Renesas 70V7339S133BFI

Overview

70V7339S133BFI from IDT (Integrated Device Technology) is a high-speed, synchronous, bank-switchable dual-ported SRAM with 512K × 18-bit (9 Mbit) capacity, organized into 64 independent 8K × 18 banks. It supports 133 MHz operation (7.5 ns cycle time), industrial temperature range (–40°C to +85°C), and selectable 2.5V/3.3V I/O interfaces per port. It is used in real-time packet buffering for telecom line cards and FPGA co-processing memory subsystems.

For engineers reviewing the 70V7339S133BFI datasheet, 70V7339S133BFI pinout, 70V7339S133BFI application, or 70V7339S133BFI equivalent, key selection criteria include dual-port latency tolerance, bank-switching control granularity, pipelined vs. flow-through output mode trade-offs, and independent VDDQ voltage configuration per port.

Technical Context

The 70V7339S133BFI implements a true SRAM core-not a traditional dual-port-enabling bank-switchable access where each port independently selects one of 64 banks via BA0–BA5 address lines. Conflicts occur only when both ports target identical banks simultaneously, causing invalid access and potential data corruption.

It features fully synchronous operation on both ports with register-controlled inputs (address, control, data), enabling tight timing margins: 1.5 ns setup and 0.5 ns hold at 133 MHz. The device supports JTAG IEEE 1149.1 for boundary-scan testing and includes counter-enable/repeat logic for burst address generation without external logic.

Key Specifications

Pinout & Package

70V7339S133BFI is housed in a 208-pin fine-pitch Ball Grid Array (fpBGA) package, designated BF208, with 15 mm × 15 mm body size and 0.8 mm ball pitch. All VDD pins require 3.3 V supply; VDDQL/VDDQR must match the selected I/O voltage (2.5 V or 3.3 V) per port as set by OPTL/OPTR.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Compared with CY7C1362BV33-133BZI and AS7C331024B-133BIN, the 70V7339S133BFI uniquely combines per-port voltage configurability, bank-switch arbitration, and JTAG testability in a 208-pin fpBGA - reducing system-level complexity for mixed-voltage, safety-critical dual-access designs.

Availability

70V7339S133BFI is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, avionics data acquisition, and FPGA-accelerated computing requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 70V7339S133BFI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance timing, memory interface, and RF solutions for communications, computing, and industrial markets.

The 70V7339S product line targets high-bandwidth, low-latency dual-access memory applications in telecom line cards, test equipment, and real-time embedded systems requiring deterministic concurrent read/write capability.

FAQ

What is the maximum guaranteed operating frequency of the 70V7339S133BFI?

The 70V7339S133BFI is rated for 133 MHz operation (7.5 ns clock cycle time) across the full industrial temperature range (–40°C to +85°C). This speed grade is validated for both commercial and industrial grades and applies to either pipelined or flow-through output modes. The device achieves 4.2 ns clock-to-data valid (tCD2) in pipelined mode at this frequency, making it suitable for demanding real-time buffering applications.

Does the 70V7339S133BFI support mixed-voltage operation between its two ports?

Yes, the 70V7339S133BFI supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL = VIL configures the left port for 2.5 V operation (requiring VDDQL = 2.5 V), while OPTR = VIH configures the right port for 3.3 V (requiring VDDQR = 3.3 V). This enables direct interfacing with heterogeneous logic families - for example, a 2.5 V FPGA core and 3.3 V microcontroller bus - without external level shifters.

How does bank switching prevent port contention in the 70V7339S133BFI?

The 70V7339S133BFI organizes memory into 64 independent 8K × 18 banks. Each port selects its target bank using BA0L–BA5L or BA0R–BA5R. If both ports assert identical bank addresses simultaneously, the access is invalidated for both - potentially corrupting write data or returning invalid reads. Therefore, system firmware or hardware must ensure BA sets differ, enabling true concurrent access to disjoint memory regions without arbitration logic.

What is the purpose of the REPEATL and REPEATR signals in the 70V7339S133BFI?

REPEATL and REPEATR reset the internal address counter to the last valid address loaded via ADSL or ADSR, respectively. When asserted (REPEATX = VIL), the counter reuses that address instead of incrementing. This enables efficient burst reads/writes to the same location or looping over small data blocks - reducing address bus activity and host CPU overhead in streaming applications like packet processing or sensor logging.

Is JTAG boundary-scan supported on the 70V7339S133BFI, and which pins are used?

Yes, the 70V7339S133BFI implements IEEE 1149.1 JTAG boundary-scan functionality using dedicated pins: TDI (A4), TDO (A3), TCK (T2), TMS (U4), and TRST (P5). These signals operate at up to 10 MHz and support full interconnect testing, making the 70V7339S133BFI suitable for high-reliability PCB assemblies where test access is constrained by density or shielding requirements.