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Renesas 70V7339S166BC8

Part No.:
70V7339S166BC8
Manufacturer:
Renesas
Category:
Memory
Package:
256-LBGA
Datasheet:
Aetrix70V7339S166BC8.pdf
Description:
IC SRAM 9MBIT PARALLEL 256CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,718

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Product details

Overview

70V7339S166BC8 from Integrated Device Technology is a high-speed 512K × 18 (9 Mbit) synchronous bank-switchable dual-ported SRAM with independent left/right ports, 166 MHz operation at industrial temperature (−40°C to +85°C), 3.6 ns max clock-to-data-out in pipelined mode, and selectable 3.3 V or 2.5 V I/O interface per port. It serves as shared memory in real-time DSP systems requiring concurrent read/write access across two processing domains.

For engineers reviewing the 70V7339S166BC8 datasheet, 70V7339S166BC8 pinout, 70V7339S166BC8 application, or 70V7339S166BC8 equivalent, key selection criteria include bank-switchable arbitration for non-blocking multi-port access, JTAG IEEE 1149.1 compliance for boundary scan, dual chip enables for seamless depth expansion, and independent OPT-pin-controlled I/O voltage selection per port.

Technical Context

The 70V7339S166BC8 implements a true SRAM core-not traditional dual-port RAM-enabling deterministic bank-switched access across 64 independent 8K × 18 banks. Each port uses separate address decode, bank decode, and I/O control logic, allowing simultaneous access to different banks without contention.

Its timing architecture supports both pipelined (3.6 ns tCD2 @ 166 MHz) and flow-through (12 ns tCD1) output modes, with fully synchronous operation on both ports, 1.5 ns address setup, and self-timed write enabling minimal cycle time. The counter enable (CNTEN) and repeat (REPEAT) features support burst address generation without external logic.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 512K × 18 (9 Mbit), organized as 64 independent 8K × 18 banks for concurrent non-conflicting access
Max Operating Frequency 166 MHz - enables 12.5 ns clock cycle time with full industrial temperature support (−40°C to +85°C)
Access Time (tCD2) 3.6 ns max (pipelined mode) - delivers low-latency data valid after clock edge for real-time pipeline alignment
I/O Voltage Support Selectable 3.3 V or 2.5 V per port via OPTL/OPTR pins - allows mixed-voltage system integration without level shifters
Power Supply 3.3 V ±150 mV core (VDD); separate VDDQL/VDDQR supplies - decouples I/O and core power for noise isolation
Package 256-pin BGA (BC256), 17 mm × 17 mm × 1.4 mm, 1.0 mm ball pitch - compatible with standard SMT reflow profiles
JTAG Compliance IEEE 1149.1 - enables production test, boundary scan, and debug visibility without additional test points

Pinout & Package

70V7339S166BC8 is housed in a 256-pin Ball Grid Array (BC256) package with 1.0 mm ball pitch, 17 mm × 17 mm body size, and thermal pad-compatible layout. Pin functions are symmetrically distributed across left (L) and right (R) ports, with dedicated VDD, VDDQ, and VSS balls for power integrity.

Pin/Terminal Circuit Role Design Meaning
CLKL / CLKR Port-synchronous clock input Edge-triggered master timing reference for all port operations; requires matched trace length for skew control
CE0L/CE1L, CE0R/CE1R Dual chip enable inputs Enable depth expansion without external logic: CE0X = active-low, CE1X = active-high for flexible gating
BA0L–BA5L, BA0R–BA5R Bank address inputs Select one of 64 banks (0–63); conflict occurs if both ports drive identical BAx values simultaneously
PL/FTL, PL/FTR Pipeline/Flow-through mode select DC-level control (VIH/VIL) to configure output latency: pipelined = 1-cycle delay, flow-through = combinatorial
OPTL, OPTR I/O voltage option control Set VIH (3.3 V) or VIL (0 V) to configure corresponding VDDQX supply to 3.3 V or 2.5 V independently per port
TCK, TMS, TDI, TDO, TRST JTAG test interface Standard 5-pin boundary scan chain supporting IEEE 1149.1; TRST is asynchronous reset for TAP controller

Key Features

Feature Design Value
Bank-switchable dual-port architecture 64 independent 8K × 18 banks eliminate arbitration logic; enables deterministic concurrent access when BAx values differ
Selectable pipelined or flow-through output Runtime-configurable latency: pipelined mode reduces tCD2 to 3.6 ns for tight timing closure; flow-through avoids pipeline stalls
Independent I/O voltage per port OPTL/OPTR pins allow left port at 3.3 V and right port at 2.5 V - simplifies interfacing with heterogeneous SoCs/FPGAs
Counter enable and repeat functionality CNTEN and REPEAT signals automate sequential address generation and restart on demand - eliminates external counters
Dual chip enables with power-down control CE0X/CE1X pair provides four power states per port, including full standby (ISB3 ≤ 30 mA) and partial active modes
JTAG IEEE 1149.1 compliance Full boundary-scan support enables PCB-level interconnect testing, fault isolation, and in-system programming verification

Applications

Telecom Line Card Buffering DSP-Based Radar Signal Processing

Use Scenario: High-throughput packet buffering between framer and processor ASICs in OC-48/STM-16 line cards.

IC Role / Device Role / Timing Role: Shared memory buffer with simultaneous ingress (framer port) and egress (processor port) access.

Use Value: 166 MHz pipelined operation ensures sub-4 ns data availability, meeting 10 Gbps line-rate timing budgets without FIFO staging.

Use Scenario: Real-time chirp storage and FFT windowing in airborne phased-array radar front-ends.

IC Role / Device Role / Timing Role: Dual-port memory for parallel acquisition (ADC DMA port) and computation (DSP core port).

Use Value: Bank-switching prevents port contention during burst transfers, sustaining >90% memory bandwidth utilization under jittered sampling clocks.

Industrial Motion Controller Medical Ultrasound Beamforming

Use Scenario: Coordinating servo loop updates and HMI data exchange in multi-axis CNC controllers.

IC Role / Device Role / Timing Role: Deterministic memory resource shared between real-time motion engine and Linux-based UI subsystem.

Use Value: Industrial −40°C to +85°C rating and 3.6 ns tCD2 guarantee consistent latency across thermal cycling in enclosed cabinets.

Use Scenario: Storing pre-calculated delay profiles and raw echo samples in portable ultrasound systems.

IC Role / Device Role / Timing Role: Low-power dual-port SRAM interfaced to FPGA beamformer and ARM application processor.

Use Value: Selectable 2.5 V I/O on processor port cuts dynamic power by 35% vs. 3.3 V, extending battery life without sacrificing bandwidth.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1362BV33-166AXC 512K × 18, 166 MHz, 3.3 V only I/O, no OPT-pin voltage selection; 208-pin TQFP package Lacks per-port voltage flexibility and bank-switching arbitration; requires external level shifters for mixed-voltage designs Choose when board space permits TQFP and system uses uniform 3.3 V I/O rails.
AS7C35128P-166BIN 512K × 18, 166 MHz, single 3.3 V supply (no VDDQ separation), 256-pin BGA, no JTAG No IEEE 1149.1 support; lacks CNTEN/REPEAT and bank-address conflict detection logic Choose for cost-sensitive, non-JTAG production where simplified control logic suffices.

Compared with CY7C1362BV33-166AXC and AS7C35128P-166BIN, the 70V7339S166BC8 uniquely delivers per-port I/O voltage selection, bank-switch arbitration, and integrated JTAG - making it optimal for complex, mixed-voltage, test-critical embedded systems.

Availability

70V7339S166BC8 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, medical imaging, and defense electronics requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for 70V7339S166BC8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and sensor solutions for communications, computing, and industrial markets.

The 70V7339S166BC8 belongs to IDT's high-speed synchronous dual-port SRAM product line, engineered for deterministic, low-latency shared memory in real-time signal processing and packet-forwarding systems.

FAQ

What is the maximum operating temperature range supported by the 70V7339S166BC8?

The 70V7339S166BC8 is rated for industrial temperature operation from −40°C to +85°C. This specification is validated for the 166 MHz speed grade and applies to the BC256 package variant. The BF208 fpBGA package does not support 166 MHz at industrial temperatures per datasheet note on page 8.

How does bank switching prevent port contention in the 70V7339S166BC8?

The 70V7339S166BC8 uses BA0L–BA5L and BA0R–BA5R to select one of 64 independent banks. If both ports attempt access to the same bank simultaneously, neither operation is valid and data corruption may occur. The device provides no internal arbitration - contention avoidance must be managed by system-level bank address coordination.

Can the left and right ports of the 70V7339S166BC8 operate at different I/O voltages?

Yes. The 70V7339S166BC8 supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL = VIH configures VDDQL for 3.3 V operation; setting OPTL = VIL configures it for 2.5 V. The same applies to OPTR/VDDQR. Core supply VDD remains fixed at 3.3 V.

What is the significance of the PL/FTL and PL/FTR pins on the 70V7339S166BC8?

PL/FTL and PL/FTR are DC-level control inputs that configure each port's output timing mode: VIH selects pipelined mode (3.6 ns tCD2 @ 166 MHz), while VIL selects flow-through mode (12 ns tCD1). These pins must remain stable during operation and are not sampled dynamically - they define static output latency behavior.

Does the 70V7339S166BC8 support JTAG boundary scan, and what pins are required?

Yes, the 70V7339S166BC8 complies with IEEE 1149.1 JTAG. Required pins are TCK (Test Clock), TMS (Test Mode Select), TDI (Test Data In), TDO (Test Data Out), and TRST (Test Reset). All five are assigned to dedicated balls in the BC256 package and require proper termination per JTAG specification.

70V7339S166BC8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
256-LBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
9Mbit
Memory Organization:
512K x 18
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.6 ns
Voltage - Supply:
3.15V ~ 3.45V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
256-CABGA (17x17)

70V7339S166BC8 FAQ

1.How can I place an order for 70V7339S166BC8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 70V7339S166BC8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70V7339S166BC8 reliable?

The price and inventory of 70V7339S166BC8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V7339S166BC8 is usually 5 days.

3.What payment methods are accepted for 70V7339S166BC8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70V7339S166BC8 transactions.

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4.How is shipping managed for 70V7339S166BC8?

70V7339S166BC8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70V7339S166BC8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70V7339S166BC8?

For technical support, including 70V7339S166BC8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V7339S166BC8 requirements.

6.How does Aetrix verify that 70V7339S166BC8 is sourced from the original manufacturer or authorized distributors?

All 70V7339S166BC8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V7339S166BC8 meets industry standards.

7.What is the process for return or replacement of 70V7339S166BC8?

All 70V7339S166BC8 units undergo pre-shipment inspection (PSI). If there is an issue with 70V7339S166BC8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70V7339S166BC8 part is unused and in its original packaging.

Return procedure for 70V7339S166BC8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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