Renesas 70V7319S200BC

Overview

70V7319S200BC from IDT (Integrated Device Technology) is a high-speed, synchronous, bank-switchable dual-ported SRAM with 256K × 18-bit (4 Mbit) capacity, organized into 64 independent 4K × 18 banks. It supports 200 MHz operation (5 ns cycle time), delivers 14 Gbps aggregate bandwidth, and features pipelined or flow-through output modes - enabling real-time data buffering in telecom line cards and packet switching fabric controllers.

For engineers reviewing the 70V7319S200BC datasheet, 70V7319S200BC pinout, 70V7319S200BC application, or 70V7319S200BC equivalent, key selection criteria include its dual-port bank-switching architecture, independent 3.3V core / selectable 3.3V or 2.5V I/O supplies per port, JTAG IEEE 1149.1 compliance, and industrial-grade (-40°C to +85°C) availability at 133 MHz.

Technical Context

The 70V7319S200BC implements a true SRAM core with bank-switchable dual-port access - not a traditional dual-port SRAM - allowing each port to independently target any of 64 banks via dedicated BA0–BA5 address lines. Conflicts occur only when both ports simultaneously access the same bank, requiring explicit software coordination.

It supports full synchronous operation on both ports with registered control, address, and data inputs; includes counter enable/repeat logic for burst addressing; and provides separate byte enables (UBL/LBL, UBR/LBR) for 9-bit byte granularity. JTAG boundary-scan support enables in-system testability per IEEE 1149.1.

Key Specifications

Pinout & Package

70V7319S200BC is housed in a 256-pin BGA (package code BC256), with 17 mm × 17 mm footprint, 1.0 mm ball pitch, and standard LVTTL-compatible I/O voltage levels. Power and ground balls are distributed across the array for low-noise operation; VDD, VDDQ, and VSS pins require proper decoupling per datasheet layout guidelines.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Compared with CY7C1362BV33-200BZI and AS7C3256B-20JCIN, the 70V7319S200BC uniquely supports per-port I/O voltage selection, bank-switching arbitration, hardware address counters, and JTAG - making it suitable for high-performance, mixed-voltage, test-ready systems where deterministic latency and flexible interfacing are critical.

Availability

70V7319S200BC is available at Aetrix Electronics and suitable for telecom infrastructure, network switching, real-time signal processing, and industrial motion control applications requiring stable component supply and long-term manufacturability.

Supply support for 70V7319S200BC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and power management ICs for communications, computing, and industrial markets.

The 70V7319S product line was designed for high-bandwidth, low-latency dual-port memory applications in telecom infrastructure and packet-processing systems - emphasizing bank-switching flexibility, mixed-voltage I/O, and JTAG testability.

FAQ

What is the maximum operating frequency of the 70V7319S200BC?

The 70V7319S200BC is rated for 200 MHz operation (5 ns clock cycle time) under commercial temperature conditions (0°C to +70°C). This speed grade is only available in the 256-pin BC256 package and requires VDDQ = 3.3 V per port (OPTL/OPTR = VIH). Industrial temperature operation is supported up to 133 MHz.

Does the 70V7319S200BC support mixed-voltage I/O interfaces?

Yes - the 70V7319S200BC supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL = VIH configures the left port for 3.3 V I/O (VDDQL = 3.3 V); setting OPTL = VIL configures it for 2.5 V I/O (VDDQL = 2.5 V). The same applies to the right port via OPTR. This enables direct interfacing with mixed-voltage SoCs or FPGAs.

How does bank-switching work in the 70V7319S200BC?

The 70V7319S200BC divides its 4 Mbit memory into 64 independent 4K × 18 banks. Each port selects a target bank using its own BA0–BA5 pins. Access is valid only when both ports select different banks; simultaneous access to the same bank by both ports invalidates both operations and may corrupt data. Software must coordinate bank selection to avoid conflicts.

What is the purpose of the CNTEN and REPEAT signals in the 70V7319S200BC?

CNTEN enables the internal address counter on each port, advancing the address automatically on every clock edge. REPEAT resets the counter to the last valid address loaded via ADS (Address Strobe). This enables efficient burst transfers without CPU intervention - for example, streaming DMA reads from sequential locations within a bank after initial ADS setup.

Is JTAG boundary-scan supported on the 70V7319S200BC?

Yes - the 70V7319S200BC includes full IEEE 1149.1-compliant JTAG test logic with dedicated TDI, TDO, TCK, TMS, and TRST pins. This allows in-system testability, interconnect verification, and device-level debugging without requiring additional test fixtures or intrusive probing.