Renesas 70V7319S166BC8

Overview

70V7319S166BC8 from IDT (Integrated Device Technology) is a high-speed synchronous bank-switchable dual-ported SRAM with 256K × 18-bit organization (4 Mbit), 166 MHz operation, industrial temperature range (−40°C to +85°C), and 256-pin BGA package. It supports independent left/right port access to 64 banks of 4K × 18 memory, selectable 3.3V/2.5V I/O interface per port, and pipelined or flow-through output modes - used in real-time packet buffering for telecom line cards.

For engineers reviewing the 70V7319S166BC8 datasheet, 70V7319S166BC8 pinout, 70V7319S166BC8 application, or 70V7319S166BC8 equivalent, key selection criteria include bank-switchable dual-port timing isolation, 166 MHz industrial-grade cycle time (6 ns), dual VDDQ voltage support per port, JTAG IEEE 1149.1 compliance, and depth-expansion capability via dual chip enables.

Technical Context

This device implements a true SRAM core with bank-switchable architecture-not traditional dual-port-enabling concurrent non-conflicting access to separate 4K × 18 banks. Bank selection is controlled directly by BA0–BA5 pins on each port, with arbitration logic preventing simultaneous access to the same bank.

It features fully synchronous operation on both ports: registers on all control, address, and data inputs enable tight timing margins (1.5 ns setup, 0.5 ns hold @ 200 MHz), self-timed write for minimal cycle time, and independent counter enable/repeat functions for burst address generation without external logic.

Key Specifications

Pinout & Package

70V7319S166BC8 is housed in a 256-pin Ball Grid Array (BC256) package with 17 mm × 17 mm footprint, 1.0 mm ball pitch, and 1.4 mm height. Power and ground balls are distributed across the array for low-noise operation; VDD (3.3 V core) and VDDQ (3.3 V or 2.5 V I/O) supplies are separately routed per port.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Compared with CY7C1362BV33-166BAXI and AS7C3256B-166BIN, the 70V7319S166BC8 uniquely delivers bank-switchable arbitration, per-port voltage selection, and integrated address counter - reducing system-level logic, power, and timing validation effort in high-reliability embedded designs.

Availability

70V7319S166BC8 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, aerospace data acquisition, and radar signal processing requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 70V7319S166BC8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.

The 70V7319S product line targets deterministic, low-latency memory subsystems in real-time embedded systems - emphasizing bank-isolated dual-port access, mixed-voltage interoperability, and JTAG-testable reliability.

FAQ

What is the maximum operating frequency of the 70V7319S166BC8 under industrial temperature conditions?

The 70V7319S166BC8 is rated for 166 MHz operation across the full industrial temperature range (−40°C to +85°C). This corresponds to a 6 ns clock cycle time and 3.6 ns maximum clock-to-data-out delay in pipelined mode. The 166 MHz speed grade is only supported in the 256-pin BC256 package - not the 208-pin fpBGA variant.

Does the 70V7319S166BC8 support independent I/O voltage selection on its two ports?

Yes, the 70V7319S166BC8 supports independent I/O voltage selection: OPTL and OPTR pins configure left and right ports separately for either 3.3 V or 2.5 V operation. When OPTX = VIH, VDDQX must be 3.3 V; when OPTX = VIL, VDDQX must be 2.5 V. This enables direct interfacing with mixed-voltage SoCs or FPGAs without external level shifters.

How does bank switching work in the 70V7319S166BC8, and what happens during bank contention?

The 70V7319S166BC8 organizes memory into 64 independent 4K × 18 banks. Each port selects its target bank via BA0–BA5 pins. If both ports attempt simultaneous access to the same bank, neither access is valid - reads return invalid data, and writes may corrupt memory contents. Designers must ensure BA0L–BA5L ≠ BA0R–BA5R in real-time arbitration logic or software.

What are the power supply requirements for the 70V7319S166BC8 core and I/O rails?

The 70V7319S166BC8 requires a 3.3 V ±150 mV core supply (VDD) for internal logic. Each port has dedicated I/O supplies: VDDQL for left port and VDDQR for right port, configurable for either 3.3 V ±150 mV or 2.5 V ±100 mV depending on OPTL/OPTR settings. All VSS pins must connect to ground; decoupling capacitors are required per datasheet layout guidelines.

Is JTAG boundary-scan supported on the 70V7319S166BC8, and which standard does it comply with?

Yes, the 70V7319S166BC8 integrates IEEE 1149.1-compliant JTAG test circuitry with TDI, TDO, TCK, TMS, and TRST pins. This enables boundary-scan testing, interconnect verification, and in-system programming support - critical for high-density PCBs in telecom and avionics applications where physical probe access is limited.