Renesas 70V7519S166BC

Overview

70V7519S166BC from Integrated Device Technology is a high-speed 256K × 36 (9 Mbit) synchronous bank-switchable dual-ported SRAM with independent left/right ports, 166 MHz operation (3.6 ns access), industrial temperature support (−40°C to +85°C), and selectable 3.3 V or 2.5 V I/O interface per port. It enables concurrent memory access in packet buffering, network switch fabric, and real-time video frame stores.

For engineers reviewing the 70V7519S166BC datasheet, 70V7519S166BC pinout, 70V7519S166BC application, or 70V7519S166BC equivalent, this page delivers verified timing parameters, bank-switching control logic, JTAG-compliant test features, and package-specific pin validation for BC256 BGA integration.

Technical Context

The 70V7519S166BC implements a true SRAM core-not traditional dual-port-partitioned into 64 independent 4K × 36 banks, each accessible via dedicated BA0–BA5 address lines per port. Bank conflict detection prevents simultaneous access to the same bank by left and right ports.

It supports pipelined or flow-through output modes via PL/FTL and PL/FTR pins, with self-timed write enabling 5 ns cycle time at 200 MHz. Dual chip enables (CE0/CE1 per port) allow depth expansion without external logic, and counter enable/repeat features support burst address generation across bank boundaries.

Key Specifications

Pinout & Package

70V7519S166BC is packaged in a 256-pin Ball Grid Array (BC256), with 17 mm × 17 mm footprint, 1.0 mm ball pitch, and 1.4 mm height. Power (VDD = 3.3 V ±150 mV), I/O supply (VDDQL/VDDQR = 3.3 V or 2.5 V), and ground (VSS) pins are distributed across the perimeter for low-noise decoupling.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-ported SRAM applications.

Compared with CY7C1362KV18-166BZI and AS7C3256A-166JCIN, the 70V7519S166BC uniquely delivers 36-bit width, bank-switching control, and industrial temperature support in a single 256-pin BGA - eliminating board space, power, and timing complexity of multi-device solutions.

Availability

70V7519S166BC is available at Aetrix Electronics and suitable for network switching, real-time video processing, radar signal buffering, and industrial PLC data exchange requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 70V7519S166BC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.

The 70V7519S166BC belongs to IDT's high-speed synchronous dual-ported SRAM product line, engineered specifically for deterministic, low-latency, concurrent memory access in packet infrastructure and real-time embedded systems.

FAQ

What is the maximum operating frequency of the 70V7519S166BC?

The 70V7519S166BC is rated for 166 MHz operation across the industrial temperature range (−40°C to +85°C). This corresponds to a guaranteed maximum clock-to-data valid time (tCD2) of 3.6 ns in pipelined mode. While the 70V7519S200 variant supports 200 MHz, that speed grade is commercial-only and incompatible with industrial temperature requirements.

Does the 70V7519S166BC support both 2.5 V and 3.3 V I/O interfaces simultaneously?

Yes - the 70V7519S166BC supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL = VIL and OPTR = VIH configures the left port for 2.5 V operation (VDDQL = 2.5 V) and the right port for 3.3 V operation (VDDQR = 3.3 V), enabling direct interfacing with mixed-voltage SoCs or FPGAs without external level shifters.

How does bank conflict resolution work in the 70V7519S166BC?

The 70V7519S166BC detects bank conflicts when BA0L–BA5L equals BA0R–BA5R. In such cases, neither port's access is completed, and data may be corrupted during writes or invalid during reads. The device does not arbitrate - it relies on system-level control to ensure unique bank addresses per concurrent access. This design avoids hidden latency and preserves deterministic timing behavior.

What package options are available for the 70V7519S166BC?

The 70V7519S166BC is offered exclusively in the 256-pin Ball Grid Array (BC256) package: 17 mm × 17 mm body, 1.0 mm ball pitch, 1.4 mm height. The BF208 (208-pin fpBGA) and DR208 (208-pin PQFP) packages are only available for other speed grades (e.g., 70V7519S133), not the 166 MHz industrial variant.

Can the 70V7519S166BC be used in JTAG boundary-scan testing?

Yes - the 70V7519S166BC fully complies with IEEE 1149.1 (JTAG) standards. Pins TDI, TDO, TCK, TMS, and TRST are dedicated for boundary-scan operation, enabling automated PCB test coverage, interconnect verification, and in-system programming of adjacent devices without requiring physical probe access.