Renesas 70V7519S133BFI8
- Part No.:
- 70V7519S133BFI8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 208-LFBGA
- Datasheet:
-
70V7519S133BFI8.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 208CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
70V7519S133BFI8 from IDT (Integrated Device Technology) is a high-speed, synchronous, bank-switchable dual-ported SRAM with 256K × 36 (9 Mbit) organization, 64 independent 4K × 36 banks, 133 MHz max operation, industrial temperature range (−40°C to +85°C), and fpBGA-208 package. It enables concurrent read/write access on two independent ports in telecom switching fabric and packet buffer applications.
For engineers reviewing the 70V7519S133BFI8 datasheet, 70V7519S133BFI8 pinout, 70V7519S133BFI8 application, or 70V7519S133BFI8 equivalent, key selection criteria include dual-port bandwidth at 133 MHz, selectable 2.5V/3.3V I/O per port, pipelined vs. flow-through output mode, bank-switching control via BA[0:5], and JTAG IEEE 1149.1 compliance for boundary scan.
Technical Context
This device implements a true SRAM core-not traditional dual-port-enabling bank-switchable architecture where each port independently selects one of 64 banks via dedicated BA[0:5] pins. Conflicts occur only when both ports target identical banks simultaneously, requiring software coordination.
It supports full synchronous operation on both ports with register-controlled inputs (address, data, control), enabling tight timing: 1.5 ns setup and 0.5 ns hold at 133 MHz. Output mode (pipelined or flow-through) is selected per port via PL/FTL and PL/FTR pins, directly affecting tCD (clock-to-data) latency and cycle time.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36 (9 Mbit), 64 independent 4K × 36 banks - enables fine-grained parallel access without internal arbitration overhead |
| Max Clock Frequency | 133 MHz - guarantees 7.5 ns clock cycle time in pipelined mode for deterministic low-latency buffering |
| Access Time (tCD) | 4.2 ns (pipelined), 15 ns (flow-through) - defines minimum latency from clock edge to valid output data |
| I/O Voltage Support | Selectable 2.5 V or 3.3 V per port via OPTL/OPTR - allows mixed-voltage system integration without level shifters |
| Operating Temperature | −40°C to +85°C - qualified for industrial-grade networking and base station equipment |
| Package | 208-pin fine-pitch BGA (BF208), 15 mm × 15 mm, 0.8 mm ball pitch - compact footprint for high-density PCB layouts |
| JTAG Compliance | IEEE 1149.1 - enables production testability and debug visibility in multi-chip systems |
Pinout & Package
Package: 208-pin fine-pitch Ball Grid Array (fpBGA), body size 15 mm × 15 mm × 1.4 mm, 0.8 mm ball pitch. All VDD pins require 3.3 V ±150 mV; VDDQ pins must match OPT pin voltage (2.5 V or 3.3 V).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port L/R clock input | Synchronous edge-triggered timing reference for all registered inputs and outputs on respective port |
| BA0L–BA5L / BA0R–BA5R | Bank address inputs | Select one of 64 memory banks per port; conflict occurs only if identical BA values asserted simultaneously |
| PL/FTL / PL/FTR | Pipeline/Flow-through mode select | VIH = pipelined (low latency, 4.2 ns tCD); VIL = flow-through (zero-cycle latency, 15 ns tCD) |
| OPTL / OPTR | I/O voltage option control | VIH = 3.3 V I/O interface; VIL = 2.5 V I/O interface - sets required VDDQL/VDDQR supply voltage |
| CE0L/CE1L / CE0R/CE1R | Dual chip enables | Enable depth expansion without external logic: CE0X = VIL & CE1X = VIH activates port X |
| I/O0L–I/O35L / I/O0R–I/O35R | Bi-directional data bus | 36-bit wide per port; byte enables (BE0–BE3) allow 9-bit sub-word writes independent of bus width |
Key Features
| Feature | Design Value |
|---|---|
| Bank-switchable dual-port architecture | Eliminates internal arbitration; enables deterministic concurrent access to disjoint memory banks across two ports |
| Selectably pipelined or flow-through output | Per-port configuration allows trade-off between latency (pipelined) and real-time determinism (flow-through) |
| Dual chip enables (CE0/CE1) | Supports seamless depth expansion using multiple devices without external decode logic or glue logic |
| Independent I/O voltage per port | Enables direct interfacing to 2.5 V FPGAs and 3.3 V processors in same system without level translation |
| Counter enable & repeat functionality | Hardware address counter with repeat reset enables burst sequential access without host CPU address management |
Applications
| Telecom Switching Fabric | Network Packet Buffer |
|---|---|
|
Use Scenario: High-throughput line cards in carrier-grade routers performing parallel header lookup and payload buffering. IC Role / Device Role / Timing Role: Dual-port SRAM serving as shared buffer between ingress and egress ASICs with bank-level concurrency. Use Value: 133 MHz pipelined operation delivers 4.2 ns tCD and 7.5 ns cycle time, enabling sub-10 ns inter-ASIC handoff latency. |
Use Scenario: Deep packet inspection engines requiring simultaneous write (ingress) and read (analysis) of packet payloads. IC Role / Device Role / Timing Role: Synchronous dual-port memory acting as zero-wait-state FIFO with independent clock domains per port. Use Value: Independent 2.5 V/3.3 V I/O per port allows direct connection to 2.5 V NPU and 3.3 V PHY without level shifters. |
| Industrial PLC Data Exchange | Radar Signal Processing Buffer |
|
Use Scenario: Real-time motion control systems exchanging position/velocity data between FPGA-based servo controllers and ARM-based HMI. IC Role / Device Role / Timing Role: Bank-switchable SRAM providing deterministic, non-blocking data exchange channel between heterogeneous processors. Use Value: −40°C to +85°C rating and JTAG support ensure reliability and testability in harsh factory environments. |
Use Scenario: Phased-array radar subsystems buffering ADC samples and feeding FFT engines with continuous streaming data. IC Role / Device Role / Timing Role: Flow-through mode configured for zero-cycle latency reads during real-time signal processing pipelines. Use Value: 15 ns tCD in flow-through mode ensures immediate availability of sampled data for time-critical DSP kernels. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-133AXC | 256K × 36, 133 MHz, 256-pin BGA, fixed 3.3 V I/O only - no 2.5 V option or bank-switching | Lacks per-port voltage flexibility and bank arbitration control; requires external logic for depth expansion | Choose when system uses uniform 3.3 V interfaces and simpler layout suffices over configurability |
| AS7C3256B-133JCIN | 256K × 36, 133 MHz, 119-pin TQFP, single-port with dual-clock - not true dual-port | No concurrent read/write on separate buses; requires external arbitration for multi-master use | Choose only for cost-sensitive, space-constrained designs where true dual-port concurrency is unnecessary |
Compared with CY7C1362BV33-133AXC and AS7C3256B-133JCIN, the 70V7519S133BFI8 uniquely delivers per-port I/O voltage selection, bank-switching control, and dual CE-based depth expansion - critical for heterogeneous, high-reliability embedded systems.
Availability
70V7519S133BFI8 is available at Aetrix Electronics and suitable for telecom switching fabric, industrial PLC data exchange, and radar signal processing buffer applications requiring stable component supply, long-term industrial temperature support, and verified fpBGA-208 sourcing.
Supply support for 70V7519S133BFI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and sensor solutions for communications and computing markets.
The 70V7519S product line was designed for high-bandwidth, low-latency dual-port memory applications in telecom infrastructure, military/aerospace systems, and real-time industrial control where deterministic access and voltage flexibility are essential.
FAQ
What is the maximum operating frequency of the 70V7519S133BFI8, and under what conditions is it guaranteed?
The 70V7519S133BFI8 is rated for 133 MHz maximum operation in both commercial and industrial temperature ranges. This speed grade is guaranteed with VDD = 3.3 V ±150 mV, VDDQ = 3.3 V (i.e., OPTL/OPTR = VIH), and ambient temperature from −40°C to +85°C. At 133 MHz, it achieves a 7.5 ns clock cycle time in pipelined mode and 4.2 ns clock-to-data (tCD2) latency.
Does the 70V7519S133BFI8 support independent I/O voltage levels on its left and right ports?
Yes, the 70V7519S133BFI8 supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL = VIH configures the left port for 3.3 V I/O (requiring VDDQL = 3.3 V), while OPTL = VIL configures it for 2.5 V (requiring VDDQL = 2.5 V). The same applies independently to the right port via OPTR and VDDQR. This enables mixed-voltage system integration without external level shifters.
How does bank-switching work in the 70V7519S133BFI8, and what happens if both ports access the same bank?
The 70V7519S133BFI8 organizes memory into 64 independent 4K × 36 banks, selected per port via BA0–BA5 inputs. When both ports assert identical bank addresses simultaneously, neither access is valid: writes may corrupt data, and reads return invalid output. System firmware must coordinate bank allocation to avoid conflicts - no hardware arbitration is provided.
What are the key timing differences between pipelined and flow-through output modes in the 70V7519S133BFI8?
In pipelined mode (PL/FTL = VIH), the 70V7519S133BFI8 delivers 4.2 ns clock-to-data (tCD2) latency and 7.5 ns minimum cycle time at 133 MHz - ideal for throughput-critical applications. In flow-through mode (PL/FTL = VIL), it provides zero-cycle latency (tCD1 = 15 ns) but requires longer 25 ns cycles - suited for real-time deterministic reads where immediate data availability matters more than bandwidth.
Is JTAG boundary scan supported on the 70V7519S133BFI8, and which pins are used?
Yes, the 70V7519S133BFI8 fully supports IEEE 1149.1 JTAG boundary scan. Required pins are TDI (pin A4), TDO (pin A3), TCK (pin T2), TMS (pin P3), and TRST (pin R3), all located on the fpBGA-208 package. These signals operate at the same voltage as the associated port's I/O domain (2.5 V or 3.3 V depending on OPTL/OPTR setting).
70V7519S133BFI8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 208-LFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 3.15V ~ 3.45V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 208-CABGA (15x15)
70V7519S133BFI8 FAQ
1.How can I place an order for 70V7519S133BFI8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 70V7519S133BFI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70V7519S133BFI8 reliable?
The price and inventory of 70V7519S133BFI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V7519S133BFI8 is usually 5 days.
3.What payment methods are accepted for 70V7519S133BFI8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70V7519S133BFI8 transactions.
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4.How is shipping managed for 70V7519S133BFI8?
70V7519S133BFI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 70V7519S133BFI8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70V7519S133BFI8?
For technical support, including 70V7519S133BFI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V7519S133BFI8 requirements.
6.How does Aetrix verify that 70V7519S133BFI8 is sourced from the original manufacturer or authorized distributors?
All 70V7519S133BFI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V7519S133BFI8 meets industry standards.
7.What is the process for return or replacement of 70V7519S133BFI8?
All 70V7519S133BFI8 units undergo pre-shipment inspection (PSI). If there is an issue with 70V7519S133BFI8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70V7519S133BFI8 part is unused and in its original packaging.
Return procedure for 70V7519S133BFI8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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