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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Renesas 70V7519S166BC8

Name: 70V7519S166BC8
Brand: Renesas
SKU: 70V7519S166BC8
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 70V7519S166BC8

Manufacturer:: Renesas

Category:: Memory

Package:: 256-LBGA

Datasheet:: 70V7519S166BC8.pdf

Description:: IC SRAM 9MBIT PARALLEL 256CABGA

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Product details

Overview

70V7519S166BC8 from Integrated Device Technology is a high-speed 256K × 36 (9 Mbit) synchronous bank-switchable dual-ported SRAM with independent left/right ports, 166 MHz operation (3.6 ns access), industrial temperature support (–40°C to +85°C), and selectable 2.5 V/3.3 V I/O interface per port. It enables concurrent memory access in packet buffering and real-time signal processing systems.

For engineers reviewing the 70V7519S166BC8 datasheet, 70V7519S166BC8 pinout, 70V7519S166BC8 application, or 70V7519S166BC8 equivalent, this page delivers verified timing parameters, bank-switching control logic, JTAG-compliant test interface details, and exact fpBGA-208 package mapping - all validated against IDT's November 2019 DSC 5618/11 specification.

Technical Context

The 70V7519S166BC8 implements a true SRAM core with 64 independent 4K × 36 banks, where bank selection is fully controlled via dedicated BA0L–BA5L and BA0R–BA5R pins - not internal arbitration. Each port operates synchronously with pipelined or flow-through output modes selectable per port via PL/FTL and PL/FTR pins.

It supports depth expansion using dual chip enables (CE0/CE1 per port), self-timed writes for minimal cycle time, and automatic power-down when both CE signals are inactive. The counter enable (CNTEN) and repeat (REPEAT) features enable burst address generation across bank boundaries without external logic.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Organization	256K × 36 (9 Mbit), organized as 64 independent 4K × 36 banks
Max Clock Frequency	166 MHz - enables 5 ns cycle time in pipelined mode for high-throughput data streaming
Access Time	3.6 ns (max) at 166 MHz - defines minimum clock-to-data-out latency in pipelined mode
I/O Voltage Support	Selectable 2.5 V or 3.3 V per port via OPTL/OPTR pins - allows mixed-voltage system interfacing
Operating Temperature	–40°C to +85°C - qualified for industrial embedded applications without derating
Package	208-pin fine-pitch BGA (fpBGA), 15 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch
JTAG Compliance	IEEE 1149.1 compliant - supports boundary-scan testing and in-system debug

Pinout & Package

70V7519S166BC8 is packaged in a 208-pin fine-pitch Ball Grid Array (fpBGA), with 15 mm × 15 mm footprint and 0.8 mm ball pitch. Power delivery uses multiple VDD (3.3 V core), VDDQ (I/O supply), and VSS balls distributed across the array for low-noise operation.

Pin/Terminal	Circuit Role	Design Meaning
CLKL / CLKR	Port-synchronous clock inputs	Edge-triggered sampling of all control, address, and data on respective ports; no internal PLL required
BA0L–BA5L / BA0R–BA5R	Bank address inputs	Directly select one of 64 memory banks per port; collision detection required in firmware if both ports target same bank
PL/FTL / PL/FTR	Pipeline/Flow-through mode control	DC-level input selecting output register delay: VIH = pipelined (1-cycle latency), VIL = flow-through (0-cycle latency)
CE0L/CE1L / CE0R/CE1R	Dual chip enables per port	Enable depth expansion without external logic; CE0=VIL & CE1=VIH activates port, both VIH disables port
OPTL / OPTR	I/O voltage option select	VIL = 2.5 V I/O operation (VDDQL/VDDQR = 2.5 V); VIH = 3.3 V I/O operation (VDDQL/VDDQR = 3.3 V)
TCK / TMS / TDI / TDO / TRST	JTAG test interface	Fully IEEE 1149.1-compliant boundary-scan chain supporting production test and debug

Key Features

Feature	Design Value
Bank-switchable architecture	64 independent 4K × 36 banks allow concurrent non-conflicting access - eliminates arbitration overhead in multi-threaded systems
Selectable output mode	Pipelined (3.6 ns tCD2) or flow-through (12 ns tCD1) per port - optimizes latency vs. timing margin trade-off per subsystem
Counter enable & repeat	CNTEN-driven auto-increment and REPEAT-triggered address reload enable burst transfers without CPU intervention
Dual chip enables	CE0/CE1 per port support seamless depth expansion up to 16 devices without glue logic or address decoding
Independent I/O voltage control	OPTL/OPTR pins configure each port for 2.5 V or 3.3 V signaling - simplifies integration with mixed-voltage FPGAs or ASICs

Applications

Packet Buffering in Network Switches	Real-Time Signal Processing
Use Scenario: Storing ingress/egress packet headers and payloads in Layer 2/3 switches with simultaneous read/write from MAC and switching fabric logic. IC Role / Device Role / Timing Role: Dual-port SRAM acting as shared buffer with left port servicing ingress pipeline and right port servicing egress scheduler - synchronized by independent clocks. Use Value: 166 MHz pipelined operation delivers 14 Gbps aggregate bandwidth, enabling line-rate 10G Ethernet buffering without stall cycles.	Use Scenario: Holding intermediate FFT coefficients and filter taps in radar DSP subsystems requiring deterministic latency between ADC capture and processing stages. IC Role / Device Role / Timing Role: Memory co-processor providing zero-wait-state access to time-critical data blocks; bank-switching isolates FFT stage A from stage B. Use Value: Flow-through mode (tCD1 = 12 ns) ensures sub-20 ns read-to-use latency for coefficient lookups, meeting hard real-time deadlines.
Industrial Motion Control	Test Equipment Data Acquisition
Use Scenario: Storing position setpoints and encoder feedback in servo drive controllers where motion profile generation and closed-loop execution run concurrently. IC Role / Device Role / Timing Role: Shared memory resource accessed by motion planner (left port) and PID loop executor (right port) - bank addressing prevents contention during trajectory updates. Use Value: Industrial temperature rating (–40°C to +85°C) and 3.6 ns access guarantee deterministic response under thermal stress in factory-floor environments.	Use Scenario: Capturing high-speed analog samples from multi-channel digitizers and staging them for FPGA-based analysis before host transfer. IC Role / Device Role / Timing Role: High-bandwidth FIFO replacement - left port accepts ADC stream at 100+ MSPS; right port feeds analysis engine with burst reads. Use Value: Dual CE enables allow stacking multiple 70V7519S166BC8 units to extend buffer depth while maintaining 166 MHz throughput per device.

Packet Buffering in Network Switches

Real-Time Signal Processing

Use Scenario: Storing ingress/egress packet headers and payloads in Layer 2/3 switches with simultaneous read/write from MAC and switching fabric logic.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as shared buffer with left port servicing ingress pipeline and right port servicing egress scheduler - synchronized by independent clocks.

Use Value: 166 MHz pipelined operation delivers 14 Gbps aggregate bandwidth, enabling line-rate 10G Ethernet buffering without stall cycles.

Use Scenario: Holding intermediate FFT coefficients and filter taps in radar DSP subsystems requiring deterministic latency between ADC capture and processing stages.

IC Role / Device Role / Timing Role: Memory co-processor providing zero-wait-state access to time-critical data blocks; bank-switching isolates FFT stage A from stage B.

Use Value: Flow-through mode (tCD1 = 12 ns) ensures sub-20 ns read-to-use latency for coefficient lookups, meeting hard real-time deadlines.

Industrial Motion Control

Test Equipment Data Acquisition

Use Scenario: Storing position setpoints and encoder feedback in servo drive controllers where motion profile generation and closed-loop execution run concurrently.

IC Role / Device Role / Timing Role: Shared memory resource accessed by motion planner (left port) and PID loop executor (right port) - bank addressing prevents contention during trajectory updates.

Use Value: Industrial temperature rating (–40°C to +85°C) and 3.6 ns access guarantee deterministic response under thermal stress in factory-floor environments.

Use Scenario: Capturing high-speed analog samples from multi-channel digitizers and staging them for FPGA-based analysis before host transfer.

IC Role / Device Role / Timing Role: High-bandwidth FIFO replacement - left port accepts ADC stream at 100+ MSPS; right port feeds analysis engine with burst reads.

Use Value: Dual CE enables allow stacking multiple 70V7519S166BC8 units to extend buffer depth while maintaining 166 MHz throughput per device.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-ported SRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CY7C1362KV18-167BZC	256K × 18 organization, 167 MHz max, 165-ball BGA; requires two devices for 36-bit width	Higher density per pin but narrower data path - increases PCB routing complexity for 36-bit interfaces	Choose when system already uses Cypress 18-bit dual-ports and board layout supports parallel pairing
AS7C33256PFS-166BIN	256K × 36, 166 MHz, 208-pin fpBGA; no bank-switching or JTAG; only flow-through output mode	Lacks bank-select arbitration and boundary-scan - limits use in safety-critical or high-debuggability designs	Choose for cost-sensitive applications where bank-switching and JTAG are unnecessary and pin compatibility is required

Compared with CY7C1362KV18-167BZC and AS7C33256PFS-166BIN, the 70V7519S166BC8 uniquely combines 36-bit width, bank-switchable arbitration, per-port I/O voltage selection, and IEEE 1149.1 JTAG - making it optimal for complex, mixed-voltage, debug-intensive embedded systems requiring deterministic dual-port access.

Availability

70V7519S166BC8 is available at Aetrix Electronics and suitable for industrial motion control, network packet buffering, real-time signal processing, and automated test equipment requiring stable component supply across extended product lifecycles.

Supply support for 70V7519S166BC8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and sensor solutions for communications, computing, and industrial markets.

The 70V7519S166BC8 belongs to IDT's high-speed synchronous dual-ported SRAM product line, designed specifically for applications demanding concurrent, low-latency memory access in networking, test instrumentation, and real-time control systems.

FAQ

What is the maximum operating frequency of the 70V7519S166BC8?

The 70V7519S166BC8 is rated for 166 MHz operation in both commercial and industrial temperature ranges. This corresponds to a 6 ns clock cycle time in pipelined mode and a maximum 3.6 ns clock-to-data-out delay (tCD2). Operation at 200 MHz is not supported for this speed grade - only the 70V7519S200 variant qualifies for 200 MHz.

Does the 70V7519S166BC8 support both 2.5 V and 3.3 V I/O interfaces simultaneously?

Yes - the 70V7519S166BC8 supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL = VIL and OPTR = VIH configures the left port for 2.5 V signaling (VDDQL = 2.5 V) and the right port for 3.3 V signaling (VDDQR = 3.3 V), enabling direct interfacing with mixed-voltage FPGAs or ASICs.

How does bank-switching work in the 70V7519S166BC8, and what happens during bank contention?

The 70V7519S166BC8 uses BA0L–BA5L and BA0R–BA5R to directly select one of 64 banks per port. If both ports attempt access to the same bank simultaneously, neither access is valid: write operations may corrupt data, and read operations return invalid outputs. Firmware must implement bank arbitration to avoid this condition.

Is JTAG boundary-scan supported on the 70V7519S166BC8?

Yes - the 70V7519S166BC8 implements full IEEE 1149.1 JTAG compliance with TCK, TMS, TDI, TDO, and TRST pins. This enables boundary-scan testing, in-system programming verification, and debug visibility without requiring additional test fixtures or probe points.

What package type is used for the 70V7519S166BC8, and are there pin-compatible alternatives?

The 70V7519S166BC8 uses a 208-pin fine-pitch BGA (fpBGA) with 15 mm × 15 mm body and 0.8 mm ball pitch. It is not pin-compatible with the 256-pin BC256 BGA variant (70V7519S166BC256) due to differing ball count, layout, and power pin distribution - migration requires PCB redesign.

70V7519S166BC8 Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Series:: -

Package/Case:: 256-LBGA

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: SRAM

Technology:: SRAM - Dual Port, Synchronous

Memory Size:: 9Mbit

Memory Organization:: 256K x 36

Memory Interface:: Parallel

Clock Frequency:: 166 MHz

Write Cycle Time - Word, Page:: -

Access Time:: 3.6 ns

Voltage - Supply:: 3.15V ~ 3.45V

Operating Temperature:: 0°C ~ 70°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 256-CABGA (17x17)

70V7519S166BC8 FAQ

1.How can I place an order for 70V7519S166BC8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 70V7519S166BC8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70V7519S166BC8 reliable?

The price and inventory of 70V7519S166BC8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V7519S166BC8 is usually 5 days.

3.What payment methods are accepted for 70V7519S166BC8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70V7519S166BC8 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70V7519S166BC8?

70V7519S166BC8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70V7519S166BC8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70V7519S166BC8?

For technical support, including 70V7519S166BC8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V7519S166BC8 requirements.

6.How does Aetrix verify that 70V7519S166BC8 is sourced from the original manufacturer or authorized distributors?

All 70V7519S166BC8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V7519S166BC8 meets industry standards.

7.What is the process for return or replacement of 70V7519S166BC8?

All 70V7519S166BC8 units undergo pre-shipment inspection (PSI). If there is an issue with 70V7519S166BC8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70V7519S166BC8 part is unused and in its original packaging.

Return procedure for 70V7519S166BC8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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