Renesas 70V3599S166BFG
- Part No.:
- 70V3599S166BFG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 208-LFBGA
- Datasheet:
-
70V3599S166BFG.pdf
- Description:
- IC SRAM 4.5MBIT PAR 208CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
70V3599S166BFG from IDT (now Renesas) is a high-speed 128K × 36-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location from independent left and right ports. It operates at 166MHz (6ns cycle time), delivers 12Gbps aggregate bandwidth, supports selectable pipelined or flow-through output modes, and targets high-throughput packet buffering in telecom line cards.
For engineers reviewing the 70V3599S166BFG datasheet, 70V3599S166BFG pinout, 70V3599S166BFG application, or 70V3599S166BFG equivalent, key selection criteria include its 166MHz pipelined timing (3.6ns tCD2), dual 3.3V/2.5V I/O voltage support per port via OPT pins, JTAG IEEE 1149.1 compliance, and industrial-grade thermal range capability at 133MHz.
Technical Context
This device implements fully synchronous operation on both ports with registered address, data, byte enable, and control inputs-enabling minimal setup/hold times (1.7ns tSA, 0.5ns tHA @ 166MHz). Its internal counter logic supports address auto-increment and repeat functions triggered by ADS and REPEAT signals, eliminating external address generation in burst-access applications.
The memory core uses true dual-port static cells with self-timed write control, while separate VDDQ supplies and OPT pins allow independent 3.3V or 2.5V I/O interface levels on each port. Dual chip enables (CE0/CE1 per port) support seamless depth expansion without external logic, and Dual Cycle Deselect (DCD) ensures clean pipelined output deactivation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36 bits (4.608 Mbit); supports 128K-word addressing per port |
| Max Clock Frequency | 166MHz (6ns cycle time) for commercial grade; 133MHz (7.5ns) for industrial grade |
| tCD2 (Clock to Data) | 3.6ns max in pipelined mode - enables tight timing closure in high-speed FPGA interfaces |
| I/O Voltage Support | Selectable 3.3V (±150mV) or 2.5V (±100mV) per port via OPTL/OPTR pins |
| Operating Temperature | Commercial: 0°C to +70°C; Industrial: –40°C to +85°C (at 133MHz) |
| Package | 208-pin fine-pitch BGA (BFG208); 17mm × 17mm body, 1.0mm ball pitch |
| JTAG Compliance | Fully compliant with IEEE 1149.1 boundary-scan for test and debug |
Pinout & Package
208-pin fine-pitch Ball Grid Array (fpBGA), package code BFG208. Body size: 17mm × 17mm × 1.4mm, 1.0mm ball pitch. All VDD pins require 3.3V supply; VDDQ pins must match OPT pin logic level (3.3V if OPT = VIH, 2.5V if OPT = VIL).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port clock input | Synchronous edge-triggered timing reference for all registered inputs/outputs on respective port |
| A0L–A16L / A0R–A16R | Address inputs | 17-bit address bus per port; A16 is no-connect for 64K variants but functional for 128K |
| I/O0L–I/O35L / I/O0R–I/O35R | Bidirectional data I/O | 36-bit data bus per port; supports byte-wise read/write via BE0–BE3 (9-bit bytes) |
| CE0L/CE1L / CE0R/CE1R | Chip enable pair | Dual enables allow depth expansion without glue logic; CE0=VIL & CE1=VIH activates port |
| R/WL / R/WR | Read/write direction control | Active-high write enable; synchronous with CLK edge; determines data flow direction per access |
| OEL / OER | Output enable | Asynchronous control - overrides clocked outputs to high-Z state immediately |
| PL/FTL / PL/FTR | Pipeline/flow-through mode select | DC-level input selecting output latency: pipelined (1-cycle delay) or flow-through (0-cycle delay) |
| ADSL / ADSR | Address strobe | Latches current address into internal counter; enables auto-increment and REPEAT functionality |
| CNTENL / CNTENR | Counter enable | Enables address counter increment on rising CLK when ADS is inactive |
| REPEATL / REPEATR | Counter repeat control | Resets counter to last valid ADS-loaded address - critical for circular buffer implementations |
| OPTL / OPTR | I/O voltage option | Selects 3.3V or 2.5V interface level per port; sets required VDDQ supply voltage |
| VDD, VDDQL, VDDQR, VSS | Power and ground | VDD = 3.3V core supply; VDDQX = I/O supply tied to OPTX logic level; all VSS pins must be grounded |
| TCK, TMS, TDI, TDO, TRST | JTAG test interface | IEEE 1149.1-compliant boundary-scan chain for production test and system debug |
Key Features
| Feature | Design Value |
|---|---|
| True dual-port memory cells | Enables concurrent read/write to identical addresses - essential for real-time inter-processor communication and ping-pong buffering |
| Selectable pipelined or flow-through output | Reduces system latency variability: pipelined mode gives deterministic 1-cycle delay; flow-through eliminates delay for timing-critical paths |
| Dual chip enables per port | Supports seamless memory depth expansion across multiple devices without external decode logic or address gating |
| Independent 3.3V/2.5V I/O per port | Allows interfacing with mixed-voltage systems - e.g., 3.3V FPGA fabric and 2.5V ASIC logic - without level shifters |
| Counter enable and repeat functions | Eliminates need for external address generators in FIFO, circular buffer, or burst-transfer applications |
| JTAG IEEE 1149.1 compliance | Enables in-system testability, boundary-scan diagnostics, and programmable configuration during manufacturing and field service |
Applications
| Telecom Line Card Buffering | Network Packet Switching |
|---|---|
Use Scenario: Storing incoming/outgoing ATM or Ethernet frames in carrier-grade line cards requiring zero-latency inter-port access. IC Role / Device Role / Timing Role: Dual-port SRAM acts as shared frame buffer between ingress and egress processing engines, synchronized via independent clocks. Use Value: Simultaneous access enables real-time frame forwarding without arbitration delay; 166MHz operation sustains >10Gbps line-rate throughput. | Use Scenario: Implementing cut-through switching buffers in multi-layer switches where packets arrive and depart at different rates. IC Role / Device Role / Timing Role: Provides non-blocking memory resource for parallel packet classification and forwarding lookups across multiple pipeline stages. Use Value: Pipelined output mode ensures predictable 3.6ns data-to-clock timing, simplifying timing closure with high-speed SerDes PHYs. |
| Real-Time Signal Processing | FPGA Co-Processing Interface |
Use Scenario: Supporting ping-pong buffering between ADC/DAC interfaces and DSP cores in radar or medical imaging systems. IC Role / Device Role / Timing Role: Acts as low-latency, deterministic memory bridge between analog front-end and digital signal processor. Use Value: Flow-through output mode eliminates pipeline delay, enabling sub-10ns round-trip latency for time-critical feedback loops. | Use Scenario: Serving as high-bandwidth scratchpad memory between FPGA fabric and external microcontroller or host CPU. IC Role / Device Role / Timing Role: Provides asynchronous, dual-clock domain bridging with independent address/data buses per side. Use Value: Dual 3.3V/2.5V I/O support allows direct connection to 2.5V FPGA I/O banks and 3.3V ARM processor buses without level translation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-166AXC | 128K × 36, 166MHz, 3.3V-only I/O, 208-pin TQFP package | Lacks dual-voltage I/O and JTAG; requires external level shifters for mixed-voltage systems | Choose when board space permits TQFP and system uses uniform 3.3V logic only |
| AS7C3256B-166JCIN | 128K × 32, 166MHz, 3.3V core/I/O, 100-pin TQFP | 32-bit width (vs. 36-bit), no OPT-selectable I/O voltage, no JTAG, smaller footprint | Choose for cost-sensitive designs where 4-bit width reduction is acceptable and JTAG is not required |
Compared with CY7C1362BV33-166AXC and AS7C3256B-166JCIN, the 70V3599S166BFG uniquely supports per-port 3.3V/2.5V I/O selection and IEEE 1149.1 JTAG, making it optimal for heterogeneous voltage systems and production-test-critical applications - while maintaining identical 166MHz performance and 128K×36 density.
Availability
70V3599S166BFG is available at Aetrix Electronics and suitable for telecom infrastructure, network switching, real-time signal processing, and FPGA co-processing applications requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.
Supply support for 70V3599S166BFG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics (formerly Integrated Device Technology, IDT) is a global semiconductor leader specializing in high-performance memory, timing, and connectivity solutions for communications, computing, and industrial markets.
The IDT70V3599 family was designed specifically for high-bandwidth, low-latency dual-port buffering in telecom line cards and packet-switching systems - emphasizing simultaneous access, flexible voltage interfaces, and robust testability.
FAQ
What is the maximum operating frequency of the 70V3599S166BFG in pipelined mode?
The 70V3599S166BFG supports up to 166MHz operation in pipelined mode, achieving a 6ns clock cycle time and 3.6ns maximum clock-to-data (tCD2) delay. This rating applies to the commercial temperature grade (0°C to +70°C); the industrial grade is rated for 133MHz (7.5ns cycle time) over –40°C to +85°C.
How does the 70V3599S166BFG support mixed-voltage system interfaces?
The 70V3599S166BFG supports independent 3.3V or 2.5V I/O voltage levels on each port via dedicated OPTL and OPTR pins. When OPTX is set to VIH (3.3V), the corresponding port's I/Os operate at 3.3V levels and require VDDQX = 3.3V; when OPTX = VIL (0V), the port operates at 2.5V levels with VDDQX = 2.5V - enabling direct interfacing with heterogeneous logic families without external level shifters.
Does the 70V3599S166BFG include built-in test features?
Yes, the 70V3599S166BFG integrates full IEEE 1149.1 JTAG boundary-scan functionality with TCK, TMS, TDI, TDO, and TRST pins. This enables in-system testability, interconnect verification, and programmable configuration - critical for high-reliability telecom and industrial applications requiring production test coverage and field diagnostics.
What memory organization does the 70V3599S166BFG implement, and how is address width determined?
The 70V3599S166BFG implements a 128K × 36-bit organization (4.608 Mbit total), requiring 17 address bits (A0–A16) per port. A16 is functional for 128K addressing; it is a no-connect only in the 64K variant (IDT70V3589). The device supports both 128K and 64K configurations via part number differentiation, not pin strapping.
Can the 70V3599S166BFG be used for circular buffer applications without external address logic?
Yes, the 70V3599S166BFG includes integrated address counter logic with CNTEN and REPEAT controls. When CNTEN is asserted, the internal counter auto-increments on each clock; REPEAT resets the counter to the last valid address loaded via ADS - enabling hardware-accelerated circular buffers, FIFOs, and burst transfers without external address generators or microcontroller intervention.
70V3599S166BFG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 208-LFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.6 ns
- Voltage - Supply:
- 3.15V ~ 3.45V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 208-CABGA (15x15)
70V3599S166BFG FAQ
1.How can I place an order for 70V3599S166BFG through Aetrix?
Please submit a Request for Quotation (RFQ) for 70V3599S166BFG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of 70V3599S166BFG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V3599S166BFG is usually 5 days.
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6.How does Aetrix verify that 70V3599S166BFG is sourced from the original manufacturer or authorized distributors?
All 70V3599S166BFG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V3599S166BFG meets industry standards.
7.What is the process for return or replacement of 70V3599S166BFG?
All 70V3599S166BFG units undergo pre-shipment inspection (PSI). If there is an issue with 70V3599S166BFG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70V3599S166BFG part is unused and in its original packaging.
Return procedure for 70V3599S166BFG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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