Renesas 70V7519S133BCI8

Overview

70V7519S133BCI8 from Integrated Device Technology is a high-speed 256K × 36 (9 Mbit) synchronous bank-switchable dual-ported SRAM with independent left/right ports, 133 MHz operation (4.2 ns max access), industrial temperature range (−40°C to +85°C), and selectable 2.5 V/3.3 V I/O interface per port. It enables concurrent memory access in telecom line cards and packet buffer applications.

For engineers reviewing the 70V7519S133BCI8 datasheet, 70V7519S133BCI8 pinout, 70V7519S133BCI8 application, or 70V7519S133BCI8 equivalent, key selection criteria include dual-port timing independence, bank-switchable architecture for conflict avoidance, pipelined/flow-through output mode selection, JTAG IEEE 1149.1 compliance, and fpBGA-208 package compatibility with depth expansion support.

Technical Context

The 70V7519S133BCI8 implements a true SRAM core organized into 64 independent 4K × 36 banks, enabling bank-level arbitration via dedicated BA0–BA5 pins per port. Each port operates fully synchronously with its own clock, address, control, and 36-bit I/O bus.

It supports two distinct output modes-pipelined (3.4 ns tCD2 at 133 MHz) and flow-through (15 ns tCYC1)-and includes counter enable/repeat logic for burst address generation. Power management uses dual chip enables (CE0/CE1) for per-port standby, with ISB3 full standby current as low as 10 mA.

Key Specifications

Pinout & Package

70V7519S133BCI8 is housed in a 208-pin fine-pitch Ball Grid Array (fpBGA, package code BF208), measuring approximately 15 mm × 15 mm × 1.4 mm with 0.8 mm ball pitch. All VDD pins require 3.3 V ±150 mV; VDDQ pins must match selected I/O voltage (2.5 V or 3.3 V) per port based on OPTL/OPTR state.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Compared with CY7C1362BV33-133AXC and AS7C3256B-133JCIN, the 70V7519S133BCI8 uniquely delivers bank-switchable arbitration, per-port voltage selection, and configurable output latency - critical for scalable, low-latency, mixed-voltage embedded systems.

Availability

70V7519S133BCI8 is available at Aetrix Electronics and suitable for telecom infrastructure, network packet buffering, radar signal processing, and industrial real-time controllers requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 70V7519S133BCI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and power management ICs for communications and computing markets.

The 70V7519S product line was designed specifically for high-bandwidth, low-latency dual-access memory applications in telecom, networking, and real-time embedded systems - emphasizing bank-level concurrency, flexible I/O voltage, and industrial reliability.

FAQ

What is the maximum operating frequency and access time specification for the 70V7519S133BCI8?

The 70V7519S133BCI8 is rated for 133 MHz operation with a maximum access time of 4.2 ns in pipelined mode. This performance is guaranteed over the full industrial temperature range (−40°C to +85°C) and applies to both left and right ports independently. The device achieves this using a synchronous bank-switchable architecture that eliminates internal arbitration delays inherent in traditional dual-port SRAMs.

Does the 70V7519S133BCI8 support mixed-voltage operation between its two ports?

Yes, the 70V7519S133BCI8 supports independent I/O voltage selection per port: OPTL sets the left port's interface voltage (2.5 V or 3.3 V), and OPTR sets the right port's. This allows one port to connect to a 2.5 V FPGA while the other interfaces with a 3.3 V microcontroller - eliminating external level shifters. Core voltage (VDD) remains fixed at 3.3 V for both configurations.

How does bank-switching prevent port contention in the 70V7519S133BCI8?

The 70V7519S133BCI8 uses dedicated BA0–BA5 pins on each port to select one of 64 independent 4K × 36 banks. When BA0L–BA5L ≠ BA0R–BA5R, both ports access separate memory regions concurrently with no conflict. If both attempt the same bank simultaneously, accesses are invalidated - so system firmware must ensure bank address separation, typically via software-managed bank allocation or hardware arbitration logic.

What are the power consumption characteristics of the 70V7519S133BCI8 in standby mode?

In full standby (ISB3), where both ports are disabled with CMOS-level inputs, the 70V7519S133BCI8 draws as little as 10 mA typical (30 mA max) at 3.3 V. With one port active and the other in TTL-level standby (ISB4), current rises to 460–545 mA depending on speed grade. These values reflect optimized power gating via dual CE0/CE1 enables - enabling dynamic power scaling in burst-oriented applications like packet buffering.

Is the 70V7519S133BCI8 pin-compatible with other speed grades in the same package family?

Yes, the 70V7519S133BCI8 shares identical pinout and footprint with other BF208-package variants including 70V7519S166BCI8 and 70V7519S200BCI8. All use the same 208-pin fpBGA layout, allowing drop-in replacement for performance tuning or qualification flexibility - provided system timing margins accommodate the slower or faster grade. Voltage and thermal requirements remain consistent across the family.