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Renesas 70V657S10BC8

Part No.:
70V657S10BC8
Manufacturer:
Renesas
Category:
Memory
Package:
256-LBGA
Datasheet:
Aetrix70V657S10BC8.pdf
Description:
IC SRAM 1.125MBIT PAR 256CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,409

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Product details

Overview

70V657S10BC8 from IDT is a high-speed 32K × 36 asynchronous dual-port static RAM with fully independent left/right ports, 10 ns max access time (commercial grade), LVTTL-compatible 3.3 V core supply, and selectable 3.3 V/2.5 V I/O voltage per port via OPTL/OPTR pins. It enables simultaneous read/write to the same memory location in real-time control systems requiring deterministic arbitration.

For engineers reviewing the 70V657S10BC8 datasheet, 70V657S10BC8 pinout, 70V657S10BC8 application, or 70V657S10BC8 equivalent, this device supports JTAG IEEE 1149.1 debugging, on-chip semaphore signaling for inter-processor coordination, and Master/Slave cascading for 72-bit+ bus expansion - critical for FPGA co-processing, telecom packet buffering, and industrial motion controller memory subsystems.

Technical Context

The 70V657S10BC8 implements true dual-port SRAM architecture with separate address, control, and bidirectional I/O buses for left (L) and right (R) ports, enabling fully asynchronous concurrent access without external arbitration logic. Its on-chip arbitration logic resolves port contention using BUSY flag assertion and M/S-selectable priority.

It features independent byte-enable controls (BE0–BE3 per port) for 9-bit byte granularity, JTAG boundary-scan support (TMS/TCK/TDI/TDO/TRST), and hardware semaphore registers accessible via A0–A2 addressing. Address pins A15L/A16L and A15R/A16R are no-connects, confirming its 32K × 36 density (A0–A14 = 15 address bits → 32,768 words).

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 32K × 36 bits (1.152 Mbit); supports 32,768 independent 36-bit word accesses per port
Access Time (tAA) 10 ns max (commercial grade); guarantees sub-10 ns data valid after address stable - critical for 100 MHz+ system clocks
Supply Voltages VDD = 3.3 V ± 150 mV (core); VDDQL/VDDQR = 3.3 V ± 150 mV or 2.5 V ± 100 mV (I/O); enables mixed-voltage system interfacing
Operating Temperature 0°C to +70°C (commercial); validated for stable operation across full range without derating
Package 208-pin Plastic Quad Flatpack (PQFP); 28 mm × 28 mm body, 0.5 mm lead pitch - compatible with standard SMT reflow profiles
Interface Standard LVTTL-compatible signaling; VIH = 2.0 V min (3.3 V mode), VIL = 0.8 V max - ensures interoperability with FPGA I/O banks and ASIC GPIOs
Special Functions On-chip semaphore logic (8 flags), BUSY/INT flags, Master/Slave select (M/S), and JTAG IEEE 1149.1 compliance - eliminates need for discrete arbitration ICs

Pinout & Package

208-pin PQFP package (IDT DR208/DRG208 footprint); 28 mm × 28 mm × 3.5 mm body; lead pitch 0.5 mm; RoHS-compliant green variant available.

Pin/Terminal Circuit Role Design Meaning
A0L–A14L Left Port Address Inputs 15-bit address bus for left port; A15L/A16L are NC - confirms 32K depth (2¹⁵ = 32,768)
A0R–A14R Right Port Address Inputs Independent 15-bit address bus for right port; A15R/A16R are NC - enables true dual-port independence
I/O0L–I/O35L Left Port Bidirectional Data 36-bit data bus; BE0L–BE3L enable 9-bit byte writes - supports partial-word updates without read-modify-write
I/O0R–I/O35R Right Port Bidirectional Data 36-bit data bus; BE0R–BE3R enable per-byte control - essential for heterogeneous processor interfacing
CE0L/CE1L, CE0R/CE1R Chip Enable Inputs (Dual CE per port) Dual CE allows depth expansion without glue logic; CE0X = VIL & CE1X = VIH enables port X
R/WL/R/WR Read/Write Control Active-low write enable; determines direction of data flow on I/OX buses during access cycles
OEL/OER Output Enable Controls tri-state of I/OX drivers; required for read operations and bus sharing
BE0L–BE3L / BE0R–BE3R Byte Enable Inputs Four independent enables for 9-bit bytes (I/O0–8, 9–17, 18–26, 27–35); enables fine-grained memory updates
SEML/SEMR Semaphore Enable Activates semaphore register access (A0–A2) instead of memory array - used for inter-processor synchronization
BUSYL/BUSYR Busy Flag Output when M/S = VIH (Master); input when M/S = VIL (Slave); asserts during port contention to block conflicting writes
INTL/INTR Interrupt Flag Push-pull output indicating semaphore flag change or arbitration event - triggers CPU interrupt without polling
M/S Master/Slave Select VIH = Master (BUSY output), VIL = Slave (BUSY input); configures arbitration priority in cascaded systems
OPTL/OPTR I/O Voltage Select VIH = 3.3 V I/O mode (VDDQX = 3.3 V), VIL = 2.5 V I/O mode (VDDQX = 2.5 V) - enables mixed-voltage board design
VDD, VDDQL, VDDQR Power Supplies VDD = 3.3 V core; VDDQL/VDDQR = I/O supply (3.3 V or 2.5 V); requires separate decoupling per supply domain
VSS Ground Multiple dedicated ground pins distributed across package - minimizes ground bounce in high-speed dual-port operation
TMS/TCK/TDI/TDO/TRST JTAG Test Interface Fully compliant with IEEE 1149.1; supports boundary-scan testing and in-system programming verification

Key Features

Feature Design Value
True Dual-Port Architecture Simultaneous independent read/write to identical memory locations - eliminates software locks and enables real-time data exchange between processors
Hardware Semaphore Logic Eight dedicated flags accessible via A0–A2; resolved in hardware with no CPU intervention - reduces inter-processor latency to <5 ns
Configurable I/O Voltage Per-port 3.3 V/2.5 V selection via OPTL/OPTR - allows direct interface to both legacy 3.3 V FPGAs and modern 2.5 V ASICs without level shifters
Master/Slave Cascading Supports >72-bit data buses using M/S pin and BUSY chaining - enables scalable memory subsystems without external arbitration logic
Low-Power Standby Modes ISB3 = 3 mA typical (full standby, CMOS inputs); ISB1 = 115 mA typical (both ports idle, TTL inputs) - optimizes power in burst-mode systems
JTAG Boundary-Scan Support IEEE 1149.1 compliant TAP controller - enables automated PCB test coverage for high-density routing and solder joint validation

Applications

Industrial Motion Controller Telecom Packet Buffer

Use Scenario: Real-time servo loop execution where FPGA handles PWM generation while ARM processor manages trajectory planning.

IC Role / Device Role / Timing Role: Dual-port RAM serves as shared memory buffer between FPGA (left port) and ARM (right port), synchronized via hardware semaphores.

Use Value: Eliminates CPU polling and software mutexes; enables deterministic <10 ns inter-processor handshaking for sub-microsecond motion update cycles.

Use Scenario: Line card in 10G Ethernet switch storing ingress/egress packet headers and metadata before ASIC forwarding decisions.

IC Role / Device Role / Timing Role: Left port accepts packet descriptors from network PHY; right port feeds descriptors to traffic manager ASIC - both at line rate.

Use Value: 10 ns access time sustains 100 Mword/s throughput per port; byte enables allow header-only writes without disturbing payload buffers.

FPGA Co-Processing Accelerator Avionics Display Generator

Use Scenario: Heterogeneous compute platform where FPGA accelerates image filtering while host CPU manages UI rendering and sensor fusion.

IC Role / Device Role / Timing Role: 70V657S10BC8 acts as zero-copy frame buffer - FPGA writes processed frames (left port), CPU reads for display (right port).

Use Value: Simultaneous access avoids DMA bottlenecks; 36-bit width matches common pixel formats (e.g., RGB888 + alpha), reducing memory bandwidth waste.

Use Scenario: Safety-critical cockpit display system requiring guaranteed response time for flight parameter overlays on video streams.

IC Role / Device Role / Timing Role: Left port receives graphics primitives from safety MCU; right port supplies pixel data to timing controller - with BUSY arbitration preventing visual artifacts.

Use Value: Hardware BUSY flag blocks unsafe concurrent writes during overlay updates; 0°C to +70°C rating meets DO-160E environmental requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1362BV33-10ZXC 32K × 36, 10 ns, 3.3 V only (no 2.5 V I/O option), 256-ball BGA package Lacks per-port I/O voltage selection and Master/Slave cascading logic; requires external arbitration for multi-device systems Select when BGA footprint and pure 3.3 V interface are preferred over PQFP and mixed-voltage flexibility
AS7C33256B-10TIN 32K × 36, 10 ns, 3.3 V core/I/O, 208-pin TQFP, no JTAG or semaphore logic No hardware semaphore or BUSY arbitration; relies on software protocols or external logic for inter-processor sync Select for cost-sensitive designs where arbitration is handled in firmware and JTAG test is not required

Compared with CY7C1362BV33-10ZXC and AS7C33256B-10TIN, the 70V657S10BC8 uniquely integrates per-port voltage selection, hardware semaphore registers, and Master/Slave arbitration - reducing BOM count and improving determinism in tightly coupled multiprocessor systems.

Availability

70V657S10BC8 is available at Aetrix Electronics and suitable for industrial motion controllers, telecom line cards, FPGA co-processing accelerators, and avionics display generators requiring stable component supply across extended product lifecycles.

Supply support for 70V657S10BC8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology) is a fabless semiconductor company specializing in timing, memory interface, and RF solutions, now part of Renesas Electronics since 2019.

The IDT70V657 family targets high-reliability, low-latency memory subsystems in real-time embedded systems - designed specifically for deterministic inter-processor communication in motion control, networking, and aerospace applications.

FAQ

What is the memory organization and total capacity of the 70V657S10BC8?

The 70V657S10BC8 is organized as 32K × 36 bits, providing 1.152 Mbit of true dual-port SRAM. With 15 address lines (A0–A14) per port and A15/A16 designated as no-connects, it delivers 32,768 independent 36-bit word locations accessible simultaneously from left and right ports - ideal for real-time data exchange between heterogeneous processors.

Does the 70V657S10BC8 support mixed-voltage operation between its two ports?

Yes, the 70V657S10BC8 supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL = VIH configures the left port for 3.3 V I/O levels (with VDDQL = 3.3 V), while OPTR = VIL configures the right port for 2.5 V I/O (with VDDQR = 2.5 V). This enables direct interfacing with both 3.3 V FPGAs and 2.5 V ASICs on the same board without level shifters.

How does hardware semaphore functionality work on the 70V657S10BC8?

The 70V657S10BC8 integrates eight dedicated semaphore flags accessible via A0–A2 addressing when SEMX = VIL and CEX = VIH. Each flag can be written by one port and read by both, enabling lock-free inter-processor synchronization. The on-chip logic ensures atomic read-modify-write operations with tSOP ≤ 4 ns (10 ns version), eliminating race conditions without CPU intervention.

What package type and dimensions does the 70V657S10BC8 use?

The 70V657S10BC8 is packaged in a 208-pin Plastic Quad Flatpack (PQFP) per IDT's DR208/DRG208 specification. The package measures 28 mm × 28 mm × 3.5 mm with 0.5 mm lead pitch. It is RoHS-compliant and available in green (halogen-free) variant - compatible with standard Type II reflow profiles and automated optical inspection.

Can the 70V657S10BC8 be used in Master/Slave configurations for wider data buses?

Yes, the 70V657S10BC8 supports Master/Slave cascading via the M/S pin and BUSY signal chaining. When configured as Master (M/S = VIH), BUSYX asserts as an output during contention; as Slave (M/S = VIL), BUSYX functions as an input. This allows multiple 70V657S10BC8 devices to be combined into 72-bit or wider memory systems without external logic - maintaining full-speed operation and error-free arbitration.

70V657S10BC8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
256-LBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Asynchronous
Memory Size:
1.125Mbit
Memory Organization:
32K x 36
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10ns
Access Time:
10 ns
Voltage - Supply:
3.15V ~ 3.45V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
256-CABGA (17x17)

70V657S10BC8 FAQ

1.How can I place an order for 70V657S10BC8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 70V657S10BC8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70V657S10BC8 reliable?

The price and inventory of 70V657S10BC8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V657S10BC8 is usually 5 days.

3.What payment methods are accepted for 70V657S10BC8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70V657S10BC8 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70V657S10BC8?

70V657S10BC8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70V657S10BC8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70V657S10BC8?

For technical support, including 70V657S10BC8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V657S10BC8 requirements.

6.How does Aetrix verify that 70V657S10BC8 is sourced from the original manufacturer or authorized distributors?

All 70V657S10BC8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V657S10BC8 meets industry standards.

7.What is the process for return or replacement of 70V657S10BC8?

All 70V657S10BC8 units undergo pre-shipment inspection (PSI). If there is an issue with 70V657S10BC8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70V657S10BC8 part is unused and in its original packaging.

Return procedure for 70V657S10BC8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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