Renesas 70V7319S166BF8

Overview

70V7319S166BF8 from IDT (Integrated Device Technology) is a high-speed, synchronous, bank-switchable dual-ported SRAM with 256K × 18-bit (4 Mbit) capacity, organized into 64 independent 4K × 18 banks. It supports 166 MHz operation (3.6 ns access), industrial temperature range (−40°C to +85°C), and selectable 3.3 V or 2.5 V I/O interface per port via OPTL/OPTR pins. It is used in real-time packet buffering and multi-processor interconnect applications requiring concurrent read/write access across two independent ports.

For engineers reviewing the 70V7319S166BF8 datasheet, 70V7319S166BF8 pinout, 70V7319S166BF8 application, or 70V7319S166BF8 equivalent, key selection criteria include bank-switchable arbitration, pipelined/flow-through output mode selection, JTAG IEEE 1149.1 compliance, dual chip enable for depth expansion, and independent voltage control per port - all critical for deterministic latency in telecom and test equipment memory subsystems.

Technical Context

The 70V7319S166BF8 implements a true SRAM core with bank-switchable architecture - not a traditional dual-port SRAM - enabling simultaneous non-conflicting access to different 4K × 18 banks via BA0–BA5 address bits on each port. Conflicts occur only when both ports target identical banks, causing invalid access and potential data corruption.

It features fully synchronous operation on both ports with registered inputs (address, control, data), supporting 5 ns cycle time at 200 MHz (14 Gbps aggregate bandwidth). Clock-to-data-out is 3.6 ns in pipelined mode and 12 ns in flow-through mode at 166 MHz, with 1.5 ns setup and 0.5 ns hold times on all inputs relative to CLK.

Key Specifications

Pinout & Package

70V7319S166BF8 is housed in a 208-pin fine-pitch Ball Grid Array (fpBGA) package measuring 15 mm × 15 mm × 1.4 mm with 0.8 mm ball pitch. All VDD pins require connection to 3.3 V, while VDDQL and VDDQR must match the selected I/O voltage (3.3 V if OPTL/OPTR = VIH; 2.5 V if OPTL/OPTR = VIL). VSS pins are grounded.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-ported SRAM applications.

Compared with CY7C1362BV33-166AXC and AS7C3256A-166JCIN, the 70V7319S166BF8 uniquely delivers per-port voltage flexibility, bank-switchable arbitration, and JTAG-compliant testability - making it the only option qualified for industrial telecom infrastructure requiring deterministic latency and in-system verifiability.

Availability

70V7319S166BF8 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial PLCs, and automated test equipment requiring stable component supply, long-term lifecycle support, and guaranteed industrial temperature performance.

Supply support for 70V7319S166BF8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and sensor solutions for communications, computing, and industrial markets.

The 70V7319S product line was designed specifically for high-bandwidth, low-latency dual-ported memory applications in telecom line cards, test instrumentation, and multi-processor systems requiring concurrent, deterministic access to shared data.

FAQ

What is the maximum operating frequency and access time for 70V7319S166BF8?

The 70V7319S166BF8 is rated for 166 MHz operation with a maximum clock-to-data-out time of 3.6 ns in pipelined mode and 12 ns in flow-through mode. These values are guaranteed over the full industrial temperature range (−40°C to +85°C) and apply only when using the BF208 fpBGA package with appropriate power supply decoupling and layout practices per the datasheet guidelines.

Does 70V7319S166BF8 support independent I/O voltage selection per port?

Yes, 70V7319S166BF8 supports independent I/O voltage selection: OPTL and OPTR pins configure left and right ports separately for either 3.3 V or 2.5 V operation. When OPTL = VIH, VDDQL must be 3.3 V; when OPTL = VIL, VDDQL must be 2.5 V - same applies to OPTR/VDDQR. This enables mixed-voltage system integration without external level shifters.

How does bank-switchable arbitration work in 70V7319S166BF8?

70V7319S166BF8 uses BA0L–BA5L and BA0R–BA5R to select one of 64 independent 4K × 18 banks per port. Access is valid only when BA values differ between ports. If both ports assert identical bank addresses simultaneously, neither access completes successfully - data may be corrupted during writes or invalid during reads. System design must ensure bank address separation.

Is JTAG boundary-scan supported on 70V7319S166BF8?

Yes, 70V7319S166BF8 fully supports IEEE 1149.1 JTAG boundary-scan via TMS, TCK, TDO, TDI, and TRST pins. This enables in-circuit testing, device identification, and debug visibility without requiring additional test pads or functional I/O pins - a key requirement for high-reliability telecom and industrial hardware validation.

What package type and footprint does 70V7319S166BF8 use?

70V7319S166BF8 uses a 208-pin fine-pitch Ball Grid Array (fpBGA) package designated BF208, with dimensions of 15 mm × 15 mm × 1.4 mm and 0.8 mm ball pitch. It is distinct from the 256-pin BC256 variant - the BF208 package supports 166 MHz industrial operation, while the BC256 is required for 200 MHz speed grade.