Renesas 70V7319S166BC

Overview

70V7319S166BC from IDT (Integrated Device Technology) is a high-speed, synchronous, bank-switchable dual-ported SRAM with 256K × 18-bit (4 Mbit) capacity, organized into 64 independent 4K × 18 banks. It supports 166 MHz operation (6 ns cycle time), industrial temperature range (–40°C to +85°C), and selectable 3.3 V or 2.5 V I/O interface per port - used in real-time DSP co-processing, packet buffering in telecom line cards, and FPGA-based protocol acceleration where concurrent read/write access across two independent ports is required.

For engineers reviewing the 70V7319S166BC datasheet, 70V7319S166BC pinout, 70V7319S166BC application, or 70V7319S166BC equivalent, key selection criteria include bank-switchable arbitration behavior, pipelined vs. flow-through output mode timing, dual-voltage I/O flexibility (OPT-controlled), JTAG IEEE 1149.1 compliance, and 256-pin BGA package compatibility with depth-expansion designs using dual chip enables.

Technical Context

This device implements a true SRAM core with bank-switchable architecture - not a traditional dual-port SRAM - enabling independent, non-conflicting access to any of 64 4K×18 memory banks via dedicated BA0–BA5 address lines per port. Conflict detection occurs only when both ports target identical bank addresses simultaneously, causing invalid access and potential data corruption.

It features fully synchronous operation on both ports with register-controlled inputs (address, data, control), supporting 1.5 ns setup / 0.5 ns hold at 200 MHz. The counter-enable and repeat functions allow auto-incrementing burst addressing across bank boundaries, while separate byte enables (UBL/LBL, UBR/LBR) support 9-bit-wide data bus matching and multiplexed bus interfacing.

Key Specifications

Pinout & Package

70V7319S166BC is housed in a 256-pin BGA (package code BC256), with 1.0 mm ball pitch and 17 mm × 17 mm body size. Power delivery includes dedicated VDD (3.3 V core), VDDQL/VDDQR (I/O supply per port), and multiple VSS balls distributed for low-noise grounding. Pin functions are symmetrically split between left (L) and right (R) ports, each with independent clocks, address/data buses, and control signals.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-ported SRAM applications.

Compared with CY7C1362BV33-166AXC and AS7C3256B-166JCIN, the 70V7319S166BC provides unique bank-switchable arbitration, per-port I/O voltage selection, and JTAG testability - making it optimal for high-performance, mixed-voltage, test-critical systems where deterministic access latency and expandability are prioritized over lowest unit cost.

Availability

70V7319S166BC is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, and FPGA-accelerated embedded systems requiring stable component supply, long-term lifecycle assurance, and industrial-grade thermal performance.

Supply support for 70V7319S166BC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and high-performance interconnect solutions for communications, computing, and industrial markets.

The 70V7319S product line was designed specifically for high-bandwidth, low-latency dual-access memory applications in telecom line cards, DSP subsystems, and real-time control systems - emphasizing bank-level concurrency, flexible I/O voltage, and JTAG testability.

FAQ

What is the maximum operating frequency of the 70V7319S166BC, and under what conditions is it guaranteed?

The 70V7319S166BC is rated for 166 MHz operation (6 ns clock cycle time) across the industrial temperature range (–40°C to +85°C). This speed grade is guaranteed only when VDDQ is set to 3.3 V per port - i.e., OPTL and OPTR must be driven to VIH (3.3 V), and corresponding VDDQL/VDDQR supplies must be 3.3 V ±150 mV. The 70V7319S166BC is not offered in the 208-pin fpBGA package at this speed grade.

How does bank-switching work in the 70V7319S166BC, and what happens if both ports access the same bank?

The 70V7319S166BC divides its 4 Mbit array into 64 independent 4K × 18 banks, selected via BA0–BA5 pins on each port. If both ports assert identical bank addresses simultaneously, neither access is valid: write operations may corrupt data, and read operations return invalid or indeterminate values. The 70V7319S166BC does not resolve conflicts - system-level logic must ensure BAx ≠ BAy to maintain data integrity.

Can the left and right ports of the 70V7319S166BC operate at different I/O voltages?

Yes - the 70V7319S166BC supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL = VIH configures the left port for 3.3 V I/O (VDDQL = 3.3 V), while OPTR = VIL configures the right port for 2.5 V I/O (VDDQR = 2.5 V). This enables direct interfacing with mixed-voltage SoCs or FPGAs without external level shifters - a capability confirmed in the 70V7319S166BC datasheet section "Pin Names" and DC Operating Conditions.

Does the 70V7319S166BC support JTAG boundary-scan, and which standard does it comply with?

Yes, the 70V7319S166BC integrates a fully compliant IEEE 1149.1 JTAG test access port (TAP) with TMS, TCK, TDI, TDO, and TRST pins. It supports instruction register scan, boundary-scan register access, and EXTEST/INTEST instructions - enabling structural testing, interconnect verification, and in-system debug for high-density PCB assemblies. This feature is explicitly documented in the 70V7319S166BC functional description and pin table.

What is the purpose of the CNTEN and REPEAT signals in the 70V7319S166BC, and how are they used in practice?

CNTEN enables automatic address increment on each clock rising edge, advancing across bank boundaries (e.g., Bank 63 → Bank 0). REPEAT resets the internal counter to the last address loaded via ADS - useful for circular buffer restarts or burst re-reads. In practice, these signals eliminate software overhead for sequential memory access: the 70V7319S166BC handles address generation autonomously, reducing CPU/FPGA resource usage in streaming applications like video frame buffering or sensor log replay.