Renesas 70V7319S133BF8

Overview

70V7319S133BF8 from IDT (Integrated Device Technology) is a high-speed, synchronous, bank-switchable dual-ported SRAM with 256K × 18-bit (4 Mbit) capacity, organized into 64 independent 4K × 18 banks. It supports 133 MHz operation (7.5 ns clock cycle), industrial temperature range (−40°C to +85°C), and selectable 3.3 V or 2.5 V I/O interface per port via OPT pins. It is used in real-time packet buffering, FPGA co-processing, and telecom line-card memory subsystems requiring concurrent read/write access across two independent ports.

For engineers reviewing the 70V7319S133BF8 datasheet, 70V7319S133BF8 pinout, 70V7319S133BF8 application, or 70V7319S133BF8 equivalent, key selection criteria include bank-switchable arbitration, pipelined/flow-through output mode selection, dual chip enable for depth expansion, JTAG IEEE 1149.1 compliance, and independent VDDQ voltage control per port.

Technical Context

The 70V7319S133BF8 implements a true SRAM core with bank-switchable architecture-not a traditional dual-port SRAM-enabling independent, non-conflicting access to any of 64 4K×18 banks by left and right ports. Bank selection is controlled directly via six dedicated BA[0–5] pins per port, with conflict detection when both ports target the same bank.

It features fully synchronous operation on both ports, including registered address, data, byte enable, and control inputs. Timing supports 133 MHz (7.5 ns cycle) with 4.2 ns clock-to-data-out in pipelined mode, 1.5 ns setup/0.5 ns hold on all inputs, and self-timed write for minimal cycle time. JTAG boundary-scan is implemented per IEEE 1149.1.

Key Specifications

Pinout & Package

70V7319S133BF8 is housed in a 208-pin fine-pitch Ball Grid Array (fpBGA) package measuring 15 mm × 15 mm × 1.4 mm with 0.8 mm ball pitch. All VDD pins require connection to 3.3 V; VDDQ pins must be supplied at 3.3 V (if OPT = VIH) or 2.5 V (if OPT = VIL) per port; all VSS pins connect to ground.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-ported SRAM applications.

Compared with 70V7319S133BC256, the 70V7319S133BF8 offers smaller footprint and lower cost for 133 MHz industrial designs; versus CY7C1372KV18, it provides flexible voltage I/O and bank arbitration essential for heterogeneous system integration.

Availability

70V7319S133BF8 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, and avionics data acquisition requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for 70V7319S133BF8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology) is a fabless semiconductor company specializing in high-performance timing, memory interface, RF, and sensor solutions, now part of Renesas Electronics.

The 70V7319S product line delivers bank-switchable dual-port SRAMs optimized for real-time systems requiring deterministic, low-latency, concurrent memory access across heterogeneous processors or ASICs.

FAQ

What is the maximum operating frequency of the 70V7319S133BF8?

The 70V7319S133BF8 is rated for 133 MHz operation (7.5 ns clock cycle time) across the full industrial temperature range (−40°C to +85°C). This speed grade is guaranteed for both commercial and industrial grades and applies to both left and right ports independently when configured in pipelined output mode.

Does the 70V7319S133BF8 support mixed-voltage operation between its two ports?

Yes, the 70V7319S133BF8 supports independent I/O voltage selection per port: OPTL sets the left port's VDDQL supply (3.3 V or 2.5 V), and OPTR sets the right port's VDDQR supply. This allows one port to interface with 3.3 V logic while the other connects to 2.5 V peripherals-no level-shifting required.

How does bank switching work in the 70V7319S133BF8?

Bank switching in the 70V7319S133BF8 is controlled by six dedicated BA[0–5] pins per port, selecting one of 64 independent 4K × 18 banks. If both ports attempt simultaneous access to the same bank, neither access is valid and data corruption may occur-so software or hardware arbitration must ensure BA[0–5]L ≠ BA[0–5]R.

What is the purpose of the REPEAT pin in the 70V7319S133BF8?

The REPEAT pin (REPEATL/REPEATR) resets the internal address counter to the last valid address loaded via ADS on that port. It enables burst sequential reads/writes without host CPU intervention-critical for DMA-driven data streaming in telecom and instrumentation applications.

Is JTAG boundary-scan supported on the 70V7319S133BF8?

Yes, the 70V7319S133BF8 implements full IEEE 1149.1 JTAG boundary-scan with dedicated TDI, TDO, TCK, TMS, and TRST pins. This enables production testing, in-system verification, and debug visibility for both ports' I/Os and internal logic paths.