Renesas 70V7339S133BF

Overview

70V7339S133BF from IDT (Integrated Device Technology) is a high-speed, synchronous, bank-switchable dual-ported SRAM with 512K × 18-bit (9 Mbit) capacity, organized into 64 independent 8K × 18 banks. It supports 133 MHz operation (7.5 ns clock cycle), industrial temperature range (–40°C to +85°C), and selectable 3.3V/2.5V I/O interface per port via OPT pins. It is used in real-time packet buffering for telecom line cards and FPGA co-processor memory subsystems requiring concurrent read/write access.

For engineers reviewing the 70V7339S133BF datasheet, 70V7339S133BF pinout, 70V7339S133BF application, or 70V7339S133BF equivalent, key selection criteria include bank-switchable arbitration, pipelined/flow-through output mode selection, dual chip enable depth expansion capability, JTAG IEEE 1149.1 compliance, and independent VDDQ voltage control per port.

Technical Context

This device implements a true synchronous dual-port architecture using a bank-switchable SRAM core-not a traditional dual-port SRAM-enabling independent, non-conflicting access to any of 64 banks by left and right ports. Bank selection is controlled directly by BA0–BA5 address lines on each port, with collision detection logic invalidating simultaneous accesses to the same bank.

It features fully registered inputs (address, data, control), supporting tight timing margins: 1.5 ns setup / 0.5 ns hold at 200 MHz, and offers two output modes-pipelined (3.4 ns tCD2 @ 200 MHz) or flow-through (10 ns tCD1 @ 200 MHz)-selected per port via PL/FTL and PL/FTR pins.

Key Specifications

Pinout & Package

70V7339S133BF is packaged in a 208-pin fine-pitch Ball Grid Array (fpBGA), body size ≈15 mm × 15 mm × 1.4 mm, 0.8 mm ball pitch. Pin functions are symmetric across left (L) and right (R) ports, with dedicated bank address (BA0–BA5), clock (CLKL/CLKR), read/write (R/WL/R/WR), chip enables (CE0L/CE1L, CE0R/CE1R), byte enables (UBL/LBL, UBR/LBR), and JTAG (TCK/TMS/TDI/TDO/TRST) signals.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-ported SRAM applications.

Compared with CY7C1362BV33-133AXC and AS7C35128PFS-133BIN, the 70V7339S133BF uniquely delivers bank-switchable arbitration, per-port I/O voltage flexibility, and integrated JTAG - making it suitable for high-reliability, heterogeneous-interface systems where deterministic access and debug integration are mandatory.

Availability

70V7339S133BF is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, avionics data acquisition, and FPGA co-processor memory subsystems requiring stable component supply across extended product lifecycles.

Supply support for 70V7339S133BF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, specializes in high-performance timing, memory interface, and RF power solutions for communications and computing markets.

The 70V7339S series was designed specifically for bandwidth-intensive, low-latency dual-access memory applications in telecom, test equipment, and real-time control systems - emphasizing bank arbitration, flexible I/O voltage, and IEEE-compliant testability.

FAQ

What is the maximum operating frequency supported by the 70V7339S133BF?

The 70V7339S133BF is rated for 133 MHz operation (7.5 ns clock cycle time) across the full industrial temperature range (–40°C to +85°C). This speed grade is validated for both commercial and industrial grades and is supported in the BF208 fpBGA package. Higher speeds (166 MHz, 200 MHz) are available in other variants but not in this specific speed/package combination.

Does the 70V7339S133BF support independent I/O voltage levels on its two ports?

Yes, the 70V7339S133BF supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL to VIL configures the left port for 2.5V operation (requiring VDDQL = 2.5V), while setting OPTR to VIH configures the right port for 3.3V operation (requiring VDDQR = 3.3V). This enables direct interfacing with mixed-voltage system components without external level shifters.

How does bank switching work in the 70V7339S133BF, and what happens during a bank conflict?

The 70V7339S133BF divides its 9 Mbit array into 64 independent 8K × 18 banks, selected by BA0–BA5 on each port. If both ports assert identical bank addresses simultaneously, neither access is valid - writes may corrupt data, and reads return invalid output. The device provides no automatic resolution; conflict avoidance must be implemented in system logic or firmware.

What output modes does the 70V7339S133BF support, and how are they selected?

The 70V7339S133BF supports two output modes: pipelined (1-cycle latency) and flow-through (0-cycle latency). Mode selection is per port via PL/FTL (left) and PL/FTR (right) pins: VIH enables pipelined mode (tCD2 = 4.2 ns @ 133 MHz), VIL enables flow-through mode (tCD1 = 15 ns @ 133 MHz). The mode is static during operation and must be set before clock initiation.

Is JTAG boundary-scan supported on the 70V7339S133BF, and which standard does it comply with?

Yes, the 70V7339S133BF includes full IEEE 1149.1-compliant JTAG boundary-scan logic with TCK, TMS, TDI, TDO, and TRST pins. This enables in-system testing, interconnect verification, and programming support without requiring additional test fixtures - a key requirement for high-reliability telecom and avionics applications where the 70V7339S133BF is deployed.