Renesas 70V7339S133BC8

Overview

70V7339S133BC8 from Integrated Device Technology is a high-speed 512K × 18 (9 Mbit) synchronous bank-switchable dual-ported SRAM with independent left/right ports, 133 MHz operation (4.2 ns max access), selectable pipelined or flow-through output mode, and industrial temperature support (–40°C to +85°C). It enables concurrent memory access in real-time networking and packet buffering systems.

For engineers reviewing the 70V7339S133BC8 datasheet, 70V7339S133BC8 pinout, 70V7339S133BC8 application, or 70V7339S133BC8 equivalent, key selection factors include dual-port timing isolation, bank-address-controlled memory partitioning, 2.5V/3.3V I/O voltage flexibility per port, JTAG IEEE 1149.1 compliance, and fpBGA-208 package compatibility with depth expansion via dual chip enables.

Technical Context

The 70V7339S133BC8 implements a true synchronous SRAM core-not legacy dual-port-organized into 64 independent 8K × 18 banks, enabling bank-level arbitration under user control via BA0L–BA5L and BA0R–BA5R pins. Each port operates fully synchronously with dedicated clock, address strobe (ADSL/ADSR), counter enable (CNTENL/CNTENR), and repeat (REPEATL/REPEATR) logic for burst address generation.

It supports two distinct output modes: pipelined (tCD2 = 4.2 ns @133 MHz) for high-throughput streaming, and flow-through (tCD1 = 15 ns @133 MHz) for low-latency deterministic reads. Power management includes four standby current states (ISB1–ISB4), controlled independently per port via CE0X/CE1X, with full CMOS-level shutdown drawing only 10 mA typical.

Key Specifications

Pinout & Package

70V7339S133BC8 is housed in a 208-pin fine-pitch Ball Grid Array (fpBGA) package measuring 15 mm × 15 mm × 1.4 mm with 0.8 mm ball pitch. All VDD pins require 3.3 V ±150 mV; VDDQ pins must match selected I/O voltage (2.5 V or 3.3 V) per port as set by OPTL/OPTR.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Compared with 70V7339S133BC8, the 166 MHz variant offers tighter timing but sacrifices fpBGA-208 compatibility, while the BF8 version retains identical electrical specs but mandates a physically incompatible 256-pin layout - making 70V7339S133BC8 the sole fpBGA-208 option at 133 MHz with industrial temp support.

Availability

70V7339S133BC8 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and FPGA-based protocol acceleration requiring stable component supply, long-term lifecycle assurance, and verified industrial-grade qualification.

Supply support for 70V7339S133BC8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory interface, and RF solutions for communications and computing markets.

The 70V7339S series was designed specifically for high-bandwidth, low-latency dual-access memory applications in networking equipment, real-time control systems, and FPGA co-processing subsystems where bank-level concurrency and flexible I/O voltage are essential.

FAQ

What is the maximum operating frequency of the 70V7339S133BC8?

The 70V7339S133BC8 is rated for 133 MHz operation, with a guaranteed maximum access time of 4.2 ns in pipelined mode. This corresponds to a minimum clock cycle time of 7.5 ns (tCYC2). It is not rated for 166 MHz or 200 MHz operation - those speed grades require different part numbers (70V7339S166BC8 and 70V7339S200BC8) and are not functionally interchangeable with the 70V7339S133BC8.

Does the 70V7339S133BC8 support both 2.5 V and 3.3 V I/O interfaces simultaneously?

Yes - the 70V7339S133BC8 supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL to VIH (3.3 V) and OPTR to VIL (0 V) configures the left port for 3.3 V signaling and the right port for 2.5 V signaling, enabling direct interfacing with mixed-voltage SoCs or FPGAs without external level shifters.

How does bank switching prevent memory access conflicts in the 70V7339S133BC8?

The 70V7339S133BC8 uses BA0L–BA5L and BA0R–BA5R to select one of 64 banks per port. If both ports attempt to access the same bank simultaneously, neither access is valid and data corruption may occur. The device does not arbitrate - conflict avoidance is the system designer's responsibility, enforced by ensuring BAxL ≠ BAxR at all times during concurrent operation.

What is the purpose of the REPEAT pin in the 70V7339S133BC8?

The REPEAT pin (REPEATL/REPEATR) resets the internal address counter to the last valid address loaded via ADSx. This enables rapid re-access to a known location - for example, reloading a descriptor header after processing a packet payload. The REPEAT address is not initialized at power-up; it must be established via an initial ADS assertion during system startup.

Is the 70V7339S133BC8 compatible with JTAG boundary-scan testing?

Yes - the 70V7339S133BC8 implements full IEEE 1149.1 JTAG functionality with TDI, TDO, TCK, TMS, and TRST pins. This allows boundary-scan testing of interconnects to the device, verification of solder joint integrity on the fpBGA-208 package, and in-system programming or debug of memory subsystems during manufacturing and field maintenance.