Renesas 70V7339S133BC

Overview

70V7339S133BC from IDT (Integrated Device Technology) is a high-speed, synchronous, bank-switchable dual-ported SRAM with 512K × 18-bit (9 Mbit) capacity, organized into 64 independent 8K × 18 banks. It supports 133 MHz operation (7.5 ns clock cycle), industrial temperature range (−40°C to +85°C), and selectable 3.3V/2.5V I/O interfaces per port via OPT pins. It is used in real-time packet buffering for telecom line cards requiring concurrent read/write access across two independent data paths.

For engineers reviewing the 70V7339S133BC datasheet, 70V7339S133BC pinout, 70V7339S133BC application, or 70V7339S133BC equivalent, key selection criteria include bank-switchable arbitration, pipelined/flow-through output mode selection, JTAG IEEE 1149.1 compliance, dual chip enable for depth expansion, and independent VDDQ voltage control per port.

Technical Context

The 70V7339S133BC implements a true SRAM core-not a traditional dual-port architecture-enabling bank-level concurrency control via six dedicated bank address pins (BA0–BA5) per port. Each port operates fully synchronously with its own clock, address, control, and 18-bit bidirectional I/O bus.

It supports two distinct output timing modes: pipelined (3.4–4.2 ns clock-to-data, tCD2) and flow-through (10–15 ns, tCD1), selected per port via PL/FTL and PL/FTR pins. Address strobe (ADS) and counter enable (CNTEN) allow burst-mode sequential addressing without external logic.

Key Specifications

Pinout & Package

70V7339S133BC is packaged in a 256-pin Ball Grid Array (BGA), package code BC256, with 17 mm × 17 mm body size and 1.0 mm ball pitch. All VDD pins require 3.3V supply; VDDQ pins must match OPT pin logic level (3.3V if OPT = VIH, 2.5V if OPT = VIL).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Compared with CY7C1362BV33-133BZI and AS7C351200PFS-133BIN, the 70V7339S133BC uniquely integrates bank-switchable arbitration, per-port voltage selection, and hardware address sequencing-reducing FPGA resource usage and PCB complexity in high-throughput embedded systems.

Availability

70V7339S133BC is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, real-time video processing, and radar signal buffering requiring stable component supply across extended temperature ranges.

Supply support for 70V7339S133BC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, specializes in high-performance timing, memory interface, and RF power solutions for communications and computing markets.

The 70V7339S product line was designed specifically for deterministic, low-latency dual-access memory applications in telecom, test equipment, and real-time embedded systems requiring bank-level concurrency and flexible I/O voltage scaling.

FAQ

What is the maximum operating frequency of the 70V7339S133BC at industrial temperature?

The 70V7339S133BC is rated for 133 MHz operation (7.5 ns clock cycle time) across the full industrial temperature range of −40°C to +85°C. This speed grade is supported in the BC256 BGA package and requires VDDQ = 3.3V (OPT pin set to VIH) for each active port. The 200 MHz and 166 MHz variants are not qualified for industrial temperature in this specific speed-bin suffix.

How does bank switching work in the 70V7339S133BC, and what happens during a bank conflict?

The 70V7339S133BC uses six bank address pins (BA0–BA5) per port to select one of 64 independent 8K×18 memory banks. If both ports attempt simultaneous access to the same bank (BA0L–BA5L = BA0R–BA5R), neither access is valid: write operations may corrupt data, and read operations return invalid or indeterminate outputs. System design must ensure bank address separation for concurrent operation.

Can the left and right ports of the 70V7339S133BC operate at different I/O voltages?

Yes. The 70V7339S133BC supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL = VIH configures the left port for 3.3V I/O levels (with VDDQL = 3.3V), while OPTR = VIL configures the right port for 2.5V I/O (with VDDQR = 2.5V). This enables direct interfacing with mixed-voltage SoCs or FPGAs without level shifters.

What is the function of the ADS and CNTEN pins on the 70V7339S133BC?

ADSL/ADSR latches the current address on the rising edge of CLK, enabling burst-mode sequential access without external counters. CNTENL/CNTENR enables automatic increment of the internal address counter on each clock edge-used with ADS to implement circular buffers or linear streaming. REPEATL/REPEATR resets the counter to the last ADS-loaded address, supporting zero-overhead buffer wraparound.

Does the 70V7339S133BC support JTAG boundary-scan, and which standard does it comply with?

Yes, the 70V7339S133BC includes full IEEE 1149.1-compliant JTAG boundary-scan logic with TDI, TDO, TCK, TMS, and TRST pins. It supports standard EXTEST and SAMPLE/PRELOAD instructions, enabling board-level interconnect testing and in-system programming verification without physical probe access.