Renesas 70V7339S200BC

Overview

70V7339S200BC from Integrated Device Technology is a high-speed 512K × 18 (9 Mbit) synchronous bank-switchable dual-ported SRAM with independent left/right ports, 200 MHz operation (5 ns cycle time), 3.4 ns clock-to-data-out in pipelined mode, and selectable 3.3 V or 2.5 V I/O interface per port. It enables concurrent access to disjoint 8K × 18 memory banks in real-time networking and packet buffering applications.

For engineers reviewing the 70V7339S200BC datasheet, 70V7339S200BC pinout, 70V7339S200BC application, or 70V7339S200BC equivalent, key selection criteria include bank-switchable arbitration, dual-port timing isolation, JTAG IEEE 1149.1 compliance, industrial-grade 166/133 MHz support, and fpBGA-208 vs BGA-256 package compatibility.

Technical Context

This device implements a true synchronous SRAM core-not traditional dual-port-enabling deterministic bank arbitration via dedicated BA0–BA5 pins per port. Each port operates fully independently with separate clock, control, address, and 18-bit I/O buses, supporting simultaneous read/write across non-overlapping banks.

It supports two output modes: pipelined (3.4 ns tCD2 @ 200 MHz) for burst throughput, and flow-through (10 ns tCD1) for low-latency deterministic access. The counter enable (CNTEN) and repeat (REPEAT) features enable auto-incremented sequential addressing without external logic.

Key Specifications

Pinout & Package

70V7339S200BC is housed in a 208-pin fine-pitch Ball Grid Array (fpBGA) package with 0.8 mm ball pitch and 15 mm × 15 mm footprint. Power delivery includes dedicated VDD (3.3 V core), VDDQL/VDDQR (port-selectable 3.3 V/2.5 V I/O), and multiple VSS balls for low-noise grounding.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Compared with CY7C1362BV33-200AXC and AS7C35128PFS-200BIN, the 70V7339S200BC uniquely delivers bank-switchable arbitration, per-port voltage selection, and JTAG compliance - critical for high-reliability, mixed-voltage, testable systems.

Availability

70V7339S200BC is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, aerospace data recorders, and high-speed test equipment requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 70V7339S200BC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and power management ICs for communications and computing markets.

The 70V7339S product line was designed specifically for high-bandwidth, low-latency dual-access memory applications in networking, test instrumentation, and real-time control systems - emphasizing deterministic timing and flexible voltage interfacing.

FAQ

What is the maximum operating frequency of the 70V7339S200BC?

The 70V7339S200BC is rated for 200 MHz operation in commercial temperature range (0°C to +70°C), delivering a 5 ns clock cycle time and 3.4 ns clock-to-data-out in pipelined mode. Industrial temperature support is limited to 166 MHz and 133 MHz speed grades - the 200 MHz grade is not qualified for −40°C to +85°C operation.

Does the 70V7339S200BC support mixed-voltage operation between its two ports?

Yes, the 70V7339S200BC supports independent I/O voltage selection per port: OPTL configures the left port's VDDQL supply (3.3 V or 2.5 V), and OPTR configures the right port's VDDQR supply. This enables one port to interface with a 3.3 V FPGA while the other connects to a 2.5 V ASIC - no external level shifters required.

How does bank-switching prevent port contention in the 70V7339S200BC?

The 70V7339S200BC uses dedicated BA0L–BA5L and BA0R–BA5R pins to select memory banks. If both ports attempt simultaneous access to the same bank (e.g., BA0L–BA5L = BA0R–BA5R), neither access is valid and data corruption may occur. The design mandates software/hardware coordination to ensure bank addresses differ - no internal arbitration logic is provided.

What is the role of the CNTEN and REPEAT pins on the 70V7339S200BC?

CNTEN enables automatic address increment on each clock rising edge, eliminating CPU overhead for sequential memory access. REPEAT resets the internal counter to the last valid address loaded via ADS - useful for looping over buffers or restarting after error recovery. Both functions operate independently per port and require no external counter logic.

Is JTAG boundary-scan supported on the 70V7339S200BC?

Yes, the 70V7339S200BC integrates a full IEEE 1149.1-compliant JTAG TAP controller with TCK, TMS, TDI, TDO, and TRST pins. This enables boundary-scan testing of PCB interconnects, visibility into internal control states, and in-system programming support - critical for high-reliability system validation.