Renesas 70V3599S166BF8
- Part No.:
- 70V3599S166BF8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 208-LFBGA
- Datasheet:
-
70V3599S166BF8.pdf
- Description:
- IC SRAM 4.5MBIT PAR 208CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
70V3599S166BF8 from IDT (now Renesas) is a high-speed 128K × 36-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location from independent left and right ports. It operates at 166MHz (6ns cycle time), supports selectable pipelined or flow-through output modes, and delivers 12Gbps aggregate bandwidth. It is used in high-throughput packet buffering, FPGA co-processor interfacing, and real-time digital signal processing systems.
For engineers reviewing the 70V3599S166BF8 datasheet, 70V3599S166BF8 pinout, 70V3599S166BF8 application, or 70V3599S166BF8 equivalent, key selection criteria include its 166MHz pipelined timing (tCD2 ≤ 3.6ns), dual-voltage I/O support (2.5V/3.3V per port), JTAG IEEE 1149.1 compliance, industrial-grade temperature range (–40°C to +85°C), and 208-pin fpBGA package compatibility.
Technical Context
The 70V3599S166BF8 implements fully synchronous operation on both ports with registered address, data, and control inputs-enabling minimal setup (1.7ns) and hold (0.5ns) times at 166MHz. Its dual-chip-enable architecture allows seamless depth expansion without external logic, while separate byte enables (BE0–BE3 per port) support 9-bit granularity for multiplexed bus matching.
It features an integrated address counter with repeat and enable controls (CNTENL/R, REPEATL/R, ADSL/R), supporting burst-mode sequential addressing. The device supports JTAG boundary-scan testing and includes automatic power-down via CE0/CE1 assertion, reducing standby current to 15mA in full CMOS-level standby mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36 bits (4.608 Mbit); supports independent concurrent access on left/right ports |
| Max Clock Frequency | 166MHz (6ns cycle time); enables 12Gbps aggregate bandwidth across both ports |
| Access Time (Pipelined) | 3.6ns clock-to-data-out (tCD2); critical for low-latency inter-processor communication |
| I/O Voltage Options | Selectable 2.5V (±100mV) or 3.3V (±150mV) per port via OPTL/OPTR pins; enables mixed-voltage system integration |
| Operating Temperature | –40°C to +85°C (industrial grade); validated for use in telecom infrastructure and industrial controllers |
| Package | 208-pin fine-pitch BGA (fpBGA); 15mm × 15mm body, 0.8mm ball pitch; RoHS-compliant and green-part qualified |
| JTAG Support | IEEE 1149.1 compliant (TCK, TMS, TDI, TDO, TRST); enables in-system testability and debug visibility |
Pinout & Package
208-pin fine-pitch Ball Grid Array (fpBGA), 15mm × 15mm × 1.4mm, 0.8mm ball pitch. All VDD pins require 3.3V ±150mV; VDDQL/VDDQR must match selected I/O voltage (2.5V or 3.3V) per port as set by OPTL/OPTR.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port-specific clock input | Synchronous edge-triggered timing reference for all registered inputs/outputs on respective port |
| A0L–A16L / A0R–A16R | Address inputs | 17-bit address bus per port; A16 is no-connect for 64K variants but functional for 128K configuration |
| I/O0L–I/O35L / I/O0R–I/O35R | Bidirectional data I/O | 36-bit parallel data path per port; supports independent read/write operations simultaneously |
| CE0L/CE1L / CE0R/CE1R | Dual chip enables | Enable/disable port independently; dual CE architecture enables depth expansion without glue logic |
| R/WL / R/WR | Read/write direction control | Active-high write enable; determines data flow direction per port on each clock cycle |
| OEL / OER | Output enable | Asynchronous control; places I/O pins in high-impedance state regardless of clock or CE status |
| BE0L–BE3L / BE0R–BE3R | Byte enable signals | Four 9-bit byte enables per port; allows granular 9-bit writes to any subset of the 36-bit word |
| PL/FTL / PL/FTR | Pipeline/flow-through mode select | DC-level control (VIH = pipelined, VIL = flow-through); configures output latency and timing model |
| ADSL / ADSR | Address strobe | Latches current address into internal counter; enables burst-mode sequential addressing without external increment logic |
| CNTENL / CNTENR | Counter enable | Enables automatic address increment on rising clock edge when ADS is inactive; supports streaming access |
| REPEATL / REPEATR | Counter repeat | Resets address counter to last valid ADS-loaded address; enables circular buffer or ping-pong operation |
| OPTL / OPTR | I/O voltage option select | VIH = 3.3V I/O mode, VIL = 2.5V I/O mode; sets required VDDQL/VDDQR supply voltage |
| TCK, TMS, TDI, TDO, TRST | JTAG boundary-scan interface | Full IEEE 1149.1 test access port; enables production test, in-system verification, and debug trace |
Key Features
| Feature | Design Value |
|---|---|
| True dual-port memory cells | Enables simultaneous read and write to identical addresses on left/right ports-eliminates arbitration logic in shared-memory interconnects |
| Selectable pipelined or flow-through output | Configurable latency: pipelined mode delivers 3.6ns tCD2 for deterministic timing; flow-through offers zero-cycle output delay for latency-sensitive applications |
| Dual chip enables (CE0/CE1) | Allows seamless depth expansion (e.g., 256K×36) using multiple devices without external decode logic or address gating |
| Separate 9-bit byte enables (BE0–BE3) | Supports partial-word writes to any 9-bit segment-critical for protocol header updates and aligned data structure manipulation |
| Integrated address counter with repeat | Reduces FPGA or processor overhead: ADS loads base address, CNTEN enables auto-increment, REPEAT enables circular buffer wrap without software intervention |
| Independent per-port I/O voltage selection | Permits direct interfacing with 2.5V FPGAs and 3.3V microcontrollers on opposite ports-avoids level-shifter components and PCB routing complexity |
Applications
| Telecom Packet Buffering | FPGA Co-Processor Interface |
|---|---|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in line cards with strict latency budgets. IC Role / Device Role / Timing Role: Dual-port SRAM acts as a non-blocking first-in-first-out (FIFO) buffer between ingress and egress traffic managers. Use Value: Simultaneous read/write at 166MHz enables full wire-speed buffering for 10Gbps+ interfaces without packet loss or jitter accumulation. | Use Scenario: High-bandwidth data exchange between a Xilinx Kintex FPGA and an ARM-based application processor in radar signal processing. IC Role / Device Role / Timing Role: Acts as a shared memory conduit with independent clock domains-one port synchronized to FPGA fabric clock, the other to processor AXI clock. Use Value: Eliminates need for asynchronous FIFOs or complex clock-domain crossing logic; 36-bit width matches common DSP word sizes and reduces transaction count. |
| Industrial Motion Controller | Real-Time Digital Audio Router |
Use Scenario: Storing interpolated motion profiles and sensor feedback data in CNC machines requiring deterministic sub-microsecond response. IC Role / Device Role / Timing Role: Serves as dual-access scratchpad memory for real-time trajectory generation and closed-loop servo update cycles. Use Value: Pipelined 3.6ns tCD2 ensures position command updates propagate within one 166MHz cycle-meeting <1µs jitter requirements for 10kHz servo loops. | Use Scenario: Routing 32-channel, 24-bit, 192kHz digital audio streams between AES67 endpoints and DSP engines in broadcast mixing consoles. IC Role / Device Role / Timing Role: Functions as a low-latency, multi-port audio sample buffer with independent read/write pointers per channel group. Use Value: Per-port 2.5V/3.3V I/O support allows direct connection to 2.5V audio ADCs/DACs and 3.3V control processors-reducing BOM cost and board area. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-166AXC | 128K × 36, 166MHz, 3.3V core/I/O, 208-pin PQFP; lacks per-port I/O voltage selection and JTAG | Requires external level shifters for mixed-voltage systems; no boundary-scan support limits test coverage in dense PCBs | Choose when PQFP package is preferred for reworkability and thermal management is less constrained |
| AS7C33128A-166BIN | 128K × 36, 166MHz, 3.3V only, 256-pin BGA; no pipelined/flow-through mode select or address counter features | Fixed flow-through timing only; no hardware address sequencing-requires host processor to manage burst addressing | Choose when JTAG and advanced counter features are unnecessary and larger BGA footprint is acceptable |
Compared with CY7C1362BV33-166AXC and AS7C33128A-166BIN, the 70V3599S166BF8 uniquely combines per-port I/O voltage flexibility, hardware address counter with repeat, and IEEE 1149.1 JTAG-making it optimal for space-constrained, mixed-voltage, test-critical embedded systems where deterministic latency and debug visibility are mandatory.
Availability
70V3599S166BF8 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, and broadcast audio equipment requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.
Supply support for 70V3599S166BF8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics (formerly Integrated Device Technology, IDT) is a global semiconductor leader specializing in high-performance memory, timing, and connectivity solutions for communications, computing, and industrial markets.
The 70V3599S166BF8 belongs to IDT's high-speed synchronous dual-port SRAM product line, designed specifically for deterministic, low-latency, multi-processor shared-memory architectures in real-time embedded systems.
FAQ
What is the maximum operating frequency and corresponding access time for the 70V3599S166BF8?
The 70V3599S166BF8 supports a maximum clock frequency of 166MHz with a 6ns clock cycle time. In pipelined output mode, its clock-to-data-valid time (tCD2) is guaranteed at ≤3.6ns. This timing is specified for commercial temperature range operation and is validated under VDD = 3.3V ±150mV and appropriate VDDQ conditions.
Does the 70V3599S166BF8 support independent I/O voltage levels on left and right ports?
Yes, the 70V3599S166BF8 supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL to VIH (3.3V) configures the left port for 3.3V I/O operation with VDDQL = 3.3V ±150mV; setting it to VIL (0V) configures 2.5V operation with VDDQL = 2.5V ±100mV. The right port is controlled identically by OPTR and VDDQR.
How does the address counter feature work in the 70V3599S166BF8?
The 70V3599S166BF8 includes dedicated address counter logic per port, controlled by CNTENL/R, ADSL/R, and REPEATL/R. When CNTEN is asserted, the internal address increments automatically on each rising CLK edge. ADS latches an external address into the counter, and REPEAT resets the counter to that latched address-enabling hardware-managed circular buffers or burst transfers without host CPU involvement.
What package type and dimensions does the 70V3599S166BF8 use?
The 70V3599S166BF8 is packaged in a 208-pin fine-pitch Ball Grid Array (fpBGA) with a 15mm × 15mm body and 0.8mm ball pitch. The package height is 1.4mm. It is RoHS-compliant and qualifies as a "green part" per IDT's environmental specifications.
Is JTAG boundary-scan supported on the 70V3599S166BF8, and which signals are used?
Yes, the 70V3599S166BF8 fully supports IEEE 1149.1 JTAG boundary-scan. The required signals are TCK (Test Clock), TMS (Test Mode Select), TDI (Test Data In), TDO (Test Data Out), and TRST (Test Reset). These pins are dedicated and electrically isolated from functional I/O, enabling in-system testability without impacting normal memory operation.
70V3599S166BF8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 208-LFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.6 ns
- Voltage - Supply:
- 3.15V ~ 3.45V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 208-CABGA (15x15)
70V3599S166BF8 FAQ
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7.What is the process for return or replacement of 70V3599S166BF8?
All 70V3599S166BF8 units undergo pre-shipment inspection (PSI). If there is an issue with 70V3599S166BF8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70V3599S166BF8 part is unused and in its original packaging.
Return procedure for 70V3599S166BF8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
70V3599S166BF8 Tags

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