Renesas 70V7339S166BCGI

Overview

70V7339S166BCGI from IDT (Integrated Device Technology) is a high-speed, synchronous, bank-switchable dual-ported SRAM with 512K × 18-bit (9 Mbit) capacity, organized into 64 independent 8K × 18 banks. It supports 166 MHz operation at industrial temperature (−40°C to +85°C), delivers 3.6 ns clock-to-data-out in pipelined mode, and features separate 3.3 V core and selectable 3.3 V/2.5 V I/O supplies per port. It is used in real-time packet buffering for telecom line cards and FPGA co-processor memory interfaces.

For engineers reviewing the 70V7339S166BCGI datasheet, 70V7339S166BCGI pinout, 70V7339S166BCGI application, or 70V7339S166BCGI equivalent, key selection considerations include bank-switchable arbitration for concurrent port access, JTAG IEEE 1149.1 compliance for boundary scan, dual chip enables for depth expansion without glue logic, and independent OPT-pin-controlled I/O voltage selection per port.

Technical Context

The 70V7339S166BCGI implements a true SRAM core-not a traditional dual-port-enabling bank-switchable access where each port independently selects one of 64 banks via BA0–BA5 address lines. Conflicting simultaneous accesses to the same bank by both ports result in invalid data and are explicitly prohibited by design.

It supports two output timing modes: pipelined (3.6 ns tCD2 @ 166 MHz) for burst throughput, and flow-through (12 ns tCD1) for low-latency deterministic reads. All control, address, and data inputs are registered, enabling tight setup/hold margins (1.7 ns setup, 0.5 ns hold @ 166 MHz) and full synchronous operation on both ports.

Key Specifications

Pinout & Package

70V7339S166BCGI is housed in a 256-pin Ball Grid Array (BCG256) package, 17 mm × 17 mm body, 1.0 mm ball pitch, with exposed thermal pad. Power and ground balls are distributed across the array for low-inductance decoupling; VDD (3.3 V core) and VDDQ (I/O supply) pins are segregated per port.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Compared with CY7C1362BV33-166AXC and AS7C36256B-166BIN, the 70V7339S166BCGI uniquely delivers per-port I/O voltage selection, IEEE 1149.1 JTAG, and hardware-enforced bank-switching - reducing system-level logic count and enabling robust testability in safety-critical deployments.

Availability

70V7339S166BCGI is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, and avionics data acquisition requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 70V7339S166BCGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.

The 70V7339S product line targets high-bandwidth, low-latency memory subsystems in real-time systems - emphasizing bank-switchable concurrency, flexible I/O voltage, and JTAG-enabled testability for mission-critical applications.

FAQ

What is the maximum operating frequency of the 70V7339S166BCGI?

The 70V7339S166BCGI is rated for 166 MHz operation across the industrial temperature range (−40°C to +85°C). This corresponds to a minimum clock cycle time of 6 ns in pipelined mode. The device achieves this speed with 3.6 ns clock-to-data-out (tCD2) and supports full synchronous operation on both ports with registered inputs and outputs.

Does the 70V7339S166BCGI support both 3.3 V and 2.5 V I/O interfaces simultaneously?

Yes, the 70V7339S166BCGI supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL to VIH configures the left port for 3.3 V I/O operation (with VDDQL = 3.3 V), while setting OPTR to VIL configures the right port for 2.5 V I/O operation (with VDDQR = 2.5 V). This enables direct interfacing with mixed-voltage SoCs or FPGAs.

How does bank switching work in the 70V7339S166BCGI, and what happens if both ports access the same bank?

The 70V7339S166BCGI uses BA0–BA5 pins on each port to select one of 64 independent 8K × 18 banks. If both ports attempt to access the same bank simultaneously, neither access is guaranteed valid: writes may corrupt data, and reads may return invalid output. System-level logic must ensure BA0L–BA5L ≠ BA0R–BA5R to maintain data integrity.

What is the purpose of the PL/FTL and PL/FTR pins on the 70V7339S166BCGI?

The PL/FTL (left port) and PL/FTR (right port) pins configure the output timing path: VIH selects pipelined mode (3.6 ns tCD2 @ 166 MHz), while VIL selects flow-through mode (12 ns tCD1). This DC-selectable mode allows optimization for either high-throughput burst transfers (pipelined) or deterministic zero-cycle-read latency (flow-through), independently per port.

Is JTAG support available on the 70V7339S166BCGI, and which standard does it comply with?

Yes, the 70V7339S166BCGI includes full IEEE 1149.1-compliant JTAG boundary-scan support via dedicated TDI, TDO, TCK, TMS, and TRST pins. This enables automated PCB testing, in-system programming verification, and debug visibility without requiring additional test points or probes - critical for high-reliability industrial and aerospace applications.