Renesas 70V7339S200BC8

Overview

70V7339S200BC8 from Integrated Device Technology is a high-speed 512K × 18 (9 Mbit) synchronous bank-switchable dual-ported SRAM with independent left/right ports, 200 MHz operation (5 ns cycle time), 3.4 ns clock-to-data-out in pipelined mode, and selectable 3.3 V or 2.5 V I/O interface per port. It enables concurrent memory access in real-time digital signal processing systems requiring low-latency inter-port data exchange.

For engineers reviewing the 70V7339S200BC8 datasheet, 70V7339S200BC8 pinout, 70V7339S200BC8 application, or 70V7339S200BC8 equivalent, key selection criteria include bank-switchable arbitration logic, dual-voltage I/O support (VDDQ = 2.5 V / 3.3 V), JTAG IEEE 1149.1 compliance, industrial-grade timing at 166 MHz, and fpBGA-208 package compatibility for high-density PCB layouts.

Technical Context

The 70V7339S200BC8 implements a true synchronous SRAM core with 64 independent 8K × 18 banks, where bank selection is controlled directly via BA0–BA5 pins on each port. Its dual-chip-enable architecture supports depth expansion without external logic, and self-timed write enables minimal cycle time.

It supports two output modes-pipelined (3.4 ns tCD2 @ 200 MHz) and flow-through (10 ns tCD1)-with separate byte enables (UBL/LBL, UBR/LBR) for 9-bit bus matching. JTAG boundary-scan is fully compliant with IEEE 1149.1, and counter enable/repeat features allow burst address generation without host intervention.

Key Specifications

Pinout & Package

70V7339S200BC8 is housed in a 208-pin fine-pitch Ball Grid Array (fpBGA) package measuring 15 mm × 15 mm × 1.4 mm with 0.8 mm ball pitch. All VDD pins require 3.3 V ±150 mV; VDDQ pins must match selected I/O voltage (3.3 V if OPT = VIH, 2.5 V if OPT = VIL); all VSS pins connect to ground.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-ported SRAM applications.

Compared with CY7C1362BV33-200AXC and AS7C362000B-200BIN, the 70V7339S200BC8 uniquely delivers bank-switchable arbitration, per-port dual-voltage I/O, and integrated address counter - enabling flexible, high-bandwidth memory sharing in heterogeneous clock domain systems.

Availability

70V7339S200BC8 is available at Aetrix Electronics and suitable for telecom infrastructure, radar signal processing, and industrial motion control applications requiring stable component supply, long-term lifecycle management, and verified fpBGA-208 packaging.

Supply support for 70V7339S200BC8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance timing, memory interface, and RF solutions for communications, computing, and industrial markets.

The 70V7339S product line targets high-speed, low-latency memory subsystems in real-time signal processing and packet-forwarding applications where concurrent dual-port access and flexible voltage interfacing are essential.

FAQ

What is the maximum operating frequency supported by the 70V7339S200BC8?

The 70V7339S200BC8 supports up to 200 MHz operation in commercial temperature range (0°C to +70°C). This speed grade requires VDDQ = 3.3 V on the active port (i.e., OPT pin set to VIH) and is only available in the BC-256 package - not in the fpBGA-208 variant. The 70V7339S200BC8 itself is rated for 200 MHz with 5 ns cycle time and 3.4 ns clock-to-data-out in pipelined mode.

Does the 70V7339S200BC8 support independent I/O voltage selection per port?

Yes, the 70V7339S200BC8 supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL = VIH configures the left port for 3.3 V I/O levels (VDDQL = 3.3 V), while OPTL = VIL selects 2.5 V (VDDQL = 2.5 V); the same applies independently to the right port. Core VDD remains fixed at 3.3 V ±150 mV for both configurations.

How does bank-switching work in the 70V7339S200BC8, and what happens during bank conflicts?

Bank-switching in the 70V7339S200BC8 is controlled by BA0–BA5 pins on each port, selecting one of 64 independent 8K × 18 banks. If both ports attempt access to the same bank simultaneously (BA0L–BA5L = BA0R–BA5R), neither access is valid: writes may corrupt data, and reads return invalid output. The device provides no internal resolution - conflict avoidance must be handled by system-level arbitration logic or software coordination.

What are the key timing differences between pipelined and flow-through output modes in the 70V7339S200BC8?

In pipelined mode (PL/FTL = VIH), the 70V7339S200BC8 delivers data 3.4 ns after clock (tCD2), adding 1-cycle latency but enabling 200 MHz operation. In flow-through mode (PL/FTL = VIL), data appears 10 ns after clock (tCD1) with zero-cycle latency, limiting max frequency to 133 MHz. Mode selection is per-port and static during operation - it cannot be changed dynamically mid-burst.

Is JTAG boundary-scan supported on the 70V7339S200BC8, and which standard does it comply with?

Yes, the 70V7339S200BC8 fully supports JTAG boundary-scan compliant with IEEE 1149.1. Pins TDI, TDO, TCK, TMS, and TRST implement the standard 5-pin test access port (TAP), enabling production testing, interconnect verification, and in-system debugging without requiring physical probe access to internal signals.