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Renesas 70V7519S133BCI

Part No.:
70V7519S133BCI
Manufacturer:
Renesas
Category:
Memory
Package:
256-LBGA
Datasheet:
Aetrix70V7519S133BCI.pdf
Description:
IC SRAM 9MBIT PARALLEL 256CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,495

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Product details

Overview

70V7519S133BCI from Integrated Device Technology is a high-speed 256K × 36 (9 Mbit) synchronous bank-switchable dual-ported SRAM with independent left/right ports, 133 MHz operation (4.2 ns max access), industrial temperature range (–40°C to +85°C), and selectable 2.5 V/3.3 V I/O interface per port. It enables concurrent memory access in telecom packet buffers and real-time DSP data exchange.

For engineers reviewing the 70V7519S133BCI datasheet, 70V7519S133BCI pinout, 70V7519S133BCI application, or 70V7519S133BCI equivalent, key selection criteria include dual-port bank-switching control, pipelined/flow-through output mode selection, JTAG IEEE 1149.1 compliance, and 256-pin BGA package compatibility for high-density routing in networking ASIC interfaces.

Technical Context

The 70V7519S133BCI implements a true SRAM core-not traditional dual-port-partitioned into 64 independent 4K × 36 banks, each accessible via dedicated BA0–BA5 address lines per port. Bank arbitration is user-controlled; simultaneous access to the same bank by both ports invalidates both operations.

It supports full synchronous operation on both ports with register-controlled inputs (address, data, control), enabling 5 ns cycle time at 200 MHz (14 Gbps aggregate bandwidth). The device features separate byte enables (BE0–BE3), counter enable/repeat logic, and dual chip enables (CE0/CE1) for seamless depth expansion without external logic.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 256K × 36 (9 Mbit), 64 independent 4K × 36 banks
Max Clock Frequency 133 MHz - enables 7.5 ns clock cycle time in pipelined mode for deterministic latency in burst transfers
Access Time 4.2 ns (max) at 133 MHz - defines minimum clock-to-data-out delay in flow-through mode
I/O Voltage Support Selectable 2.5 V or 3.3 V per port via OPTL/OPTR pins - allows mixed-voltage system interfacing without level shifters
Operating Temperature –40°C to +85°C - qualified for industrial-grade embedded networking and base station equipment
Package 256-pin Ball Grid Array (BC256) - 17 mm × 17 mm body, 1.0 mm ball pitch, optimized for thermal dissipation and signal integrity
JTAG Compliance IEEE 1149.1 - enables boundary-scan testing and in-system debug of memory subsystems

Pinout & Package

70V7519S133BCI is housed in a 256-pin BGA (BC256) package with 17 mm × 17 mm footprint, 1.0 mm ball pitch, and 1.4 mm height. Power delivery uses distributed VDD (3.3 V core), VDDQ (2.5 V/3.3 V I/O), and VSS balls; I/Os are arranged in symmetrical left/right port groups with dedicated bank address, control, and strobe pins.

Pin/Terminal Circuit Role Design Meaning
CLKL / CLKR Port-specific clock input Synchronizes all registered inputs and outputs per port; rising-edge triggered
BA0L–BA5L / BA0R–BA5R Bank address inputs Select one of 64 memory banks independently per port; mismatch prevents bank collision
CE0L/CE1L / CE0R/CE1R Dual chip enables Enable/disable port activity; CE0=low + CE1=high activates port; supports depth expansion
R/WL / R/WR Read/write control Active-high write enable; determines direction of data transfer on I/O bus per port
OEL / OER Output enable Asynchronous control of output drivers; high-Z when asserted, enabling bus sharing
OPTL / OPTR I/O voltage select VIH = 3.3 V I/O mode; VIL = 2.5 V I/O mode; sets required VDDQL/VDDQR supply voltage
I/O0L–I/O35L / I/O0R–I/O35R Bidirectional data bus 36-bit parallel interface per port; supports byte-wise writes via BE0–BE3
TCK/TMS/TDI/TDO/TRST JTAG test interface Enables IEEE 1149.1 boundary-scan for PCB-level interconnect verification

Key Features

Feature Design Value
Bank-switchable architecture 64 independent 4K × 36 banks allow non-blocking concurrent access - eliminates arbitration overhead in multi-threaded systems
Selectable pipelined/flow-through output Pipelined mode reduces tCD to 4.2 ns (133 MHz); flow-through offers zero-cycle latency for real-time read-after-write
Independent I/O voltage per port OPTL/OPTR pins configure left/right ports for 2.5 V or 3.3 V signaling - simplifies integration with mixed-voltage SoCs
Dual chip enables with power-down CE0/CE1 pair per port enables low-power standby (ISB3 ≤ 30 mA) and seamless depth expansion without glue logic
Counter enable & repeat functionality Hardware address counter with REPEATL/REPEATR resets to last ADS-loaded address - accelerates sequential burst reads/writes

Applications

Telecom Packet Buffering DSP Data Exchange

Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in line cards with strict latency budgets.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as shared buffer between ingress parser and egress scheduler; left port handles packet write, right port handles read-for-transmit.

Use Value: Bank-switching prevents contention during back-to-back packet processing; 133 MHz throughput sustains 4.8 Gbps line-rate buffering.

Use Scenario: Real-time data exchange between two independent DSP cores performing parallel FFT and filtering operations.

IC Role / Device Role / Timing Role: Synchronous memory conduit enabling deterministic, low-latency data handoff without software synchronization overhead.

Use Value: Pipelined output mode delivers 4.2 ns tCD for sub-8 ns round-trip latency; independent clocks support asynchronous core timing domains.

Industrial PLC Memory Coherency Medical Imaging Frame Store

Use Scenario: Maintaining consistent I/O state across redundant controller modules in safety-critical programmable logic controllers.

IC Role / Device Role / Timing Role: Shared memory resource accessed concurrently by primary and backup CPU modules for state mirroring and failover coordination.

Use Value: Industrial temperature rating (–40°C to +85°C) ensures reliability in harsh environments; JTAG support enables in-field diagnostics.

Use Scenario: Temporary storage of uncompressed 16-bit medical image frames (e.g., ultrasound or MRI) during acquisition and preprocessing.

IC Role / Device Role / Timing Role: High-bandwidth frame buffer interfacing with ADC front-end (left port) and GPU/FPGA accelerator (right port).

Use Value: 9 Mbit capacity supports 512 × 512 × 16-bit frames; 36-bit bus width matches common imaging data paths for efficient pixel packing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-ported SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1362BV33-133AXC 256K × 32 organization, 32-bit bus width, no bank-switching; fixed 3.3 V I/O only Lacks per-port voltage select and bank arbitration - suitable for simpler dual-access but not for high-concurrency packet buffering Choose when 32-bit data path suffices and mixed-voltage interface is unnecessary
AS7C33128A-133BIN 32M × 8 async dual-port SRAM; no clock, no pipelining, no JTAG; 133 MHz max async access No synchronous timing control or flow-through/pipelined modes - limited to legacy designs requiring pure async behavior Choose only for retrofitting non-synchronous systems where clock domain isolation is not required

Compared with CY7C1362BV33-133AXC and AS7C33128A-133BIN, the 70V7519S133BCI uniquely delivers bank-switchable concurrency, per-port I/O voltage flexibility, and IEEE 1149.1 testability - critical for new-generation telecom and industrial control designs demanding deterministic latency and mixed-voltage interoperability.

Availability

70V7519S133BCI is available at Aetrix Electronics and suitable for telecom infrastructure, industrial PLCs, and medical imaging systems requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for 70V7519S133BCI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and sensor solutions for communications and computing markets.

The 70V7519S133BCI belongs to IDT's high-speed synchronous dual-port SRAM product line, designed specifically for applications demanding concurrent, low-latency memory access in packet processing, DSP, and real-time control systems.

FAQ

What is the maximum operating frequency of the 70V7519S133BCI?

The 70V7519S133BCI is rated for 133 MHz operation, corresponding to a 7.5 ns clock cycle time in pipelined mode and 4.2 ns maximum access time in flow-through mode. This speed grade is validated for both commercial and industrial temperature ranges and requires VDDQ = 3.3 V (i.e., OPTL/OPTR = VIH) per port.

Does the 70V7519S133BCI support mixed-voltage operation between its two ports?

Yes, the 70V7519S133BCI supports independent I/O voltage selection per port: OPTL configures the left port for 2.5 V or 3.3 V operation, and OPTR does the same for the right port. This allows one port to interface with a 2.5 V ASIC while the other connects to a 3.3 V FPGA, eliminating external level shifters.

How does bank-switching prevent memory access conflicts in the 70V7519S133BCI?

The 70V7519S133BCI divides memory into 64 independent 4K × 36 banks. Each port selects its target bank via BA0–BA5 pins. If both ports attempt simultaneous access to the same bank, neither access is valid and data corruption may occur. Users must ensure BA0L–BA5L ≠ BA0R–BA5R in real-time software or hardware arbitration logic.

What is the purpose of the REPEATL and REPEATR signals in the 70V7519S133BCI?

REPEATL and REPEATR reset the internal address counter to the last valid address loaded via ADSL or ADSR, respectively. This enables rapid sequential burst access without reissuing full addresses - critical for streaming applications like packet header parsing or image line buffering. The counter advances across bank boundaries automatically.

Is the 70V7519S133BCI pin-compatible with other speed grades in the 70V7519S family?

No, the 70V7519S133BCI is not pin-compatible with faster variants like 70V7519S166BCI or 70V7519S200BCI. While all share the BC256 package, the 133 MHz version is qualified only for industrial temperature with VDDQ = 3.3 V, whereas higher-speed grades require stricter voltage margins and have different AC timing validation - direct substitution is not supported.

70V7519S133BCI Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
256-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
9Mbit
Memory Organization:
256K x 36
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4.2 ns
Voltage - Supply:
3.15V ~ 3.45V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
256-CABGA (17x17)

70V7519S133BCI FAQ

1.How can I place an order for 70V7519S133BCI through Aetrix?

Please submit a Request for Quotation (RFQ) for 70V7519S133BCI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70V7519S133BCI reliable?

The price and inventory of 70V7519S133BCI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V7519S133BCI is usually 5 days.

3.What payment methods are accepted for 70V7519S133BCI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70V7519S133BCI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70V7519S133BCI?

70V7519S133BCI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70V7519S133BCI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70V7519S133BCI?

For technical support, including 70V7519S133BCI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V7519S133BCI requirements.

6.How does Aetrix verify that 70V7519S133BCI is sourced from the original manufacturer or authorized distributors?

All 70V7519S133BCI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V7519S133BCI meets industry standards.

7.What is the process for return or replacement of 70V7519S133BCI?

All 70V7519S133BCI units undergo pre-shipment inspection (PSI). If there is an issue with 70V7519S133BCI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70V7519S133BCI part is unused and in its original packaging.

Return procedure for 70V7519S133BCI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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