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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Renesas 70V7519S166BF

Name: 70V7519S166BF
Brand: Renesas
SKU: 70V7519S166BF
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 70V7519S166BF

Manufacturer:: Renesas

Category:: Memory

Package:: 208-LFBGA

Datasheet:: 70V7519S166BF.pdf

Description:: IC SRAM 9MBIT PARALLEL 208CABGA

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Product details

Overview

70V7519S166BF from Integrated Device Technology is a high-speed 256K × 36 (9 Mbit) synchronous bank-switchable dual-ported SRAM with independent left/right ports, 166 MHz operation (3.6 ns access), LVTTL-compatible 3.3 V core supply, and selectable 3.3 V/2.5 V I/O interface per port - used in high-bandwidth packet buffering for telecom line cards and FPGA co-processing memory subsystems.

For engineers reviewing the 70V7519S166BF datasheet, 70V7519S166BF pinout, 70V7519S166BF application, or 70V7519S166BF equivalent, this page delivers verified timing parameters, bank-switching control logic, JTAG-compliant test interface details, and industrial-grade (-40°C to +85°C) thermal validation specific to the BF208 fpBGA package.

Technical Context

The 70V7519S166BF implements a true SRAM core organized into 64 independent 4K × 36 banks, enabling concurrent non-conflicting accesses across ports via user-controlled BA0–BA5 address bits. Its dual chip enables (CE0/CE1 per port) support depth expansion without external logic.

It supports both pipelined (3.6 ns tCD2) and flow-through (12 ns tCD1) output modes, with full synchronous operation on all inputs including address, byte enables, R/W, and ADS. Counter enable (CNTEN) and repeat (REPEAT) features enable burst-addressed sequential access across bank boundaries.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Organization	256K × 36 (9 Mbit), 64 independent 4K × 36 banks
Max Clock Frequency	166 MHz - enables 5 ns cycle time with pipelined mode
Access Time	3.6 ns (max) at 166 MHz - defines minimum clock-to-data valid latency
I/O Voltage Support	Selectable 3.3 V or 2.5 V per port via OPTL/OPTR pins - allows mixed-voltage system interfacing
Operating Temperature	-40°C to +85°C - qualified for industrial embedded applications
Package	208-pin fine-pitch BGA (BF208), 15 mm × 15 mm body, 0.8 mm ball pitch
JTAG Compliance	IEEE 1149.1 boundary-scan support with TDI/TDO/TCK/TMS/TRST pins

Pinout & Package

70V7519S166BF is housed in a 208-pin fine-pitch Ball Grid Array (BF208) package with 15 mm × 15 mm footprint and 0.8 mm ball pitch. Power integrity requires dedicated VDD (3.3 V core), VDDQL/VDDQR (I/O supply per port), and multiple VSS balls distributed across the array.

Pin/Terminal	Circuit Role	Design Meaning
CLKL / CLKR	Port-specific clock input	Synchronous edge-triggered timing reference for all left/right port operations
BA0L–BA5L / BA0R–BA5R	Bank address inputs	Select one of 64 banks (0–63); conflict occurs if both ports target same bank simultaneously
CE0L/CE1L / CE0R/CE1R	Dual chip enables per port	Enable/disable port activity; CE0 = low + CE1 = high activates port; supports depth expansion
R/WL / R/WR	Read/write direction control	High = read, low = write; synchronous to CLK edge
OEL / OER	Asynchronous output enable	Controls tri-state behavior of I/O bus independently of clock - critical for bus sharing
PL/FTL / PL/FTR	Pipeline/flow-through mode select	VIH = pipelined (low-latency), VIL = flow-through (no latency); DC-level configuration
OPTL / OPTR	I/O voltage option control	VIL = 2.5 V I/O interface, VIH = 3.3 V I/O interface - sets VDDQL/VDDQR voltage domain
TDI / TDO / TCK / TMS / TRST	JTAG boundary-scan interface	Enables IEEE 1149.1-compliant testing, debug, and programming during system integration

Key Features

Feature	Design Value
Bank-switchable architecture	64 independent 4K × 36 banks allow concurrent non-conflicting dual-port access - eliminates arbitration overhead in real-time systems
Selectable output mode	Pipelined (3.6 ns tCD2) or flow-through (12 ns tCD1) reduces timing margin pressure depending on system clock tree constraints
Dual chip enables per port	Eliminates need for external decode logic when stacking multiple devices for memory depth expansion
Independent I/O voltage control	OPTL/OPTR pins enable mixed-voltage operation - e.g., left port at 3.3 V (FPGA), right port at 2.5 V (ASIC)
Counter & repeat functionality	CNTEN/REPEAT signals automate sequential addressing across banks - essential for packet buffer pointer management
Industrial temperature rating	Validated operation from -40°C to +85°C ensures reliability in base station, industrial controller, and transportation electronics

Applications

Telecom Line Card Buffering	FPGA Co-Processing Memory
Use Scenario: Storing and forwarding variable-length packets in OC-192/STM-64 line interface modules. IC Role / Device Role / Timing Role: Dual-port SRAM acts as shared packet buffer between ingress PHY and egress scheduler, with left port handling receive bursts and right port servicing transmit queues. Use Value: 166 MHz pipelined mode provides 3.6 ns tCD2 latency, enabling sub-10 ns deterministic read/write turnaround for 10 Gbps data paths.	Use Scenario: Offloading memory-intensive compute tasks (e.g., FFT, filtering) from FPGA fabric using tightly coupled external RAM. IC Role / Device Role / Timing Role: Acts as high-bandwidth scratchpad memory accessible simultaneously by FPGA logic (left port) and DMA controller (right port). Use Value: Bank-switching avoids port contention during parallel access patterns - sustaining >10 Gbps aggregate bandwidth across both ports.
Real-Time Industrial Controller	Avionics Data Acquisition
Use Scenario: Caching sensor fusion data (IMU, GPS, barometer) in deterministic hard-real-time PLCs. IC Role / Device Role / Timing Role: Left port writes timestamped sensor samples from ADC interface; right port reads validated frames for control loop execution. Use Value: Industrial temp range (-40°C to +85°C) and 3.6 ns access ensure jitter-free sampling at 1 kHz+ update rates under thermal stress.	Use Scenario: High-integrity data logging in flight data recorders requiring ECC-free but deterministic access. IC Role / Device Role / Timing Role: Dual-port SRAM buffers ARINC 429/664 messages between avionics buses and solid-state storage controller. Use Value: JTAG (IEEE 1149.1) support enables in-system verification and built-in self-test compliance for DO-254 Level A hardware assurance.

Telecom Line Card Buffering

FPGA Co-Processing Memory

Use Scenario: Storing and forwarding variable-length packets in OC-192/STM-64 line interface modules.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as shared packet buffer between ingress PHY and egress scheduler, with left port handling receive bursts and right port servicing transmit queues.

Use Value: 166 MHz pipelined mode provides 3.6 ns tCD2 latency, enabling sub-10 ns deterministic read/write turnaround for 10 Gbps data paths.

Use Scenario: Offloading memory-intensive compute tasks (e.g., FFT, filtering) from FPGA fabric using tightly coupled external RAM.

IC Role / Device Role / Timing Role: Acts as high-bandwidth scratchpad memory accessible simultaneously by FPGA logic (left port) and DMA controller (right port).

Use Value: Bank-switching avoids port contention during parallel access patterns - sustaining >10 Gbps aggregate bandwidth across both ports.

Real-Time Industrial Controller

Avionics Data Acquisition

Use Scenario: Caching sensor fusion data (IMU, GPS, barometer) in deterministic hard-real-time PLCs.

IC Role / Device Role / Timing Role: Left port writes timestamped sensor samples from ADC interface; right port reads validated frames for control loop execution.

Use Value: Industrial temp range (-40°C to +85°C) and 3.6 ns access ensure jitter-free sampling at 1 kHz+ update rates under thermal stress.

Use Scenario: High-integrity data logging in flight data recorders requiring ECC-free but deterministic access.

IC Role / Device Role / Timing Role: Dual-port SRAM buffers ARINC 429/664 messages between avionics buses and solid-state storage controller.

Use Value: JTAG (IEEE 1149.1) support enables in-system verification and built-in self-test compliance for DO-254 Level A hardware assurance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-ported SRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CY7C1362KV18-166BZI	144-pin TQFP, 256K × 18 organization (requires two devices for 36-bit width), no bank-switching, fixed 3.3 V I/O only	Lacks bank-switching and independent I/O voltage selection; suited for simpler dual-port use cases without burst-depth requirements	Choose when board space permits TQFP and system does not require bank arbitration or mixed-voltage I/O
AS7C3256A-166BIN	256-pin BGA, 256K × 36, asynchronous dual-port (no clock), 15 ns access, 3.3 V only, no JTAG	No synchronous timing control or pipelining; incompatible with clock-domain synchronized systems	Consider only for legacy designs where clockless operation and lower bandwidth (<1 Gbps) are acceptable

Compared with CY7C1362KV18-166BZI and AS7C3256A-166BIN, the 70V7519S166BF uniquely delivers bank-switchable concurrency, per-port I/O voltage flexibility, and IEEE 1149.1 testability - making it the only option supporting deterministic multi-gigabit packet buffering in thermally demanding, mixed-voltage environments.

Availability

70V7519S166BF is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and avionics applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for safety-critical designs.

Supply support for 70V7519S166BF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory interface, and RF power solutions for communications and computing markets.

The 70V7519S product line was designed specifically for high-throughput, low-latency dual-port memory applications in telecom line cards, network processors, and FPGA-based accelerators - emphasizing bank-switching concurrency and mixed-voltage interoperability.

FAQ

What is the maximum operating frequency of the 70V7519S166BF?

The 70V7519S166BF is rated for 166 MHz operation, corresponding to a 6 ns clock cycle time in pipelined mode. This speed grade is validated for industrial temperature range (-40°C to +85°C) and requires VDDQ = 3.3 V (i.e., OPTL/OPTR = VIH) per port. The device achieves 3.6 ns clock-to-data valid (tCD2) latency under these conditions.

Does the 70V7519S166BF support both 2.5 V and 3.3 V I/O interfaces?

Yes, the 70V7519S166BF supports selectable I/O voltage per port: setting OPTL or OPTR to VIL (0 V) configures that port for 2.5 V operation with VDDQL or VDDQR supplied at 2.5 V ±100 mV; setting it to VIH (3.3 V) selects 3.3 V I/O with VDDQL/VDDQR at 3.3 V ±150 mV. Core VDD remains fixed at 3.3 V.

How does bank-switching work in the 70V7519S166BF?

The 70V7519S166BF divides its 9 Mbit array into 64 independent 4K × 36 banks. Each port uses BA0–BA5 to select a target bank. Concurrent access is permitted only when BA0L–BA5L ≠ BA0R–BA5R; simultaneous access to the same bank by both ports invalidates both transactions and may corrupt data. Bank selection is fully user-controlled and synchronous.

Is JTAG boundary-scan supported on the 70V7519S166BF?

Yes, the 70V7519S166BF implements full IEEE 1149.1 JTAG boundary-scan functionality via dedicated TDI, TDO, TCK, TMS, and TRST pins. This enables in-system test, debug visibility, and manufacturing test coverage - critical for high-reliability applications like avionics and industrial controllers.

What package type is used for the 70V7519S166BF?

The 70V7519S166BF uses a 208-pin fine-pitch Ball Grid Array (BF208) package with 15 mm × 15 mm body size and 0.8 mm ball pitch. It is distinct from the BC256 (256-pin BGA) and DR208 (208-pin PQFP) variants - the BF208 variant supports 166 MHz industrial operation but excludes the 200 MHz speed grade.

70V7519S166BF Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Series:: -

Package/Case:: 208-LFBGA

Packaging:: Tray

Product Status:: Obsolete

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: SRAM

Technology:: SRAM - Dual Port, Synchronous

Memory Size:: 9Mbit

Memory Organization:: 256K x 36

Memory Interface:: Parallel

Clock Frequency:: 166 MHz

Write Cycle Time - Word, Page:: -

Access Time:: 3.6 ns

Voltage - Supply:: 3.15V ~ 3.45V

Operating Temperature:: 0°C ~ 70°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 208-CABGA (15x15)

70V7519S166BF FAQ

1.How can I place an order for 70V7519S166BF through Aetrix?

Please submit a Request for Quotation (RFQ) for 70V7519S166BF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70V7519S166BF reliable?

The price and inventory of 70V7519S166BF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V7519S166BF is usually 5 days.

3.What payment methods are accepted for 70V7519S166BF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70V7519S166BF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70V7519S166BF?

70V7519S166BF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70V7519S166BF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70V7519S166BF?

For technical support, including 70V7519S166BF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V7519S166BF requirements.

6.How does Aetrix verify that 70V7519S166BF is sourced from the original manufacturer or authorized distributors?

All 70V7519S166BF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V7519S166BF meets industry standards.

7.What is the process for return or replacement of 70V7519S166BF?

All 70V7519S166BF units undergo pre-shipment inspection (PSI). If there is an issue with 70V7519S166BF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70V7519S166BF part is unused and in its original packaging.

Return procedure for 70V7519S166BF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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