Renesas 70V7519S166BCI

Overview

70V7519S166BCI from Integrated Device Technology is a high-speed 256K × 36 (9 Mbit) synchronous bank-switchable dual-ported SRAM with independent left/right ports, 166 MHz operation (3.6 ns access), industrial temperature range (–40°C to +85°C), and selectable 3.3 V or 2.5 V I/O interface per port. It enables concurrent memory access in telecom packet buffers and real-time video frame stores.

For engineers reviewing the 70V7519S166BCI datasheet, 70V7519S166BCI pinout, 70V7519S166BCI application, or 70V7519S166BCI equivalent, key selection criteria include dual-port bank arbitration timing, pipelined/flow-through output mode selection, JTAG IEEE 1149.1 compliance, and 256-pin BGA package compatibility with depth expansion via dual chip enables.

Technical Context

The 70V7519S166BCI implements a true SRAM core organized into 64 independent 4K × 36 banks, where bank access is directly controlled by six dedicated bank address pins (BA0–BA5) per port. This architecture avoids traditional dual-port contention by allowing each port to target any unoccupied bank-subject to BAxL ≠ BAxR enforcement at system level.

It supports full synchronous operation on both ports with register-controlled inputs, enabling 5 ns cycle time at 200 MHz (14 Gbps aggregate bandwidth). The device features separate byte enables (BE0–BE3) per port for 9-bit byte granularity, counter enable/repeat logic for burst address generation, and self-timed write for minimal cycle overhead.

Key Specifications

Pinout & Package

70V7519S166BCI is housed in a 256-pin BGA (BC256) package with 17 mm × 17 mm footprint and 1.0 mm ball pitch. Power delivery includes dedicated VDD (3.3 V core), VDDQL/VDDQR (port-selectable I/O supply), and multiple VSS balls for low-noise grounding.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-ported SRAM applications.

Compared with CY7C1362BV33-166AXC and AS7C3256B-166BIN, the 70V7519S166BCI delivers higher effective bandwidth via bank-switching concurrency, finer-grained control with per-port I/O voltage and pipelined output, and built-in testability through JTAG - making it optimal for latency-critical, mixed-voltage, and high-reliability systems.

Availability

70V7519S166BCI is available at Aetrix Electronics and suitable for telecom infrastructure, broadcast video equipment, military radar systems, and industrial motion controllers requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for 70V7519S166BCI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.

The 70V7519S166BCI belongs to IDT's high-speed synchronous dual-port SRAM product line, engineered specifically for deterministic, low-latency memory buffering in real-time signal processing and packet-forwarding systems.

FAQ

What is the maximum operating frequency and access time for the 70V7519S166BCI?

The 70V7519S166BCI is rated for 166 MHz operation with a maximum access time of 3.6 ns in pipelined output mode. This specification applies under industrial temperature conditions (–40°C to +85°C) and requires VDDQ set to 3.3 V (OPT pin = VIH) per port. The device also supports flow-through mode with 12 ns clock-to-data valid delay at the same frequency.

Does the 70V7519S166BCI support independent I/O voltage levels on its two ports?

Yes, the 70V7519S166BCI supports independent I/O voltage selection: OPTL sets the left port's interface voltage (3.3 V or 2.5 V), and OPTR sets the right port's interface voltage. Each port requires its corresponding VDDQL or VDDQR supply at the selected level. This allows direct interfacing with mixed-voltage FPGAs or ASICs without external level shifters.

How does bank arbitration work in the 70V7519S166BCI, and what happens during contention?

Bank arbitration in the 70V7519S166BCI is user-managed via BA0–BA5 pins on each port. If both ports assert identical bank addresses simultaneously, neither access is valid - writes may corrupt data, and reads return invalid output. System design must ensure BAxL ≠ BAxR during concurrent operations, typically using address mapping logic or software coordination.

What package type and pin count does the 70V7519S166BCI use?

The 70V7519S166BCI uses a 256-pin Ball Grid Array (BC256) package with a 17 mm × 17 mm body and 1.0 mm ball pitch. This package is distinct from the 208-pin fpBGA (BF208) variant and supports the full industrial temperature range at 166 MHz - unlike the BF208, which is limited to commercial grade at this speed.

Is JTAG boundary-scan supported on the 70V7519S166BCI, and which standard does it comply with?

Yes, the 70V7519S166BCI integrates IEEE 1149.1-compliant JTAG test logic with TDI, TDO, TCK, TMS, and TRST pins. This enables boundary-scan testing, interconnect verification, and in-system programming support during PCB assembly and field maintenance - critical for high-reliability telecom and defense applications.