Renesas 70V7339S166BC8
- Part No.:
- 70V7339S166BC8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 256-LBGA
- Datasheet:
-
70V7339S166BC8.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 256CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
70V7339S166BC8 from Integrated Device Technology is a high-speed 512K × 18 (9 Mbit) synchronous bank-switchable dual-ported SRAM with independent left/right ports, 166 MHz operation at industrial temperature (−40°C to +85°C), 3.6 ns max clock-to-data-out in pipelined mode, and selectable 3.3 V or 2.5 V I/O interface per port. It serves as shared memory in real-time DSP systems requiring concurrent read/write access across two processing domains.
For engineers reviewing the 70V7339S166BC8 datasheet, 70V7339S166BC8 pinout, 70V7339S166BC8 application, or 70V7339S166BC8 equivalent, key selection criteria include bank-switchable arbitration for non-blocking multi-port access, JTAG IEEE 1149.1 compliance for boundary scan, dual chip enables for seamless depth expansion, and independent OPT-pin-controlled I/O voltage selection per port.
Technical Context
The 70V7339S166BC8 implements a true SRAM core-not traditional dual-port RAM-enabling deterministic bank-switched access across 64 independent 8K × 18 banks. Each port uses separate address decode, bank decode, and I/O control logic, allowing simultaneous access to different banks without contention.
Its timing architecture supports both pipelined (3.6 ns tCD2 @ 166 MHz) and flow-through (12 ns tCD1) output modes, with fully synchronous operation on both ports, 1.5 ns address setup, and self-timed write enabling minimal cycle time. The counter enable (CNTEN) and repeat (REPEAT) features support burst address generation without external logic.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 512K × 18 (9 Mbit), organized as 64 independent 8K × 18 banks for concurrent non-conflicting access |
| Max Operating Frequency | 166 MHz - enables 12.5 ns clock cycle time with full industrial temperature support (−40°C to +85°C) |
| Access Time (tCD2) | 3.6 ns max (pipelined mode) - delivers low-latency data valid after clock edge for real-time pipeline alignment |
| I/O Voltage Support | Selectable 3.3 V or 2.5 V per port via OPTL/OPTR pins - allows mixed-voltage system integration without level shifters |
| Power Supply | 3.3 V ±150 mV core (VDD); separate VDDQL/VDDQR supplies - decouples I/O and core power for noise isolation |
| Package | 256-pin BGA (BC256), 17 mm × 17 mm × 1.4 mm, 1.0 mm ball pitch - compatible with standard SMT reflow profiles |
| JTAG Compliance | IEEE 1149.1 - enables production test, boundary scan, and debug visibility without additional test points |
Pinout & Package
70V7339S166BC8 is housed in a 256-pin Ball Grid Array (BC256) package with 1.0 mm ball pitch, 17 mm × 17 mm body size, and thermal pad-compatible layout. Pin functions are symmetrically distributed across left (L) and right (R) ports, with dedicated VDD, VDDQ, and VSS balls for power integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port-synchronous clock input | Edge-triggered master timing reference for all port operations; requires matched trace length for skew control |
| CE0L/CE1L, CE0R/CE1R | Dual chip enable inputs | Enable depth expansion without external logic: CE0X = active-low, CE1X = active-high for flexible gating |
| BA0L–BA5L, BA0R–BA5R | Bank address inputs | Select one of 64 banks (0–63); conflict occurs if both ports drive identical BAx values simultaneously |
| PL/FTL, PL/FTR | Pipeline/Flow-through mode select | DC-level control (VIH/VIL) to configure output latency: pipelined = 1-cycle delay, flow-through = combinatorial |
| OPTL, OPTR | I/O voltage option control | Set VIH (3.3 V) or VIL (0 V) to configure corresponding VDDQX supply to 3.3 V or 2.5 V independently per port |
| TCK, TMS, TDI, TDO, TRST | JTAG test interface | Standard 5-pin boundary scan chain supporting IEEE 1149.1; TRST is asynchronous reset for TAP controller |
Key Features
| Feature | Design Value |
|---|---|
| Bank-switchable dual-port architecture | 64 independent 8K × 18 banks eliminate arbitration logic; enables deterministic concurrent access when BAx values differ |
| Selectable pipelined or flow-through output | Runtime-configurable latency: pipelined mode reduces tCD2 to 3.6 ns for tight timing closure; flow-through avoids pipeline stalls |
| Independent I/O voltage per port | OPTL/OPTR pins allow left port at 3.3 V and right port at 2.5 V - simplifies interfacing with heterogeneous SoCs/FPGAs |
| Counter enable and repeat functionality | CNTEN and REPEAT signals automate sequential address generation and restart on demand - eliminates external counters |
| Dual chip enables with power-down control | CE0X/CE1X pair provides four power states per port, including full standby (ISB3 ≤ 30 mA) and partial active modes |
| JTAG IEEE 1149.1 compliance | Full boundary-scan support enables PCB-level interconnect testing, fault isolation, and in-system programming verification |
Applications
| Telecom Line Card Buffering | DSP-Based Radar Signal Processing |
|---|---|
|
Use Scenario: High-throughput packet buffering between framer and processor ASICs in OC-48/STM-16 line cards. IC Role / Device Role / Timing Role: Shared memory buffer with simultaneous ingress (framer port) and egress (processor port) access. Use Value: 166 MHz pipelined operation ensures sub-4 ns data availability, meeting 10 Gbps line-rate timing budgets without FIFO staging. |
Use Scenario: Real-time chirp storage and FFT windowing in airborne phased-array radar front-ends. IC Role / Device Role / Timing Role: Dual-port memory for parallel acquisition (ADC DMA port) and computation (DSP core port). Use Value: Bank-switching prevents port contention during burst transfers, sustaining >90% memory bandwidth utilization under jittered sampling clocks. |
| Industrial Motion Controller | Medical Ultrasound Beamforming |
|
Use Scenario: Coordinating servo loop updates and HMI data exchange in multi-axis CNC controllers. IC Role / Device Role / Timing Role: Deterministic memory resource shared between real-time motion engine and Linux-based UI subsystem. Use Value: Industrial −40°C to +85°C rating and 3.6 ns tCD2 guarantee consistent latency across thermal cycling in enclosed cabinets. |
Use Scenario: Storing pre-calculated delay profiles and raw echo samples in portable ultrasound systems. IC Role / Device Role / Timing Role: Low-power dual-port SRAM interfaced to FPGA beamformer and ARM application processor. Use Value: Selectable 2.5 V I/O on processor port cuts dynamic power by 35% vs. 3.3 V, extending battery life without sacrificing bandwidth. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-166AXC | 512K × 18, 166 MHz, 3.3 V only I/O, no OPT-pin voltage selection; 208-pin TQFP package | Lacks per-port voltage flexibility and bank-switching arbitration; requires external level shifters for mixed-voltage designs | Choose when board space permits TQFP and system uses uniform 3.3 V I/O rails. |
| AS7C35128P-166BIN | 512K × 18, 166 MHz, single 3.3 V supply (no VDDQ separation), 256-pin BGA, no JTAG | No IEEE 1149.1 support; lacks CNTEN/REPEAT and bank-address conflict detection logic | Choose for cost-sensitive, non-JTAG production where simplified control logic suffices. |
Compared with CY7C1362BV33-166AXC and AS7C35128P-166BIN, the 70V7339S166BC8 uniquely delivers per-port I/O voltage selection, bank-switch arbitration, and integrated JTAG - making it optimal for complex, mixed-voltage, test-critical embedded systems.
Availability
70V7339S166BC8 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, medical imaging, and defense electronics requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for 70V7339S166BC8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and sensor solutions for communications, computing, and industrial markets.
The 70V7339S166BC8 belongs to IDT's high-speed synchronous dual-port SRAM product line, engineered for deterministic, low-latency shared memory in real-time signal processing and packet-forwarding systems.
FAQ
What is the maximum operating temperature range supported by the 70V7339S166BC8?
The 70V7339S166BC8 is rated for industrial temperature operation from −40°C to +85°C. This specification is validated for the 166 MHz speed grade and applies to the BC256 package variant. The BF208 fpBGA package does not support 166 MHz at industrial temperatures per datasheet note on page 8.
How does bank switching prevent port contention in the 70V7339S166BC8?
The 70V7339S166BC8 uses BA0L–BA5L and BA0R–BA5R to select one of 64 independent banks. If both ports attempt access to the same bank simultaneously, neither operation is valid and data corruption may occur. The device provides no internal arbitration - contention avoidance must be managed by system-level bank address coordination.
Can the left and right ports of the 70V7339S166BC8 operate at different I/O voltages?
Yes. The 70V7339S166BC8 supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL = VIH configures VDDQL for 3.3 V operation; setting OPTL = VIL configures it for 2.5 V. The same applies to OPTR/VDDQR. Core supply VDD remains fixed at 3.3 V.
What is the significance of the PL/FTL and PL/FTR pins on the 70V7339S166BC8?
PL/FTL and PL/FTR are DC-level control inputs that configure each port's output timing mode: VIH selects pipelined mode (3.6 ns tCD2 @ 166 MHz), while VIL selects flow-through mode (12 ns tCD1). These pins must remain stable during operation and are not sampled dynamically - they define static output latency behavior.
Does the 70V7339S166BC8 support JTAG boundary scan, and what pins are required?
Yes, the 70V7339S166BC8 complies with IEEE 1149.1 JTAG. Required pins are TCK (Test Clock), TMS (Test Mode Select), TDI (Test Data In), TDO (Test Data Out), and TRST (Test Reset). All five are assigned to dedicated balls in the BC256 package and require proper termination per JTAG specification.
70V7339S166BC8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 256-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 9Mbit
- Memory Organization:
- 512K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.6 ns
- Voltage - Supply:
- 3.15V ~ 3.45V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-CABGA (17x17)
70V7339S166BC8 FAQ
1.How can I place an order for 70V7339S166BC8 through Aetrix?
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The price and inventory of 70V7339S166BC8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V7339S166BC8 is usually 5 days.
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5.How can I obtain technical support or documentation for 70V7339S166BC8?
For technical support, including 70V7339S166BC8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V7339S166BC8 requirements.
6.How does Aetrix verify that 70V7339S166BC8 is sourced from the original manufacturer or authorized distributors?
All 70V7339S166BC8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V7339S166BC8 meets industry standards.
7.What is the process for return or replacement of 70V7339S166BC8?
All 70V7339S166BC8 units undergo pre-shipment inspection (PSI). If there is an issue with 70V7339S166BC8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70V7339S166BC8 part is unused and in its original packaging.
Return procedure for 70V7339S166BC8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
70V7339S166BC8 Tags

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M24C02-WMN6TP
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