Renesas 70V7339S166BFG
- Part No.:
- 70V7339S166BFG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 208-LFBGA
- Datasheet:
-
70V7339S166BFG.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 208CABGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,678
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Product details
Overview
70V7339S166BFG from Integrated Device Technology is a high-speed 512K × 18 (9 Mbit) synchronous bank-switchable dual-ported SRAM with independent left/right ports, 166 MHz operation (3.6 ns access), industrial temperature support (−40°C to +85°C), and selectable 3.3 V or 2.5 V I/O interface per port. It enables concurrent read/write access to separate 8K × 18 memory banks in telecom switching fabric and real-time packet buffering.
For engineers reviewing the 70V7339S166BFG datasheet, 70V7339S166BFG pinout, 70V7339S166BFG application, or 70V7339S166BFG equivalent, key selection criteria include bank-switchable arbitration, pipelined/flow-through output mode selection, JTAG IEEE 1149.1 compliance, dual chip enable for depth expansion, and independent VDDQ voltage control per port.
Technical Context
This device implements a true synchronous SRAM core-not traditional dual-port-enabling deterministic timing with register-controlled address/data/control inputs. Each port features dedicated bank address pins (BA0–BA5), counter enable (CNTEN), repeat (REPEAT), and pipeline/flow-through mode selection (PL/FTL/R).
Full port independence includes separate clock domains, asynchronous OE, and dual CE0/CE1 logic per port. Bank conflict detection is user-managed: simultaneous access to identical banks by both ports invalidates both operations, requiring external arbitration logic or software coordination.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 512K × 18 (9 Mbit), 64 independent 8K × 18 banks |
| Max Clock Frequency | 166 MHz (industrial temp), enabling 5 ns cycle time in pipelined mode |
| Access Time | 3.6 ns (max) at 166 MHz - defines minimum clock-to-data-out latency for pipelined reads |
| I/O Voltage Support | Selectable 3.3 V (±150 mV) or 2.5 V (±100 mV) per port via OPTL/OPTR pins |
| Operating Temperature | −40°C to +85°C (industrial grade), validated for 166 MHz operation |
| Package | 208-pin fine-pitch BGA (BF208), 15 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch |
| JTAG Compliance | Fully supports IEEE 1149.1 boundary-scan for test and debug |
Pinout & Package
70V7339S166BFG is housed in a 208-pin fine-pitch Ball Grid Array (fpBGA, package code BF208) with 0.8 mm ball pitch and 15 mm × 15 mm footprint. Power delivery requires 3.3 V core (VDD) and separately configurable I/O supplies (VDDQL/VDDQR) tied to OPTL/OPTR logic levels.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port-specific clock input | Synchronous edge-triggered timing reference for all port registers; no internal PLL |
| BA0L–BA5L / BA0R–BA5R | Bank address inputs | Select one of 64 memory banks (0–63); conflict occurs if both ports drive identical BA values |
| PL/FTL / PL/FTR | Pipeline/Flow-through mode select | DC-level control: VIH = pipelined (1-cycle latency), VIL = flow-through (0-cycle latency) |
| OPTL / OPTR | I/O voltage option control | VIH → 3.3 V I/O levels & VDDQX = 3.3 V; VIL → 2.5 V I/O levels & VDDQX = 2.5 V |
| CE0L/CE1L / CE0R/CE1R | Dual chip enable logic | Depth expansion without external logic: CE0X = VIL & CE1X = VIH enables port X |
| UBL/LBL / UBR/LBR | Byte enable controls (9-bit bytes) | Independent upper/lower byte masking per port; supports 9-bit bus matching |
Key Features
| Feature | Design Value |
|---|---|
| Bank-switchable architecture | 64 independent 8K × 18 banks allow parallel access to non-overlapping memory regions without arbitration logic |
| Selectable output mode | Pipelined (3.6 ns tCD2) or flow-through (12 ns tCD1) per port - configurable via PL/FT pin, enabling latency vs. timing margin trade-off |
| Counter + repeat functionality | Hardware address counter with REPEAT reset enables burst sequential access without host CPU address incrementing |
| Dual VDDQ per port | Independent 2.5 V / 3.3 V I/O interface on left/right ports allows mixed-voltage system integration (e.g., 2.5 V FPGA + 3.3 V processor) |
| JTAG IEEE 1149.1 support | Full boundary-scan capability for production test, interconnect validation, and in-system debug without additional hardware |
Applications
| Telecom Switching Fabric | Real-Time Packet Buffering |
|---|---|
Use Scenario: High-throughput line cards in carrier-grade routers performing header lookup and forwarding decisions. IC Role / Device Role / Timing Role: Dual-port SRAM acts as shared buffer between ingress and egress ASICs, enabling zero-wait-state concurrent read/write across ports. Use Value: 166 MHz pipelined operation delivers 14 Gbps aggregate bandwidth, supporting OC-192+ line rates with deterministic latency. |
Use Scenario: Deep packet inspection engines requiring low-latency access to multi-gigabit Ethernet frame payloads. IC Role / Device Role / Timing Role: Left port accepts incoming packet data from MAC; right port feeds analysis engine - synchronized via independent clocks. Use Value: Independent bank addressing prevents port contention during burst transfers, eliminating FIFO overflow under traffic spikes. |
| Industrial Motion Control | Medical Imaging Data Pipeline |
Use Scenario: Multi-axis CNC controllers synchronizing servo position updates and trajectory interpolation. IC Role / Device Role / Timing Role: Stores interpolated motion profiles; left port updated by host CPU, right port read by real-time FPGA sequencer. Use Value: Industrial −40°C to +85°C rating ensures reliability in uncooled enclosures; dual CE enables seamless profile swapping without stoppage. |
Use Scenario: MRI or CT scanner front-end systems buffering raw sensor data before reconstruction processing. IC Role / Device Role / Timing Role: Acts as ping-pong buffer between ADC interface (left port) and GPU-based reconstruction engine (right port). Use Value: Selectable 2.5 V I/O on ADC side reduces noise coupling; 3.3 V on GPU side matches interface standards - all within single device. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-ported SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-166AXC | 512K × 18, 166 MHz, 256-pin BGA, fixed 3.3 V I/O only (no 2.5 V option) | Lacks per-port VDDQ selection; requires external level-shifting for mixed-voltage systems | Preferred when system uses uniform 3.3 V signaling and larger BGA footprint is acceptable |
| IDT70V9369S166BG | 256K × 18 (4.5 Mbit), same 166 MHz speed, 208-pin fpBGA, identical VDDQ flexibility | Half memory depth; suitable for lower-bandwidth control-plane buffers but insufficient for full packet buffering | Valid drop-in replacement where 4.5 Mbit capacity meets design requirements and pinout matches |
Compared with CY7C1362BV33-166AXC and IDT70V9369S166BG, the 70V7339S166BFG uniquely delivers 9 Mbit density in the compact 208-pin fpBGA while retaining per-port 2.5 V/3.3 V I/O configurability - critical for heterogeneous signal chain integration without voltage translation.
Availability
70V7339S166BFG is available at Aetrix Electronics and suitable for telecom switching fabric, real-time packet buffering, and industrial motion control requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for 70V7339S166BFG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.
The 70V7339S product line targets high-bandwidth, low-latency deterministic memory applications in telecom infrastructure and real-time embedded systems - emphasizing bank-switchable concurrency and flexible I/O voltage scaling.
FAQ
What is the maximum operating frequency of the 70V7339S166BFG at industrial temperature?
The 70V7339S166BFG is rated for 166 MHz operation across the full industrial temperature range (−40°C to +85°C). This corresponds to a maximum clock cycle time of 6 ns and pipelined access time of 3.6 ns. Note that this speed grade is not supported in the 208-pin fpBGA package at industrial temperature - however, the BFG suffix confirms this specific variant is qualified for 166 MHz industrial use per IDT documentation.
Can the left and right ports of the 70V7339S166BFG operate at different I/O voltages simultaneously?
Yes. The 70V7339S166BFG supports independent I/O voltage selection per port: OPTL sets VDDQL (left port), and OPTR sets VDDQR (right port). Setting OPTL = VIL and OPTR = VIH configures left port for 2.5 V signaling and right port for 3.3 V signaling - enabling direct interfacing with mixed-voltage SoCs or FPGAs without level shifters.
Does the 70V7339S166BFG support true dual-port concurrent access without arbitration logic?
The 70V7339S166BFG enables concurrent access only to *different* memory banks. If both ports assert identical BA0–BA5 values, the access is invalidated on both sides and data corruption may occur. Therefore, external arbitration or software-enforced bank separation is required - unlike legacy dual-ports with built-in busy logic, this device relies on user-managed bank addressing.
What is the function of the REPEAT pin on the 70V7339S166BFG?
The REPEAT pin (REPEATL/REPEATR) resets the internal address counter to the last valid address loaded via ADS (Address Strobe Enable). When asserted, it enables burst sequential access without host CPU intervention - for example, streaming video frames or sensor samples. The reset value is not power-on default and must be initialized via an ADS cycle during startup.
Is JTAG boundary-scan supported on the 70V7339S166BFG, and which standard does it comply with?
Yes, the 70V7339S166BFG fully supports IEEE 1149.1 JTAG boundary-scan. Pins TDI, TDO, TCK, TMS, and TRST are dedicated for this purpose and operate at the I/O voltage level selected by the corresponding OPT pin. This enables production testing, interconnect verification, and in-system debugging without requiring additional test fixtures.
70V7339S166BFG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 208-LFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 9Mbit
- Memory Organization:
- 512K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.6 ns
- Voltage - Supply:
- 3.15V ~ 3.45V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 208-CABGA (15x15)
70V7339S166BFG FAQ
1.How can I place an order for 70V7339S166BFG through Aetrix?
Please submit a Request for Quotation (RFQ) for 70V7339S166BFG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70V7339S166BFG reliable?
The price and inventory of 70V7339S166BFG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V7339S166BFG is usually 5 days.
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70V7339S166BFG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 70V7339S166BFG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70V7339S166BFG?
For technical support, including 70V7339S166BFG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V7339S166BFG requirements.
6.How does Aetrix verify that 70V7339S166BFG is sourced from the original manufacturer or authorized distributors?
All 70V7339S166BFG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V7339S166BFG meets industry standards.
7.What is the process for return or replacement of 70V7339S166BFG?
All 70V7339S166BFG units undergo pre-shipment inspection (PSI). If there is an issue with 70V7339S166BFG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70V7339S166BFG part is unused and in its original packaging.
Return procedure for 70V7339S166BFG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
70V7339S166BFG Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

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24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
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