Renesas 70V7319S133BC8

Overview

70V7319S133BC8 from IDT (Integrated Device Technology) is a high-speed, synchronous, bank-switchable dual-ported SRAM with 256K × 18-bit (4 Mbit) capacity, organized into 64 independent 4K × 18 banks. It supports 133 MHz operation (7.5 ns clock cycle), industrial temperature range (−40°C to +85°C), and dual-voltage I/O (2.5 V or 3.3 V selectable per port). It is used in real-time packet buffering for telecom line cards requiring concurrent read/write access across two independent data paths.

For engineers reviewing the 70V7319S133BC8 datasheet, 70V7319S133BC8 pinout, 70V7319S133BC8 application, or 70V7319S133BC8 equivalent, key selection criteria include bank-switchable arbitration, pipelined/flow-through output mode selection, JTAG IEEE 1149.1 compliance, dual chip-enable depth expansion support, and independent per-port I/O voltage configuration via OPT pins.

Technical Context

The 70V7319S133BC8 implements a true SRAM core with bank-switchable architecture-not traditional dual-port-enabling independent, non-conflicting access to any of 64 banks by left/right ports. Bank selection is controlled directly via BA0–BA5 address lines on each port, with conflict detection preventing simultaneous access to the same bank.

It supports full synchronous operation on both ports with register-controlled inputs (address, data, control), enabling tight timing: 1.5 ns setup / 0.5 ns hold at 200 MHz (derated for 133 MHz), self-timed write, and selectable pipelined (3.4 ns tCD2) or flow-through (15 ns tCD1) output modes. JTAG boundary-scan is implemented per IEEE 1149.1 for testability.

Key Specifications

Pinout & Package

70V7319S133BC8 is packaged in a 256-pin Ball Grid Array (BGA), package code BC256, body size 17 mm × 17 mm × 1.4 mm, 1.0 mm ball pitch. All VDD pins require 3.3 V; VDDQ pins must match OPT pin logic level (2.5 V if OPT = VIL, 3.3 V if OPT = VIH); all VSS pins connect to ground.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-ported SRAM applications.

Compared with CY7C1362BV33-133AXC and AS7C3256B-133JCIN, the 70V7319S133BC8 uniquely delivers bank-switchable arbitration, per-port 2.5/3.3 V I/O flexibility, pipelined/flow-through mode selection, and integrated JTAG-making it optimal for high-reliability, mixed-voltage, real-time embedded systems demanding deterministic dual-port behavior.

Availability

70V7319S133BC8 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, avionics data acquisition, and real-time DSP applications requiring stable component supply, long-term lifecycle support, and guaranteed industrial temperature performance.

Supply support for 70V7319S133BC8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.

The 70V7319S product line targets high-bandwidth, low-latency dual-ported memory applications in telecom line cards, radar systems, and real-time control where concurrent, conflict-free access to shared memory is essential.

FAQ

What is the operating temperature range for the 70V7319S133BC8?

The 70V7319S133BC8 is rated for industrial temperature operation from −40°C to +85°C. This specification is explicitly confirmed for the 133 MHz speed grade in the BC256 package, making it suitable for harsh-environment applications such as base station equipment and factory automation controllers where ambient thermal stability cannot be guaranteed.

Does the 70V7319S133BC8 support both 2.5 V and 3.3 V I/O interfaces simultaneously?

Yes, the 70V7319S133BC8 supports independent I/O voltage selection per port: OPTL sets the left port's I/O voltage (2.5 V or 3.3 V), and OPTR sets the right port's. When OPTL = VIL (0 V), VDDQL must be 2.5 V; when OPTL = VIH (3.3 V), VDDQL must be 3.3 V-and likewise for the right port. This allows mixed-voltage system interfacing without level shifters.

How does bank-switching prevent port contention in the 70V7319S133BC8?

The 70V7319S133BC8 uses BA0–BA5 inputs on each port to select one of 64 banks. If the left and right ports attempt simultaneous access to the same bank (BA0L–BA5L = BA0R–BA5R), both accesses are invalidated and data corruption may occur. The architecture requires software/firmware coordination to ensure distinct bank addresses-eliminating arbitration logic but placing bank management responsibility on the system designer.

What is the difference between pipelined and flow-through output modes in the 70V7319S133BC8?

In pipelined mode (PL/FTL = VIH), output data appears after one clock cycle (tCD2 = 4.2 ns max at 133 MHz); in flow-through mode (PL/FTL = VIL), data appears combinatorially after address/control setup (tCD1 = 15 ns max). Pipelined mode improves throughput in sequential accesses; flow-through avoids pipeline bubbles in irregular or burst-limited patterns-mode selection is per-port and static during operation.

Is JTAG boundary-scan supported on the 70V7319S133BC8, and which standard does it comply with?

Yes, the 70V7319S133BC8 integrates full IEEE 1149.1-compliant JTAG boundary-scan functionality using dedicated pins (TMS, TCK, TDI, TDO, TRST). This enables production testing, in-circuit debugging, and verification of PCB interconnect integrity-critical for high-reliability applications like avionics and medical imaging systems where test access is constrained.