Renesas 70V7319S166BF

Overview

70V7319S166BF from Integrated Device Technology is a 256K × 18 (4 Mbit) synchronous bank-switchable dual-ported SRAM with independent left/right ports, 166 MHz operation (3.6 ns access), pipelined/flow-through output mode selection, and selectable 3.3 V or 2.5 V I/O interface per port. It delivers 14 Gbps aggregate bandwidth and supports industrial temperature range (−40°C to +85°C) in BC-256 BGA package - used in high-throughput packet buffering and real-time DSP co-processing.

For engineers reviewing the 70V7319S166BF datasheet, 70V7319S166BF pinout, 70V7319S166BF application, or 70V7319S166BF equivalent, key selection criteria include bank-switchable arbitration for concurrent port access, JTAG IEEE 1149.1 compliance, dual chip enable depth expansion, counter repeat functionality, and voltage-flexible I/O banks enabling mixed-voltage system integration.

Technical Context

The 70V7319S166BF implements a true SRAM core with 64 independent 4K × 18 banks, where bank access is directly controlled by BA0–BA5 pins on each port. Conflicts occur only when both ports target identical banks simultaneously - requiring explicit software/hardware coordination to avoid data corruption.

It supports full synchronous operation on both ports with registered control, address, and data inputs; self-timed write enables minimal cycle time; and configurable OPT pins set per-port I/O voltage (3.3 V or 2.5 V) independently, while core VDD remains fixed at 3.3 V ±150 mV.

Key Specifications

Pinout & Package

70V7319S166BF is packaged in a 256-pin Ball Grid Array (BC-256) with 1.0 mm ball pitch and 17 mm × 17 mm body size. Pin functions are symmetric across left (L) and right (R) ports, including dual clock (CLKL/CLKR), bank address (BA0L–BA5L / BA0R–BA5R), and byte-enable (UBL/LBL / UBR/LBR) signals.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-ported SRAM applications.

Compared with CY7C1362BV33-166AXC and AS7C3256B-166JCIN, the 70V7319S166BF uniquely combines per-port voltage selection, bank-switchable conflict avoidance, and integrated address counter - reducing FPGA logic utilization and enabling deterministic real-time memory access in heterogeneous systems.

Availability

70V7319S166BF is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, avionics data acquisition, and real-time DSP co-processing requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for 70V7319S166BF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.

The 70V7319S series targets high-bandwidth, low-latency dual-port memory applications in packet processing, digital signal processing, and real-time control systems - emphasizing bank-switchable concurrency and mixed-voltage interoperability.

FAQ

What is the maximum operating frequency of the 70V7319S166BF?

The 70V7319S166BF operates at up to 166 MHz in pipelined mode (tCYC2 = 6 ns), delivering 14 Gbps aggregate bandwidth. This speed grade is validated for industrial temperature range (−40°C to +85°C) and requires VDDQ = 3.3 V (i.e., OPTL/OPTR = VIH) - confirmed in IDT datasheet DSC 5629, Table 11.

Does the 70V7319S166BF support mixed-voltage I/O interfaces?

Yes, the 70V7319S166BF supports per-port I/O voltage selection: OPTL sets left-port VDDQL to 3.3 V or 2.5 V, and OPTR sets right-port VDDQR independently. Core VDD remains fixed at 3.3 V. This enables direct connection to 2.5 V FPGAs and 3.3 V microcontrollers without level shifters - detailed in datasheet page 4, Pin Names table and Note 2.

How does bank-switching prevent port contention in the 70V7319S166BF?

The 70V7319S166BF allocates 64 independent 4K × 18 banks. Each port selects its target bank via BA0–BA5 pins. If BA0L–BA5L ≠ BA0R–BA5R, both ports access memory concurrently without conflict. If addresses match, both accesses are invalidated - requiring firmware coordination. This architecture avoids internal arbitration delays, unlike traditional dual-port SRAMs - explained in datasheet Note 4, page 4.

What is the purpose of the CNTEN and REPEAT pins on the 70V7319S166BF?

CNTEN enables automatic address increment on each clock cycle; REPEAT resets the internal counter to the last valid address loaded via ADS. Together, they implement hardware-managed burst addressing - eliminating host CPU overhead in FIFO, circular buffer, or DMA-like operations. This behavior is defined in Truth Table II (page 5) and Timing Waveform on page 11 of the datasheet.

Which package variant is used for the 70V7319S166BF?

The 70V7319S166BF uses the BC-256 package: a 256-pin Ball Grid Array with 1.0 mm ball pitch and 17 mm × 17 mm body size. The BF-208 fpBGA variant is not offered for the 166 MHz industrial-grade version - explicitly stated in datasheet footnote 4 on page 8 and footnote 4 on page 10.