Renesas 70V7339S166BF

Overview

70V7339S166BF from Integrated Device Technology is a high-speed 512K × 18 (9 Mbit) synchronous bank-switchable dual-ported SRAM with independent left/right ports, 166 MHz operation (3.6 ns access), industrial temperature support (−40°C to +85°C), and selectable 3.3 V or 2.5 V I/O interface per port. It enables concurrent read/write access to separate 8K × 18 memory banks in telecom packet buffering and real-time DSP co-processing systems.

For engineers reviewing the 70V7339S166BF datasheet, 70V7339S166BF pinout, 70V7339S166BF application, or 70V7339S166BF equivalent, key selection criteria include bank-switchable arbitration for non-blocking dual-port access, pipelined/flow-through output mode selection, JTAG IEEE 1149.1 compliance, dual chip enable for depth expansion, and independent OPT-pin-controlled I/O voltage per port.

Technical Context

The 70V7339S166BF implements a true synchronous SRAM core-not traditional dual-port-enabling deterministic timing with 5 ns cycle time at 200 MHz and 3.6 ns clock-to-data out in pipelined mode. Its 64 independent 8K × 18 banks are selected via dedicated BA0–BA5 pins per port, allowing user-directed bank arbitration without internal contention logic.

Each port features full register staging on address, control, and data inputs (1.5 ns setup / 0.5 ns hold @ 200 MHz), self-timed write for minimal cycle overhead, and separate byte enables (UBL/LBL, UBR/LBR) supporting 9-bit multiplexed bus matching. JTAG boundary-scan is fully compliant with IEEE 1149.1.

Key Specifications

Pinout & Package

70V7339S166BF is housed in a 208-pin fine-pitch Ball Grid Array (fpBGA) package with 0.8 mm ball pitch and 15 mm × 15 mm footprint. All VDD pins require 3.3 V ±150 mV; VDDQ pins must be supplied at 3.3 V (if corresponding OPT = VIH) or 2.5 V (if OPT = VIL); all VSS pins connect to ground.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-ported SRAM applications.

Compared with 70V7339S166BC, the 70V7339S166BF offers identical functionality in a smaller 208-pin fpBGA but lacks industrial 166 MHz qualification; compared with 70V7339S133BF, it delivers 25% higher bandwidth at the cost of tighter timing margins and higher dynamic current (675 mA vs. 550 mA).

Availability

70V7339S166BF is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, and network switch design requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for production programs.

Supply support for 70V7339S166BF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.

The 70V7339S product line delivers bank-switchable dual-ported SRAMs optimized for deterministic, low-latency concurrent access in real-time packet processing and DSP subsystems.

FAQ

What is the maximum operating frequency of the 70V7339S166BF?

The 70V7339S166BF is rated for 166 MHz operation with a maximum 3.6 ns access time in pipelined mode. This speed grade is qualified for commercial temperature range (0°C to +70°C) only; industrial −40°C to +85°C operation at 166 MHz is not supported in the BF208 package. The device achieves 5 ns cycle time and 14 Gbps aggregate bandwidth when both ports run concurrently at full speed.

Does the 70V7339S166BF support mixed I/O voltages on its two ports?

Yes, the 70V7339S166BF supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL = VIH configures the left port for 3.3 V LVTTL-compatible signaling with VDDQL = 3.3 V, while setting OPTR = VIL configures the right port for 2.5 V operation with VDDQR = 2.5 V. This enables direct interfacing with heterogeneous logic families without level-shifting circuitry.

How does bank switching work in the 70V7339S166BF?

The 70V7339S166BF divides its 512K × 18 memory into 64 independent 8K × 18 banks. Each port selects a target bank using its dedicated BA0L–BA5L or BA0R–BA5R inputs. If both ports attempt to access the same bank simultaneously, neither access is valid and data corruption may occur. Users must ensure BA0L–BA5L ≠ BA0R–BA5R in real-time software or hardware arbitration logic to maintain data integrity.

What is the purpose of the CNTEN and REPEAT signals in the 70V7339S166BF?

CNTEN enables automatic address increment on each rising CLK edge, allowing sequential burst access across bank boundaries (e.g., from Bank 0, address FFFh to Bank 1, address 0h). REPEAT resets the internal counter to the last valid address loaded via ADS, enabling rapid re-access to a known location without reloading the address bus. Both functions simplify DMA and streaming data path design.

Is JTAG boundary-scan supported on the 70V7339S166BF?

Yes, the 70V7339S166BF integrates a fully compliant IEEE 1149.1 JTAG TAP controller with dedicated TCK, TMS, TDI, TDO, and TRST pins. This enables boundary-scan testing, in-system programming verification, and production-level interconnect diagnostics without requiring additional test fixtures or intrusive probing.