Renesas 70V7339S166BFG8

Overview

70V7339S166BFG8 from IDT (Integrated Device Technology) is a high-speed, synchronous, bank-switchable dual-ported SRAM with 512K × 18-bit (9 Mbit) capacity, organized into 64 independent 8K × 18 banks. It supports 166 MHz operation at industrial temperature (−40°C to +85°C), delivers 3.6 ns clock-to-data-out in pipelined mode, and features separate 3.3 V core and selectable 3.3 V/2.5 V I/O supplies per port - enabling use in high-bandwidth packet buffering for telecom line cards and FPGA co-processing interfaces.

For engineers reviewing the 70V7339S166BFG8 datasheet, 70V7339S166BFG8 pinout, 70V7339S166BFG8 application, or 70V7339S166BFG8 equivalent, key selection criteria include bank-switchable arbitration for concurrent port access, JTAG IEEE 1149.1 compliance for boundary-scan testability, flow-through/pipelined output mode selection, and dual chip-enable depth expansion capability without external logic.

Technical Context

The 70V7339S166BFG8 implements a true synchronous dual-port architecture using a bank-switchable SRAM core - not a traditional dual-port SRAM - allowing independent left/right port access to non-overlapping 8K × 18 memory banks controlled via dedicated BA0–BA5 address lines. Conflict detection occurs only when both ports target identical banks simultaneously, causing invalid access and potential data corruption.

Each port includes fully registered control, address, and data paths with 1.5 ns setup / 0.5 ns hold times at 200 MHz, self-timed write for minimal cycle time, and independent OPT pins enabling mixed-voltage I/O operation (3.3 V/2.5 V per port). JTAG TAP controller supports scan-based testing and debug in production and system-level environments.

Key Specifications

Pinout & Package

70V7339S166BFG8 is packaged in a 208-pin fine-pitch Ball Grid Array (fpBGA), body size ≈15 mm × 15 mm × 1.4 mm, 0.8 mm ball pitch. Pin assignments are validated per IDT DSC 5628/12 (October 2019), with dedicated left/right port signals including dual clock (CLKL/CLKR), bank address (BA0L–BA5L / BA0R–BA5R), and independent I/O buses (I/O0L–I/O17L / I/O0R–I/O17R).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Compared with CY7C1362BV33-166AXC and AS7C35128P-166BIN, the 70V7339S166BFG8 uniquely combines bank-switchable arbitration, per-port 2.5 V/3.3 V I/O flexibility, pipelined/flow-through mode selection, and IEEE 1149.1 JTAG - making it optimal for complex, mixed-voltage, high-reliability embedded systems requiring deterministic dual-port access and production test coverage.

Availability

70V7339S166BFG8 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, FPGA co-processing, and automated test equipment requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 70V7339S166BFG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and sensor signal conditioning ICs for communications, computing, and industrial markets.

The 70V7339S166BFG8 belongs to IDT's high-speed synchronous dual-port SRAM product line, designed specifically for applications demanding concurrent, low-latency, bank-arbitrated memory access in telecom, test, and real-time control systems.

FAQ

What is the maximum operating frequency of the 70V7339S166BFG8 under industrial temperature conditions?

The 70V7339S166BFG8 is rated for 166 MHz operation over the full industrial temperature range of −40°C to +85°C. This speed grade is validated for the BF208 fpBGA package and requires VDDQ set to 3.3 V (i.e., OPTL and/or OPTR = VIH) per port. The device achieves a 3.6 ns clock-to-data-out (tCD2) in pipelined mode at this frequency.

Does the 70V7339S166BFG8 support mixed-voltage operation between its left and right ports?

Yes, the 70V7339S166BFG8 supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL = VIH configures VDDQL for 3.3 V operation on the left port, while setting OPTR = VIL configures VDDQR for 2.5 V operation on the right port - enabling direct interfacing with heterogeneous logic families without external level shifters.

How does bank-switching arbitration work in the 70V7339S166BFG8, and what happens during a bank conflict?

Bank access is controlled by BA0L–BA5L and BA0R–BA5R inputs. If both ports attempt to access the same bank simultaneously, neither access is valid: writes may corrupt data, and reads return invalid output. The device does not resolve conflicts automatically - system design must ensure BAx values differ, typically via software coordination or hardware encoding logic.

Can the 70V7339S166BFG8 be used in JTAG-boundary-scan test environments?

Yes, the 70V7339S166BFG8 integrates a fully compliant IEEE 1149.1 JTAG TAP controller with TDI, TDO, TCK, TMS, and TRST pins. It supports standard instruction register operations, data register scanning, and boundary-scan testing - enabling in-circuit verification and fault isolation during PCB assembly and field maintenance.

What are the power supply requirements for the 70V7339S166BFG8 core and I/O domains?

The 70V7339S166BFG8 requires a 3.3 V ±150 mV core supply (VDD) and separate I/O supplies: VDDQL for the left port and VDDQR for the right port. Each VDDQx must match the voltage selected by its OPTx pin - 3.3 V if OPTx = VIH, or 2.5 V if OPTx = VIL. All VSS pins must be connected to ground.