My Inquiry
My Account
Renesas 70V7519S133BC8
- Part No.:
- 70V7519S133BC8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 256-LBGA
- Datasheet:
-
70V7519S133BC8.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 256CABGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,489
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
70V7519S133BC8 from Integrated Device Technology is a 256K × 36 synchronous bank-switchable dual-ported SRAM with 9 Mbit capacity, 133 MHz operation (4.2 ns access), industrial temperature support (–40°C to +85°C), and independent 3.3V/2.5V I/O voltage selection per port. It enables high-bandwidth data buffering in telecom line cards requiring concurrent read/write access across two independent memory ports.
For engineers reviewing the 70V7519S133BC8 datasheet, 70V7519S133BC8 pinout, 70V7519S133BC8 application, or 70V7519S133BC8 equivalent, this page delivers verified timing parameters, bank-switching control logic, JTAG-compliant test interface details, and validated alternatives for depth-expanded dual-port memory systems.
Technical Context
The 70V7519S133BC8 implements a true SRAM core organized into 64 independent 4K × 36 banks, enabling non-conflicting concurrent access by left and right ports-provided BA0–BA5 addresses differ. Bank selection is user-controlled via dedicated bank address pins, not internal arbitration logic.
It supports pipelined (3.4–4.2 ns tCD2) or flow-through (10–15 ns tCD1) output modes per port, selectable via PL/FTL and PL/FTR pins. Dual chip enables (CE0/CE1 per port) allow seamless depth expansion without external logic, while counter enable (CNTEN) and repeat (REPEAT) features support burst-mode sequential addressing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36 (9 Mbit), 64 independent 4K × 36 banks |
| Max Clock Frequency | 133 MHz - enables 5.32 Gbps aggregate bandwidth (36-bit × 133 MHz) |
| Access Time | 4.2 ns (max) at 133 MHz - defines minimum clock-to-data valid delay in pipelined mode |
| Operating Temperature | –40°C to +85°C - qualified for industrial embedded and telecom infrastructure use |
| I/O Voltage Support | Selectable 3.3V or 2.5V per port via OPTL/OPTR - allows mixed-voltage system interfacing |
| Package | 256-pin BGA (BC256), 17 mm × 17 mm, 1.0 mm ball pitch - optimized for high-density PCB layouts |
| JTAG Compliance | IEEE 1149.1 - enables boundary-scan testing and in-system debug of memory subsystems |
Pinout & Package
70V7519S133BC8 is housed in a 256-pin Ball Grid Array (BC256) package with 17 mm × 17 mm body size and 1.0 mm ball pitch. Power delivery includes dedicated VDD (3.3V core), VDDQL/VDDQR (port-selectable I/O supply), and multiple VSS balls for low-noise grounding.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port-specific clock inputs | Synchronous edge-triggered timing reference for all register-based operations on left/right port |
| BA0L–BA5L / BA0R–BA5R | Bank address inputs | User-defined 6-bit selection of one of 64 memory banks per port; conflict causes invalid access |
| CE0L/CE1L / CE0R/CE1R | Dual chip enables per port | Enable depth expansion: CE0 active + CE1 inactive = normal operation; both active = power-down |
| PL/FTL / PL/FTR | Pipeline/flow-through mode select | VIH = pipelined (low-latency, 1-cycle delay); VIL = flow-through (zero-cycle latency, higher tCYC) |
| OPTL / OPTR | I/O voltage option control | VIH = 3.3V I/O levels (VDDQX = 3.3V); VIL = 2.5V I/O levels (VDDQX = 2.5V) - independent per port |
| TMS/TCK/TDO/TDI/TRST | JTAG test interface | Full IEEE 1149.1 boundary-scan support for interconnect and memory array verification |
Key Features
| Feature | Design Value |
|---|---|
| Bank-switchable architecture | Enables deterministic, non-arbitrated concurrent access to disjoint 4K × 36 blocks - eliminates bus contention in real-time packet buffers |
| Selectable output mode | Pipelined mode achieves 4.2 ns tCD2 at 133 MHz; flow-through mode eliminates output latency for time-critical control loops |
| Independent I/O voltage per port | Allows left port to interface with 3.3V FPGA fabric while right port connects to 2.5V ASIC - no level-shifting required |
| Dual chip enables | Supports seamless depth expansion across multiple 70V7519S133BC8 devices using only CE0/CE1 signals - no external decode logic needed |
| Counter & repeat functionality | CNTEN enables auto-increment addressing; REPEAT resets counter to last ADS-loaded address - ideal for circular buffer implementations |
Applications
| Telecom Line Card Buffering | Real-Time Signal Processing |
|---|---|
|
Use Scenario: Storing inbound/outbound ATM or Ethernet frames in carrier-grade switching hardware where simultaneous ingress/egress access is required. IC Role / Device Role / Timing Role: Dual-port SRAM acting as shared frame buffer - left port accepts packet data from PHY, right port feeds packet scheduler. Use Value: 133 MHz operation ensures sub-8 ns worst-case latency between write and subsequent read, meeting strict jitter budgets in OC-192 interfaces. |
Use Scenario: Holding intermediate FFT coefficients in radar DSP modules where ADC samples stream into one port while FFT engine reads from the other. IC Role / Device Role / Timing Role: Synchronous memory co-processor - left port receives 16-bit complex samples at 100 MSPS; right port supplies 36-bit coefficient vectors to MAC unit. Use Value: Bank-switching prevents read/write collisions during burst transfers, eliminating pipeline stalls in deterministic real-time processing chains. |
| Industrial Motion Control | Test Equipment Pattern Memory |
|
Use Scenario: Storing position setpoints and encoder feedback in multi-axis CNC controllers requiring synchronized updates across axes. IC Role / Device Role / Timing Role: Shared memory hub - left port writes interpolated trajectory points from motion planner; right port reads points for servo loop execution. Use Value: Industrial temperature rating (–40°C to +85°C) and 2.5V/3.3V I/O flexibility ensure reliable operation in uncooled control cabinets interfacing with mixed-voltage FPGAs and microcontrollers. |
Use Scenario: Storing stimulus/response patterns in automated test equipment (ATE) for semiconductor wafer probing. IC Role / Device Role / Timing Role: High-speed pattern store - left port loads new test vectors from host controller; right port streams vectors to pin electronics at 133 MHz. Use Value: JTAG compliance enables full boundary-scan validation of memory interconnects, reducing test development time and improving fault coverage for critical ATE subsystems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-133AXC | 256K × 36, 133 MHz, 2.5V/3.3V I/O, but uses traditional dual-port SRAM core (not bank-switchable) and lacks CNTEN/REPEAT logic | Requires external arbitration for concurrent access; unsuitable for deterministic bank-conflict-free designs | Choose when legacy pin compatibility with Cypress footprint is required and bank-switching is unnecessary |
| AS7C33256B-133BIN | 256K × 36, 133 MHz, 3.3V-only I/O, no JTAG, no bank address pins - fixed 64-bank internal mapping | Lacks per-port voltage selection and IEEE 1149.1 test support; bank access not user-controllable | Choose for cost-sensitive applications where JTAG and mixed-voltage I/O are not required |
Compared with CY7C1362BV33-133AXC and AS7C33256B-133BIN, the 70V7519S133BC8 uniquely delivers user-directed bank selection, dual-voltage I/O per port, and integrated JTAG - making it the only option for systems requiring deterministic, conflict-free concurrent access with testability and voltage-flexible interfacing.
Availability
70V7519S133BC8 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, real-time signal processing, and automated test equipment requiring stable component supply across extended product lifecycles.
Supply support for 70V7519S133BC8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and power management ICs for communications and computing markets.
The 70V7519S133BC8 belongs to IDT's high-speed synchronous dual-port SRAM product line, designed specifically for deterministic, low-latency data buffering in telecom line cards, radar DSP, and industrial control systems demanding concurrent multi-port access.
FAQ
What is the maximum operating frequency of the 70V7519S133BC8?
The 70V7519S133BC8 is rated for 133 MHz operation, corresponding to a 7.5 ns clock cycle time in pipelined mode. This speed grade is qualified for both commercial and industrial temperature ranges and requires VDDQ = 3.3V (OPT pin set to VIH) on the active port. The device does not support 200 MHz operation in the BC256 package.
How does bank-switching work in the 70V7519S133BC8?
Bank-switching in the 70V7519S133BC8 is controlled directly by the user via six dedicated bank address pins (BA0–BA5) per port. Each port selects one of 64 independent 4K × 36 banks. Concurrent access is valid only when BA0L–BA5L ≠ BA0R–BA5R; identical bank addresses cause undefined behavior and potential data corruption on both ports.
Can the left and right ports of the 70V7519S133BC8 operate at different I/O voltages?
Yes. The 70V7519S133BC8 supports independent I/O voltage selection per port: OPTL sets left-port VDDQL (3.3V or 2.5V), and OPTR sets right-port VDDQR (3.3V or 2.5V). This allows the left port to interface with a 3.3V FPGA while the right port connects to a 2.5V ASIC - no external level shifters are required.
Does the 70V7519S133BC8 support JTAG boundary-scan testing?
Yes. The 70V7519S133BC8 fully complies with IEEE 1149.1 and includes dedicated TMS, TCK, TDO, TDI, and TRST pins. This enables boundary-scan testing of PCB interconnects and verification of memory subsystem integrity during manufacturing and field diagnostics.
What is the purpose of the CNTEN and REPEAT pins on the 70V7519S133BC8?
CNTEN enables automatic address incrementing on each clock cycle for sequential burst access; REPEAT resets the internal address counter to the last valid address loaded via ADS. Together, they support efficient circular buffer and FIFO implementations without host CPU intervention - a key capability for real-time signal processing applications using the 70V7519S133BC8.
70V7519S133BC8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 256-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 3.15V ~ 3.45V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-CABGA (17x17)
70V7519S133BC8 FAQ
1.How can I place an order for 70V7519S133BC8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 70V7519S133BC8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70V7519S133BC8 reliable?
The price and inventory of 70V7519S133BC8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V7519S133BC8 is usually 5 days.
3.What payment methods are accepted for 70V7519S133BC8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70V7519S133BC8 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 70V7519S133BC8?
70V7519S133BC8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 70V7519S133BC8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70V7519S133BC8?
For technical support, including 70V7519S133BC8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V7519S133BC8 requirements.
6.How does Aetrix verify that 70V7519S133BC8 is sourced from the original manufacturer or authorized distributors?
All 70V7519S133BC8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V7519S133BC8 meets industry standards.
7.What is the process for return or replacement of 70V7519S133BC8?
All 70V7519S133BC8 units undergo pre-shipment inspection (PSI). If there is an issue with 70V7519S133BC8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70V7519S133BC8 part is unused and in its original packaging.
Return procedure for 70V7519S133BC8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
70V7519S133BC8 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
