Renesas 70V7319S166BCGI

Overview

70V7319S166BCGI from Integrated Device Technology is a 256K × 18 (4 Mbit) synchronous bank-switchable dual-ported SRAM with independent left/right ports, 166 MHz operation (4.2 ns access), industrial temperature range (–40°C to +85°C), and selectable 2.5V/3.3V I/O interface per port. It enables high-bandwidth data buffering in telecom line cards and real-time packet switching systems.

For engineers reviewing the 70V7319S166BCGI datasheet, 70V7319S166BCGI pinout, 70V7319S166BCGI application, or 70V7319S166BCGI equivalent, key selection factors include bank-switchable architecture for concurrent non-conflicting access, pipelined/flow-through output mode selection, JTAG IEEE 1149.1 compliance, dual chip enable for depth expansion, and VDDQ voltage flexibility per port.

Technical Context

The 70V7319S166BCGI implements a true SRAM core with 64 independent 4K × 18 banks, enabling each port to access any unoccupied bank under direct user control via BA0–BA5 address lines. Conflicting simultaneous bank access invalidates both operations and risks data corruption.

It supports full synchronous operation on both ports with register-controlled inputs (1.5 ns setup, 0.5 ns hold @ 200 MHz), self-timed write for minimal cycle time, and separate byte enables (UBL/LBL, UBR/LBR) for 9-bit bus matching. The PL/FTL and PL/FTR pins configure pipelined (3.6 ns tCD2) or flow-through (12 ns tCD1) output timing per port.

Key Specifications

Pinout & Package

70V7319S166BCGI is housed in a 256-pin Ball Grid Array (BC256) package with 17 mm × 17 mm footprint and 1.0 mm ball pitch. All VDD pins require 3.3 V ±150 mV; VDDQ pins must match selected I/O voltage (2.5 V ±100 mV or 3.3 V ±150 mV) per port based on OPTL/OPTR state.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-ported SRAM applications.

Compared with 70V7319S133BCGI, the 70V7319S166BCGI delivers 25% higher bandwidth and retains industrial qualification; versus 70V7319S200BG208, it trades peak speed for wider temperature range and mixed-voltage I/O-critical for ruggedized embedded deployments.

Availability

70V7319S166BCGI is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, and medical imaging systems requiring stable component supply, long-term lifecycle support, and guaranteed industrial temperature performance.

Supply support for 70V7319S166BCGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and power management solutions for communications, computing, and industrial markets.

The 70V7319S product line delivers high-speed, bank-switchable dual-ported SRAMs optimized for deterministic, low-latency data buffering in multi-clock-domain systems such as network switches, baseband processors, and real-time control units.

FAQ

What is the maximum operating frequency of the 70V7319S166BCGI?

The 70V7319S166BCGI is rated for 166 MHz operation across both ports, corresponding to a 6 ns clock cycle time and 4.2 ns maximum access time in flow-through mode. This speed grade is validated for industrial temperature range (–40°C to +85°C) and supported exclusively in the 256-pin BC256 package.

Does the 70V7319S166BCGI support mixed I/O voltage operation between its two ports?

Yes, the 70V7319S166BCGI supports independent I/O voltage selection per port: OPTL sets left-port VDDQL to either 2.5 V (±100 mV) or 3.3 V (±150 mV), while OPTR does the same for the right port. This allows one port to interface with a 2.5 V FPGA and the other with a 3.3 V microcontroller without external level shifters.

How does bank-switching prevent port contention in the 70V7319S166BCGI?

The 70V7319S166BCGI uses BA0L–BA5L and BA0R–BA5R to select one of 64 banks per port. If both ports attempt simultaneous access to the same bank (identical BA values), neither access is valid and data may be corrupted. Designers must ensure BA values differ to guarantee deterministic concurrent operation - a hardware-enforced constraint, not software-managed arbitration.

What is the purpose of the CNTEN and REPEAT signals on the 70V7319S166BCGI?

CNTEN enables automatic address increment on each clock edge, supporting burst reads/writes without CPU intervention. REPEAT resets the internal counter to the last valid address loaded via ADS, enabling efficient circular buffer or ping-pong memory access patterns. Both functions reduce controller overhead in streaming applications like video frame buffering or sensor data logging.

Is JTAG boundary-scan supported on the 70V7319S166BCGI, and what pins are used?

Yes, the 70V7319S166BCGI implements IEEE 1149.1 JTAG boundary-scan with dedicated TDI, TDO, TCK, TMS, and TRST pins. These signals are fully compliant and enable in-system testing of solder joints, interconnects, and memory subsystem integrity - critical for high-reliability telecom and medical equipment manufacturing.