Renesas 70V7339S133BCI8
- Part No.:
- 70V7339S133BCI8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 256-LBGA
- Datasheet:
-
70V7339S133BCI8.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 256CABGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,715
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
70V7339S133BCI8 from Integrated Device Technology is a high-speed 512K × 18 (9 Mbit) synchronous bank-switchable dual-ported SRAM with independent left/right ports, 133 MHz operation (4.2 ns max access), industrial temperature range (–40°C to +85°C), and selectable 3.3 V or 2.5 V I/O interface per port. It enables concurrent read/write access to separate 8K × 18 memory banks in telecom switching fabric and real-time packet buffering systems.
For engineers reviewing the 70V7339S133BCI8 datasheet, 70V7339S133BCI8 pinout, 70V7339S133BCI8 application, or 70V7339S133BCI8 equivalent, key selection criteria include bank-switchable arbitration, pipelined/flow-through output mode selection, JTAG IEEE 1149.1 compliance, dual chip enable for depth expansion, and independent VDDQ voltage control per port.
Technical Context
This device implements a true synchronous SRAM core-not a traditional dual-port-organized into 64 independent 8K × 18 banks. Bank access is controlled directly via six dedicated bank address pins (BA0–BA5) per port, enabling deterministic arbitration without internal contention logic.
Each port features fully registered inputs (address, data, control), self-timed write, and configurable pipeline/flow-through output timing. The 133 MHz speed grade supports industrial temperature operation only in the 256-pin BGA package (BC256), with 4.2 ns clock-to-data valid (tCD1) in flow-through mode and 4.2 ns tCD2 in pipelined mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 512K × 18 (9 Mbit), 64 independent 8K × 18 banks |
| Max Clock Frequency | 133 MHz - enables 7.5 ns minimum cycle time (tCYC2) in pipelined mode |
| Access Time | 4.2 ns (max) - defines worst-case clock-to-output delay for timing closure at 133 MHz |
| I/O Voltage Support | Selectable 3.3 V or 2.5 V per port via OPTL/OPTR pins - allows mixed-voltage system interfacing |
| Operating Temperature | –40°C to +85°C - qualified for industrial embedded and telecom infrastructure use |
| Package | 256-pin BGA (BC256), 17 mm × 17 mm × 1.4 mm, 1.0 mm ball pitch - compatible with standard SMT reflow |
| JTAG Compliance | IEEE 1149.1 - supports boundary-scan testing and in-system debug of memory subsystems |
Pinout & Package
70V7339S133BCI8 is housed in a 256-pin Ball Grid Array (BC256) package with 1.0 mm ball pitch, 17 mm × 17 mm body size, and 1.4 mm height. Power and ground balls are distributed across the array for low-inductance decoupling; VDD (3.3 V core) and VDDQ (3.3 V or 2.5 V I/O) supplies are segregated per port.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port-specific clock input | Synchronous edge-triggered timing reference for all registered inputs and outputs on that port |
| CE0L/CE1L, CE0R/CE1R | Dual chip enable pair per port | Enables depth expansion without external logic: CE0X = L & CE1X = H activates port; both high disables port |
| BA0L–BA5L / BA0R–BA5R | Bank address inputs | Select one of 64 memory banks (0–63); conflict occurs if both ports drive identical BA values simultaneously |
| PL/FTL / PL/FTR | Pipeline/Flow-through mode select | VIH = pipelined (1-cycle latency), VIL = flow-through (0-cycle latency); configures output register bypass |
| OPTL / OPTR | I/O voltage option control | VIL selects 2.5 V I/O levels (VDDQL/VDDQR = 2.5 V); VIH selects 3.3 V (VDDQL/VDDQR = 3.3 V) |
| TMS, TCK, TDI, TDO, TRST | JTAG test interface | Full IEEE 1149.1 boundary-scan support for interconnect validation and memory subsystem diagnostics |
Key Features
| Feature | Design Value |
|---|---|
| Bank-switchable architecture | 64 independent 8K × 18 banks allow concurrent non-conflicting access by left/right ports - eliminates arbitration wait states in burst data paths |
| Selectable output mode | Pipelined (3.4–4.2 ns tCD2) or flow-through (10–15 ns tCD1) output timing - balances latency vs. throughput based on system clock domain requirements |
| Independent I/O voltage control | OPTL/OPTR pins configure each port for 3.3 V or 2.5 V signaling - enables direct interface to mixed-voltage FPGAs or ASICs without level shifters |
| Counter enable & repeat | CNTEN/REPEAT signals control auto-incrementing address counter - simplifies sequential burst reads/writes in packet buffer or FIFO applications |
| Dual chip enables | CE0X/CE1X pair per port supports seamless depth expansion up to 16 Mbit using multiple devices - no external decode logic required |
Applications
| Telecom Switching Fabric | Real-Time Packet Buffering |
|---|---|
|
Use Scenario: High-throughput line cards in carrier-grade routers perform parallel header lookup and payload forwarding. IC Role / Device Role / Timing Role: Dual-port SRAM serves as shared descriptor table and packet buffer memory, with left port handling ingress DMA and right port servicing egress scheduler. Use Value: Bank-switchable architecture prevents port contention during simultaneous ingress/egress bursts, sustaining 133 MHz sustained bandwidth without arbitration stalls. |
Use Scenario: Network interface controllers buffer variable-length Ethernet frames before classification and QoS tagging. IC Role / Device Role / Timing Role: 70V7339S133BCI8 acts as a ping-pong buffer - one port writes incoming frame data while the other reads for processing. Use Value: Flow-through output mode delivers zero-cycle latency reads for fast frame inspection; 2.5 V I/O interface matches FPGA transceiver voltage domains. |
| Industrial Motion Control | Radar Signal Processing |
|
Use Scenario: Multi-axis servo drives require synchronized position/velocity updates between FPGA motion engine and microcontroller host. IC Role / Device Role / Timing Role: Left port interfaces FPGA for real-time trajectory calculation; right port connects to ARM Cortex-M7 for configuration and diagnostics. Use Value: Industrial temperature rating (–40°C to +85°C) ensures reliability in enclosed cabinet environments; JTAG support enables field firmware update verification. |
Use Scenario: Phased-array radar systems digitize and buffer ADC samples prior to FFT computation in FPGA-based beamforming engines. IC Role / Device Role / Timing Role: Dual-port SRAM stores interleaved I/Q sample streams - left port accepts ADC DMA bursts, right port feeds FFT engine with aligned 128-sample blocks. Use Value: Pipelined output mode (tCD2 = 4.2 ns) meets tight timing budgets for 133 MHz FFT clock domains; 9 Mbit capacity supports multi-millisecond dwell-time buffering. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-133BZI | 512K × 18, 133 MHz, 256-pin BGA, but uses conventional dual-port SRAM core (not bank-switchable); no ADS/CNTEN/REPEAT functions | Lacks bank arbitration and counter features - requires external logic for burst address generation and conflict resolution | Choose when legacy design compatibility or simpler timing model is prioritized over advanced burst control |
| AS7C36256B-133BIN | 512K × 18, 133 MHz, 256-pin BGA, but only supports 3.3 V I/O; no VDDQ voltage selection or JTAG | No mixed-voltage I/O or boundary-scan - unsuitable for systems requiring 2.5 V FPGA interfacing or production test coverage | Choose for cost-sensitive industrial controls where 3.3 V-only interface suffices and JTAG is unnecessary |
Compared with CY7C1362BV33-133BZI and AS7C36256B-133BIN, the 70V7339S133BCI8 provides unique bank-switchable arbitration and per-port voltage configurability - eliminating external logic for depth expansion and enabling direct 2.5 V/3.3 V interoperability without level shifters.
Availability
70V7339S133BCI8 is available at Aetrix Electronics and suitable for telecom switching fabric, real-time packet buffering, industrial motion control, and radar signal processing requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for 70V7339S133BCI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.
The 70V7339S product line delivers bank-switchable dual-port SRAMs optimized for deterministic, low-latency data sharing between asynchronous processors, FPGAs, and ASICs in real-time infrastructure systems.
FAQ
What is the maximum operating frequency of the 70V7339S133BCI8?
The 70V7339S133BCI8 is rated for 133 MHz operation, corresponding to a minimum clock cycle time of 7.5 ns in pipelined mode (tCYC2). This speed grade is qualified for industrial temperature range (–40°C to +85°C) and supported exclusively in the 256-pin BC256 BGA package. The 70V7339S133BCI8 achieves 4.2 ns clock-to-data valid (tCD2) in pipelined mode and 15 ns in flow-through mode (tCD1).
Does the 70V7339S133BCI8 support mixed-voltage I/O operation?
Yes, the 70V7339S133BCI8 supports independent 3.3 V or 2.5 V I/O voltage selection per port via the OPTL and OPTR pins. When OPTL = VIL (0 V), the left port operates at 2.5 V I/O levels (VDDQL = 2.5 V); when OPTL = VIH (3.3 V), it operates at 3.3 V. The same applies to the right port via OPTR. The core VDD supply remains fixed at 3.3 V for both configurations.
How does bank-switching work on the 70V7339S133BCI8?
Bank-switching on the 70V7339S133BCI8 is implemented via six dedicated bank address pins per port (BA0L–BA5L and BA0R–BA5R), selecting one of 64 independent 8K × 18 memory banks. Concurrent access to the same bank by both ports invalidates both operations - users must ensure BA values differ (BA0L–BA5L ≠ BA0R–BA5R) to maintain data integrity. This architecture replaces traditional dual-port contention logic with user-directed bank arbitration.
What is the purpose of the CNTEN and REPEAT signals on the 70V7339S133BCI8?
CNTEN enables automatic address increment on each clock cycle, allowing sequential burst access without external address generation. REPEAT resets the internal counter to the last valid address loaded via ADS - useful for circular buffer or ping-pong operation. Both signals operate independently per port and function regardless of CE0/CE1 state, enabling robust burst control in packet processing and motion control applications using the 70V7339S133BCI8.
Is JTAG boundary-scan supported on the 70V7339S133BCI8?
Yes, the 70V7339S133BCI8 fully complies with IEEE 1149.1 JTAG standards, featuring dedicated TMS, TCK, TDI, TDO, and TRST pins. This enables boundary-scan testing of PCB interconnects, in-system programming verification, and diagnostic access to internal memory and control registers - critical for high-reliability telecom and industrial deployments of the 70V7339S133BCI8.
70V7339S133BCI8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 256-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 9Mbit
- Memory Organization:
- 512K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 3.15V ~ 3.45V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-CABGA (17x17)
70V7339S133BCI8 FAQ
1.How can I place an order for 70V7339S133BCI8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 70V7339S133BCI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70V7339S133BCI8 reliable?
The price and inventory of 70V7339S133BCI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V7339S133BCI8 is usually 5 days.
3.What payment methods are accepted for 70V7339S133BCI8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70V7339S133BCI8 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 70V7339S133BCI8?
70V7339S133BCI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 70V7339S133BCI8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70V7339S133BCI8?
For technical support, including 70V7339S133BCI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V7339S133BCI8 requirements.
6.How does Aetrix verify that 70V7339S133BCI8 is sourced from the original manufacturer or authorized distributors?
All 70V7339S133BCI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V7339S133BCI8 meets industry standards.
7.What is the process for return or replacement of 70V7339S133BCI8?
All 70V7339S133BCI8 units undergo pre-shipment inspection (PSI). If there is an issue with 70V7339S133BCI8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70V7339S133BCI8 part is unused and in its original packaging.
Return procedure for 70V7339S133BCI8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
70V7339S133BCI8 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
