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Renesas 70V7339S133BCI

Part No.:
70V7339S133BCI
Manufacturer:
Renesas
Category:
Memory
Package:
256-LBGA
Datasheet:
Aetrix70V7339S133BCI.pdf
Description:
IC SRAM 9MBIT PARALLEL 256CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,664

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Product details

Overview

70V7339S133BCI from Integrated Device Technology is a high-speed 512K × 18 (9 Mbit) synchronous bank-switchable dual-ported SRAM with independent left/right ports, 133 MHz operation (4.2 ns max access), industrial temperature range (–40°C to +85°C), and selectable 3.3 V or 2.5 V I/O interface per port. It enables concurrent read/write access to separate 8K × 18 memory banks in telecom switching fabric and real-time packet buffering.

For engineers reviewing the 70V7339S133BCI datasheet, 70V7339S133BCI pinout, 70V7339S133BCI application, or 70V7339S133BCI equivalent, key selection criteria include bank-switchable arbitration, pipelined/flow-through output mode selection, JTAG IEEE 1149.1 compliance, dual chip enable depth expansion, and independent VDDQ voltage control per port.

Technical Context

The 70V7339S133BCI implements a true SRAM core-not traditional dual-port-enabling bank-switchable access across 64 independent 8K × 18 blocks. Bank selection is controlled directly via BA0–BA5 pins on each port, with collision detection when both ports target identical banks.

It supports full synchronous operation on both ports: 5 ns cycle time at 200 MHz (not applicable to this speed grade), but for 70V7339S133BCI specifically, it guarantees 25 ns flow-through clock cycle (tCYC1) and 7.5 ns pipelined clock cycle (tCYC2), with 4.2 ns max clock-to-data (tCD2) in pipelined mode and 15 ns in flow-through mode.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization512K × 18 (9 Mbit), organized as 64 independent 8K × 18 banks
Max Operating Frequency133 MHz - enables deterministic 7.5 ns pipelined read cycles for real-time data coherency
Access Time4.2 ns (max) clock-to-data in pipelined mode - supports tight timing closure in FPGA-ASIC interconnects
I/O Voltage SupportSelectable 3.3 V or 2.5 V per port via OPTL/OPTR pins - allows mixed-voltage system integration without level shifters
Operating Temperature–40°C to +85°C industrial grade - qualified for base station and industrial control environments
Package256-pin BGA (BC256), 17 mm × 17 mm × 1.4 mm, 1.0 mm ball pitch - compatible with standard SMT reflow profiles
JTAG ComplianceIEEE 1149.1 boundary-scan support - enables in-system testability and debug of memory subsystems

Pinout & Package

70V7339S133BCI is housed in a 256-pin Ball Grid Array (BC256) package with 1.0 mm ball pitch, 17 mm × 17 mm body size, and thermal pad-compatible layout. Power delivery includes dedicated VDD (3.3 V core), VDDQL/VDDQR (port-selectable 3.3 V/2.5 V I/O), and multiple VSS balls for low-noise grounding.

Pin/Terminal Circuit Role Design Meaning
CLKL / CLKRPort-synchronous clock inputEdge-triggered sampling of all port controls; supports independent clock domains per port
BA0L–BA5L / BA0R–BA5RBank address inputsSelect one of 64 memory banks per port; mismatch prevents bank contention and data corruption
PL/FTL / PL/FTRPipeline/Flow-Through mode selectDC-level control (VIH/VIL) to configure output latency: pipelined = 1-cycle delay, flow-through = combinational
CE0L/CE1L / CE0R/CE1RDual chip enablesEnable/disable port independently; CE0=VIL & CE1=VIH activates port; both high = power-down
OPTL / OPTRI/O voltage option controlSet VIH (3.3 V) or VIL (0 V) to configure corresponding VDDQX supply voltage (3.3 V or 2.5 V)
TDI / TDO / TCK / TMS / TRSTJTAG test interfaceFull IEEE 1149.1 boundary-scan chain for production test and debug visibility

Key Features

Feature Design Value
Bank-switchable architecture64 independent 8K × 18 banks allow concurrent non-conflicting access - eliminates arbitration logic in multi-processor systems
Selectable pipelined or flow-through outputConfigurable latency mode per port enables optimization for throughput (pipelined) or minimal latency (flow-through)
Dual chip enables per portEnables seamless depth expansion across multiple devices without external logic - reduces BOM count and PCB area
Independent I/O voltage per portOPTL/OPTR pins allow left port at 3.3 V and right port at 2.5 V - supports heterogeneous SoC/FPGA interfacing
Counter enable and repeat functionsHardware address counter with REPEAT reset enables burst sequential access without CPU intervention - offloads DMA controllers
Automatic power-down modeCE0/CE1-driven standby reduces dynamic current to ≤310 mA (industrial) - critical for thermal management in dense modules

Applications

Telecom Switching Fabric Real-Time Packet Buffering

Use Scenario: High-throughput line cards in carrier-grade routers performing parallel header lookup and forwarding decision.

IC Role / Device Role / Timing Role: Dual-port SRAM serves as shared buffer between ingress and egress ASICs, enabling simultaneous write (ingress) and read (egress) at 133 MHz.

Use Value: 4.2 ns pipelined tCD2 ensures sub-5 ns data availability, meeting strict 10 Gbps packet processing deadlines without pipeline stalls.

Use Scenario: Deep buffering in 5G baseband units handling variable-length uplink/downlink bursts with zero packet loss.

IC Role / Device Role / Timing Role: Acts as elastic store between RF front-end and baseband processor, absorbing jitter via independent port clocks.

Use Value: Bank-switchable architecture isolates burst traffic across banks, preventing head-of-line blocking during concurrent LTE/NR scheduling.

Industrial Motion Control Medical Imaging Data Pipeline

Use Scenario: Multi-axis servo controller synchronizing position feedback and PWM updates across six axes in real time.

IC Role / Device Role / Timing Role: Provides deterministic low-latency memory for motion trajectory tables and encoder interpolation buffers.

Use Value: Flow-through output mode delivers immediate read data (tCD1 ≤15 ns), enabling sub-microsecond closed-loop response times.

Use Scenario: CT/MRI scanner front-end digitizing analog detector outputs and streaming to reconstruction engine.

IC Role / Device Role / Timing Role: Buffers raw 16-bit ADC samples from parallel detector channels before compression and transfer.

Use Value: Independent 2.5 V/3.3 V I/O per port interfaces directly to low-voltage ADCs and 3.3 V FPGAs - eliminates level-shifter components.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1362BV33-133BZI512K × 18, 133 MHz, 256-pin BGA, but uses conventional dual-port core (not bank-switchable); no REPEAT/counter featuresLacks bank arbitration and hardware address counter - requires external logic for burst sequencingChoose if legacy design compatibility is required and bank-switching is unnecessary
AS7C35128PFS-133BIN512K × 18, 133 MHz, 256-pin BGA, but only supports 3.3 V I/O; no VDDQ voltage selection or JTAGNo per-port voltage flexibility or boundary-scan test capability - limits mixed-voltage and testability requirementsChoose for cost-sensitive industrial applications where 2.5 V I/O and JTAG are not needed

Compared with CY7C1362BV33-133BZI and AS7C35128PFS-133BIN, the 70V7339S133BCI uniquely delivers bank-switchable arbitration, per-port voltage selection, and integrated JTAG - reducing system-level complexity in high-reliability telecom and medical designs.

Availability

70V7339S133BCI is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, medical imaging systems, and aerospace data acquisition requiring stable component supply across extended product lifecycles.

Supply support for 70V7339S133BCI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and sensor solutions for communications and computing markets.

The 70V7339S series was designed for high-bandwidth, low-latency memory subsystems in telecom switches, network processors, and real-time embedded systems demanding concurrent dual-port access and deterministic timing.

FAQ

What is the maximum guaranteed operating frequency for the 70V7339S133BCI?

The 70V7339S133BCI is rated for 133 MHz operation across the industrial temperature range (–40°C to +85°C). Its AC specifications guarantee 25 ns flow-through clock cycle time (tCYC1) and 7.5 ns pipelined clock cycle time (tCYC2), with 4.2 ns max clock-to-data (tCD2) in pipelined mode. This speed grade is only available in the 256-pin BC256 package.

Does the 70V7339S133BCI support independent I/O voltage levels on its two ports?

Yes, the 70V7339S133BCI supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL to VIH (3.3 V) configures VDDQL for 3.3 V operation, while setting it to VIL (0 V) configures VDDQL for 2.5 V. The same applies to OPTR and VDDQR. The core VDD remains fixed at 3.3 V ±150 mV.

How does bank-switching prevent data corruption in the 70V7339S133BCI?

The 70V7339S133BCI uses BA0–BA5 pins on each port to select one of 64 independent 8K × 18 banks. If both ports attempt to access the same bank simultaneously, neither access is valid and data may be corrupted during writes or invalid during reads. The architecture requires software/hardware coordination to ensure BA0L–BA5L ≠ BA0R–BA5R at all times - no internal arbitration logic is provided.

What JTAG capabilities does the 70V7339S133BCI provide?

The 70V7339S133BCI implements full IEEE 1149.1 JTAG boundary-scan functionality with TDI, TDO, TCK, TMS, and TRST pins. It supports device identification, interconnect testing, and visibility into internal control signals - enabling in-system validation of memory subsystem wiring and signal integrity without physical probe access.

Can the 70V7339S133BCI operate in both pipelined and flow-through output modes simultaneously?

Yes, the 70V7339S133BCI supports independent output mode configuration per port via PL/FTL (left) and PL/FTR (right) pins. One port can be set to pipelined mode (PL/FTx = VIH) for higher throughput, while the other operates in flow-through mode (PL/FTx = VIL) for minimal latency - enabling asymmetric system timing optimization.

70V7339S133BCI Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
256-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
9Mbit
Memory Organization:
512K x 18
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4.2 ns
Voltage - Supply:
3.15V ~ 3.45V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
256-CABGA (17x17)

70V7339S133BCI FAQ

1.How can I place an order for 70V7339S133BCI through Aetrix?

Please submit a Request for Quotation (RFQ) for 70V7339S133BCI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70V7339S133BCI reliable?

The price and inventory of 70V7339S133BCI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V7339S133BCI is usually 5 days.

3.What payment methods are accepted for 70V7339S133BCI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70V7339S133BCI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70V7339S133BCI?

70V7339S133BCI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70V7339S133BCI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70V7339S133BCI?

For technical support, including 70V7339S133BCI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V7339S133BCI requirements.

6.How does Aetrix verify that 70V7339S133BCI is sourced from the original manufacturer or authorized distributors?

All 70V7339S133BCI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V7339S133BCI meets industry standards.

7.What is the process for return or replacement of 70V7339S133BCI?

All 70V7339S133BCI units undergo pre-shipment inspection (PSI). If there is an issue with 70V7339S133BCI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70V7339S133BCI part is unused and in its original packaging.

Return procedure for 70V7339S133BCI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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