Renesas 70V7319S133BC

Overview

70V7319S133BC from Integrated Device Technology is a 256K × 18 (4 Mbit) synchronous bank-switchable dual-ported SRAM with independent left/right ports, 133 MHz operation (7.5 ns cycle time), industrial temperature support (–40°C to +85°C), and selectable 3.3V/2.5V I/O interface per port. It enables high-bandwidth data buffering in telecom line cards and packet switching engines where concurrent read/write access across isolated memory banks is required.

For engineers reviewing the 70V7319S133BC datasheet, 70V7319S133BC pinout, 70V7319S133BC application, or 70V7319S133BC equivalent, key selection criteria include bank-switchable arbitration, pipelined/flow-through output mode selection, JTAG IEEE 1149.1 compliance, dual chip enable for depth expansion, and independent VDDQ/OPT control per port.

Technical Context

The 70V7319S133BC implements a true SRAM core organized into 64 independent 4K × 18 banks, enabling non-conflicting concurrent access when BA0–BA5 of left and right ports differ. Bank selection is fully user-controlled via dedicated bank address pins - not internal arbitration logic - ensuring deterministic latency and eliminating bus contention.

It supports two synchronous output modes: pipelined (3.4 ns clock-to-data at 133 MHz) and flow-through (15 ns clock-to-data), each with distinct timing constraints on tCYC, tCH/tCL, and setup/hold windows. The counter-enable and repeat features allow burst-address generation without external logic, while JTAG boundary-scan supports production testability.

Key Specifications

Pinout & Package

70V7319S133BC is housed in a 256-pin Ball Grid Array (BC256) package with 1.0 mm ball pitch, 17 mm × 17 mm footprint, and 1.4 mm height. Power and ground balls are distributed across the array for low-inductance supply delivery; VDD (3.3V core) and VDDQ (port-selectable I/O) pins are segregated per port.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-ported SRAM applications.

Compared with CY7C1362BV33-133AXC and AS7C3256B-133JCIN, the 70V7319S133BC uniquely delivers bank-switchable concurrency, per-port I/O voltage flexibility, and IEEE 1149.1 JTAG - making it optimal for high-performance, mixed-voltage, test-critical systems where deterministic latency and expandability are mandatory.

Availability

70V7319S133BC is available at Aetrix Electronics and suitable for telecom infrastructure, network switching, industrial control, and medical imaging applications requiring stable component supply, long-term lifecycle assurance, and industrial-grade thermal performance.

Supply support for 70V7319S133BC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory interface, and RF solutions for communications and computing markets.

The 70V7319S product line was designed specifically for high-bandwidth, low-latency dual-access buffering in telecom and networking equipment - emphasizing bank-switchable concurrency, flexible I/O voltage, and JTAG testability.

FAQ

What is the maximum operating frequency of the 70V7319S133BC at industrial temperature?

The 70V7319S133BC is fully specified and guaranteed to operate at 133 MHz (7.5 ns clock cycle time) over the full industrial temperature range of –40°C to +85°C. This speed grade is validated for both commercial and industrial grades, unlike the 166 MHz and 200 MHz variants which are commercial-only or package-restricted.

How does bank-switching work in the 70V7319S133BC, and what happens if both ports access the same bank?

The 70V7319S133BC uses six bank address pins (BA0–BA5) per port to directly select one of 64 independent 4K × 18 memory banks. If both ports assert identical BA0–BA5 values simultaneously, neither access is valid - writes may corrupt data, and reads return invalid output. Designers must ensure BAxL ≠ BAxR in real-time software or hardware arbitration logic.

Can the left and right ports of the 70V7319S133BC operate at different I/O voltages?

Yes. The 70V7319S133BC supports independent I/O voltage selection per port: OPTL sets left-port VDDQL (3.3V or 2.5V), and OPTR sets right-port VDDQR (3.3V or 2.5V). Both ports can run at 3.3V, both at 2.5V, or one at each voltage - enabling direct interfacing with mixed-voltage FPGAs or ASICs without level shifters.

What is the purpose of the CNTEN and REPEAT signals in the 70V7319S133BC?

CNTEN enables automatic address increment on each clock cycle, allowing burst sequential access without external address generation. REPEAT resets the internal counter to the last valid address loaded via ADS - useful for circular buffer restarts or re-reading a known location. Both functions reduce host processor load in streaming data applications.

Does the 70V7319S133BC support JTAG boundary-scan, and which standard does it comply with?

Yes, the 70V7319S133BC integrates full IEEE 1149.1-compliant JTAG boundary-scan logic with TMS, TCK, TDI, TDO, and TRST pins. This enables production testing of solder joints and interconnects, in-system programming verification, and debug visibility without physical probe access - critical for high-density BGA designs.