminal Circuit Role Design Meaning
CLKL / CLKRPort-specific clock inputsSynchronous edge-triggered timing reference for left/right port registers
CE0L/CE1L, CE0R/CE1RDual chip enables per portEnable depth expansion without external logic; double-buffered in pipelined mode
PL/FTL / PL/FTRPipeline/Flow-Through mode selectDC-configurable output latency: pipelined (1-cycle delay) or flow-through (0-cycle delay)
ADSL / ADSRAddress strobe enableLatches external address into internal counter on rising clock edge
CNTENL / CNTENRCounter enableEnables auto-increment of internal address counter on each clock cycle
REPEATL / REPEATRCounter repeat controlResets counter to last ADS-loaded address-enables burst read/write loops
I/O0L–I/O35L, I/O0R–I/O35R36-bit bidirectional data busesIndependent 9-bit byte lanes (BE0–BE3) for partial writes and bus-matching
OPTL / OPTRI/O voltage option selectVIH = 3.3V I/O operation; VIL = 2.5V I/O operation (sets VDDQL/VDDQR requirement)

Key Features

Feature Design Value
True dual-port memory cellsEnables concurrent read/write to identical addresses-critical for lock-free inter-processor communication
Dual-cycle deselect (DCD)Prevents metastability during rapid port disable in pipelined mode by enforcing two-cycle deactivation
Separate byte controls (BE0–BE3)Allows 8-, 16-, or 24-bit writes within 36-bit bus-reduces bus contention and power in partial updates
Self-timed write architectureEliminates need for external write pulse generation; guarantees minimum tCYC2 = 6ns at 166MHz
Asynchronous Output Enable (OEL/OER)Permits dynamic output gating without clock synchronization-essential for shared-bus arbitration
Automatic power-downReduces standby current to 15mA (ISB3) when both CE0/CE1 are high-lowers system-level idle power

Applications

Telecom Packet Buffering FPGA Co-Processor Memory

Use Scenario: Line cards in 10G Ethernet switches buffer ingress/egress packets across CPU and ASIC domains.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-latency, non-blocking FIFO between traffic manager and packet classifier engines.

Use Value: Simultaneous 166MHz reads/writes eliminate arbitration overhead; 3.6ns tCD2 ensures sub-ns timing margin for 10G wire-speed processing.

Use Scenario: High-performance FPGA-based vision processors require low-latency, deterministic memory access for frame buffers and coefficient tables.

IC Role / Device Role / Timing Role: Provides dedicated, conflict-free memory space for FPGA fabric and embedded soft-core processor.

Use Value: Independent 3.3V/2.5V I/O per port matches FPGA bank voltages; pipelined mode delivers predictable 6ns cycle time for real-time DMA bursts.

Industrial Motion Control Avionics Data Acquisition

Use Scenario: CNC controllers synchronize servo loop updates and HMI display refresh using deterministic memory sharing.

IC Role / Device Role / Timing Role: Serves as shared parameter store between real-time DSP and ARM-based UI controller.

Use Value: REPEAT-enabled address looping supports fixed-frame motion profiles; industrial temp range (-40°C to +85°C) ensures reliability in harsh enclosures.

Use Scenario: Flight data recorders capture sensor streams from multiple analog/digital sources with timestamp coherence.

IC Role / Device Role / Timing Role: Acts as synchronized dual-input buffer-left port accepts ADC samples, right port feeds ARINC-429 encoder.

Use Value: Port-to-port delay (tCO = 5ns min) guarantees <10ns skew between sample capture and encoding trigger-meets DO-254 timing closure.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT70V3599S133BFSame fpBGA-208 package and pinout; rated for 133MHz max (7.5ns tCYC2) across industrial temperature range (-40°C to +85°C)Supports full industrial temp operation where 166MHz is not required-lower power (ISB2 = 220mA typ) and higher reliability in extended environmentsSelect when thermal constraints or long-term field deployment demand industrial-grade timing stability over peak speed.
CY7C1362BV33-166AXC3.3V-only I/O (no 2.5V option); 166MHz operation in 208-pin PQFP; lacks JTAG and REPEAT/ADSR featuresTargeted at cost-sensitive, non-JTAG test environments; requires external address counter logic for burst operationsChoose for legacy PCBs using PQFP footprint or where JTAG testability and autonomous address generation are unnecessary.

Compared with IDT70V3599S133BF, the 70V3599S166BF delivers 25% higher bandwidth but sacrifices industrial temperature support; versus CY7C1362BV33-166AXC, it adds voltage-flexible I/O, JTAG, and hardware address automation-reducing FPGA logic utilization and board-level complexity.

Availability

70V3599S166BF is available at Aetrix Electronics and suitable for telecom infrastructure, FPGA-accelerated computing, and industrial motion control systems requiring stable component supply with guaranteed long-term availability.

Supply support for 70V3599S166BF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics (formerly Integrated Device Technology) is a global semiconductor leader specializing in high-performance timing, memory, and embedded solutions for networking, automotive, and industrial markets.

The IDT70V3599 family was designed specifically for deterministic, low-latency memory sharing between heterogeneous processors-targeting applications demanding simultaneous, conflict-free access to shared data structures.

FAQ

What is the maximum guaranteed operating frequency of the 70V3599S166BF?

The 70V3599S166BF is commercially rated for guaranteed operation at 166MHz (6ns clock cycle time) in pipelined output mode. This specification is validated across the full commercial temperature range (0°C to +70°C) and requires proper VDD = 3.3V ±150mV and matched I/O supply (VDDQL/VDDQR = 3.3V or 2.5V per port). Industrial-grade 133MHz operation is supported by the pin-compatible 70V3599S133BF variant.

Does the 70V3599S166BF support mixed-voltage I/O operation between its two ports?

Yes, the 70V3599S166BF supports independent I/O voltage selection per port: OPTL sets left-port I/O voltage (3.3V or 2.5V), and OPTR sets right-port I/O voltage. This allows one port to interface with a 3.3V FPGA bank while the other connects to a 2.5V ASIC-eliminating level-shifters and reducing BOM count. VDDQL and VDDQR must be supplied at the corresponding voltage levels.

How does the REPEAT function work in the 70V3599S166BF, and what is its design benefit?

The REPEATL/REPEATR signal resets the internal address counter to the last valid address loaded via ADSL/ADSR. This enables hardware-accelerated burst transfers-e.g., reading a fixed 64-word block repeatedly without CPU intervention. Unlike software loops, REPEAT operates synchronously with the clock and requires no instruction fetch overhead, making it ideal for real-time DMA engines and motion control waveform replay.

What is the purpose of dual chip enables (CE0/CE1) on each port of the 70V3599S166BF?

Dual chip enables (CE0L/CE1L and CE0R/CE1R) provide flexible depth expansion: CE0X = LOW and CE1X = HIGH enables the port, while CE0X = HIGH and CE1X = LOW places it in power-down mode. This pairing eliminates the need for external decode logic when stacking multiple devices-each additional 70V3599S166BF can be enabled via unique CE0/CE1 combinations, simplifying high-density memory subsystem design.

Is JTAG boundary-scan supported on the 70V3599S166BF, and which pins are used?

Yes, the 70V3599S166BF fully complies with IEEE 1149.1 JTAG boundary-scan. Dedicated pins include TCK (Test Clock), TMS (Test Mode Select), TDI (Test Data In), TDO (Test Data Out), and TRST (Test Reset). These signals are electrically isolated from functional I/O and operate independently of memory operation-enabling in-system test, interconnect verification, and programming of adjacent CPLDs/FPGAs without disrupting SRAM functionality.

70V3599S166BF Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
208-LFBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
4.5Mbit
Memory Organization:
128K x 36
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.6 ns
Voltage - Supply:
3.15V ~ 3.45V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
208-CABGA (15x15)

70V3599S166BF FAQ

1.How can I place an order for 70V3599S166BF through Aetrix?

Please submit a Request for Quotation (RFQ) for 70V3599S166BF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70V3599S166BF reliable?

The price and inventory of 70V3599S166BF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V3599S166BF is usually 5 days.

3.What payment methods are accepted for 70V3599S166BF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70V3599S166BF transactions.

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70V3599S166BF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70V3599S166BF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70V3599S166BF?

For technical support, including 70V3599S166BF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V3599S166BF requirements.

6.How does Aetrix verify that 70V3599S166BF is sourced from the original manufacturer or authorized distributors?

All 70V3599S166BF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V3599S166BF meets industry standards.

7.What is the process for return or replacement of 70V3599S166BF?

All 70V3599S166BF units undergo pre-shipment inspection (PSI). If there is an issue with 70V3599S166BF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70V3599S166BF part is unused and in its original packaging.

Return procedure for 70V3599S166BF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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