Renesas 70V7339S166BF8

Overview

70V7339S166BF8 from IDT (Integrated Device Technology) is a high-speed, 512K × 18-bit synchronous bank-switchable dual-ported SRAM with independent left/right ports, 3.4 ns clock-to-data (pipelined), 166 MHz operation, and industrial temperature support (−40°C to +85°C). It delivers 14 Gbps aggregate bandwidth via full synchronous dual-port operation and supports mixed-voltage I/O (3.3 V or 2.5 V per port) using OPT pins.

For engineers reviewing the 70V7339S166BF8 datasheet, 70V7339S166BF8 pinout, 70V7339S166BF8 application, or 70V7339S166BF8 equivalent, key selection criteria include pipelined/flow-through output mode selection, bank-address-controlled memory access arbitration, dual chip enable for depth expansion, JTAG IEEE 1149.1 compliance, and fpBGA-208 package compatibility with strict VDD/VDDQ power sequencing.

Technical Context

The 70V7339S166BF8 implements a true SRAM core with bank-switchable architecture-64 independent 8K × 18 banks-enabling concurrent non-conflicting accesses across ports when BA0–BA5 differ. Its dual-port control logic enforces bank-level arbitration: simultaneous access to the same bank by both ports invalidates both operations and risks data corruption.

It supports two distinct output timing modes: pipelined (tCD2 = 3.6 ns max at 166 MHz) for burst throughput optimization, and flow-through (tCD1 = 12 ns max) for low-latency deterministic reads. Address strobe (ADS), counter enable (CNTEN), and repeat (REPEAT) signals provide programmable address generation independent of CE/R/W state.

Key Specifications

Pinout & Package

70V7339S166BF8 is housed in a 208-pin fine-pitch Ball Grid Array (fpBGA) package measuring 15 mm × 15 mm × 1.4 mm with 0.8 mm ball pitch. All VDD pins require 3.3 V ±150 mV; VDDQ pins must match OPT pin voltage (3.3 V if OPT = VIH, 2.5 V if OPT = VIL); all VSS pins connect to ground.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Compared with CY7C1362BV33-166AXC and AS7C362000B-166BIN, the 70V7339S166BF8 uniquely combines fpBGA-208 compactness, per-port 2.5 V/3.3 V I/O configurability, IEEE 1149.1 JTAG, and bank-switchable arbitration-making it optimal for space-constrained, mixed-voltage, test-critical telecom and defense systems.

Availability

70V7339S166BF8 is available at Aetrix Electronics and suitable for telecom line cards, network packet buffers, industrial motion controllers, and radar signal processing applications requiring stable component supply, long-term industrial temperature qualification, and fpBGA-208 footprint compatibility.

Supply support for 70V7339S166BF8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and sensor solutions for communications, computing, and industrial markets.

The 70V7339S product line was designed for high-bandwidth, low-latency dual-port buffering in real-time systems-specifically targeting telecom infrastructure, test equipment, and military/aerospace platforms demanding deterministic access, bank-level concurrency, and industrial-grade reliability.

FAQ

What is the maximum operating frequency supported by the 70V7339S166BF8?

The 70V7339S166BF8 is rated for 166 MHz operation in both commercial and industrial temperature ranges. This corresponds to a minimum clock cycle time of 6 ns in pipelined mode (tCYC2), enabling 14 Gbps aggregate bandwidth. It does not support 200 MHz operation-the 70V7339S200 variant is required for that speed grade.

Does the 70V7339S166BF8 support mixed-voltage operation between its left and right ports?

Yes, the 70V7339S166BF8 supports independent I/O voltage selection per port: OPTL configures the left port's VDDQL (3.3 V or 2.5 V), and OPTR configures the right port's VDDQR. Both ports may operate at 3.3 V, both at 2.5 V, or one at each voltage-enabling seamless interfacing with heterogeneous SoCs without external level shifters.

How does bank arbitration work in the 70V7339S166BF8, and what happens during a bank conflict?

Bank arbitration in the 70V7339S166BF8 is controlled directly by BA0–BA5 inputs on each port. If both ports assert identical bank addresses simultaneously, neither access is valid: writes may corrupt data, and reads return invalid output. The device does not resolve conflicts-it relies on system-level coordination (e.g., software or hardware semaphore) to ensure BA values differ before concurrent access.

What is the purpose of the REPEAT and CNTEN signals in the 70V7339S166BF8?

The CNTEN signal enables automatic address incrementing on each clock edge, while REPEAT resets the internal address counter to the last valid address loaded via ADS. Together, they enable hardware-accelerated sequential access (e.g., FIFO or circular buffer behavior) without CPU overhead-critical for real-time streaming applications like radar sampling or packet forwarding.

Is JTAG boundary-scan supported on the 70V7339S166BF8, and which standards does it comply with?

Yes, the 70V7339S166BF8 fully supports IEEE 1149.1 JTAG boundary-scan via dedicated TMS, TCK, TDO, TDI, and TRST pins. This enables PCB-level interconnect testing, in-system programming verification, and debug visibility into memory subsystem timing margins-without requiring functional access to the SRAM array itself.