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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Renesas 70V7519S166BF8

Name: 70V7519S166BF8
Brand: Renesas
SKU: 70V7519S166BF8
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 70V7519S166BF8

Manufacturer:: Renesas

Category:: Memory

Package:: 208-LFBGA

Datasheet:: 70V7519S166BF8.pdf

Description:: IC SRAM 9MBIT PARALLEL 208CABGA

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Product details

Overview

70V7519S166BF8 from Integrated Device Technology is a 256K × 36 (9 Mbit) synchronous bank-switchable dual-ported SRAM with independent left/right ports, 166 MHz operation (3.6 ns access), LVTTL-compatible 3.3 V core supply, and selectable 3.3 V/2.5 V I/O interface per port. It supports pipelined or flow-through output modes and is used in high-bandwidth packet buffering for telecom line cards and network processors.

For engineers reviewing the 70V7519S166BF8 datasheet, 70V7519S166BF8 pinout, 70V7519S166BF8 application, or 70V7519S166BF8 equivalent, key selection criteria include dual-port bank-switching architecture, industrial temperature support (−40°C to +85°C), JTAG IEEE 1149.1 compliance, 208-pin fpBGA package, and voltage-flexible I/O per port via OPT pins.

Technical Context

The 70V7519S166BF8 implements a true SRAM core with 64 independent 4K × 36 banks, enabling concurrent non-conflicting accesses across ports when bank addresses differ (BA0L–BA5L ≠ BA0R–BA5R). Its self-timed write and registered control/data/address inputs enable tight timing margins: 1.5 ns setup and 0.5 ns hold at 200 MHz.

Each port features separate byte enables (BE0–BE3), counter enable (CNTEN), repeat (REPEAT), address strobe (ADS), and pipeline/flow-through mode selection (PL/FT). The device supports depth expansion using dual chip enables (CE0/CE1) without external logic and includes automatic power-down via CE assertion.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Organization	256K × 36 (9 Mbit), organized as 64 independent 4K × 36 banks
Max Clock Frequency	166 MHz - enables 5 ns cycle time and 14 Gbps aggregate bandwidth
Access Time	3.6 ns (max) at 166 MHz - defines minimum clock-to-data-out latency in pipelined mode
Supply Voltages	VDD = 3.3 V ± 150 mV (core); VDDQ = 3.3 V or 2.5 V per port (I/O), selected by OPT pin
Operating Temperature	−40°C to +85°C - qualified for industrial environments without derating
Package	208-pin fine-pitch BGA (fpBGA), 15 mm × 15 mm × 1.4 mm, 0.8 mm ball pitch
JTAG Support	IEEE 1149.1 compliant - enables boundary-scan testing and system-level debug

Pinout & Package

70V7519S166BF8 is housed in a 208-pin fine-pitch Ball Grid Array (fpBGA) with 0.8 mm ball pitch, 15 mm × 15 mm body size, and thermal/mechanical characteristics optimized for high-density PCB layouts in telecom and networking equipment.

Pin/Terminal	Circuit Role	Design Meaning
CLKL / CLKR	Port clock input	Synchronous edge-triggered timing reference for all left/right port operations
CE0L/CE1L, CE0R/CE1R	Dual chip enables	Enable/disable port activity independently; allow depth expansion without glue logic
BA0L–BA5L, BA0R–BA5R	Bank address inputs	Select one of 64 memory banks per port; conflict detection prevents simultaneous same-bank access
I/O0L–I/O35L, I/O0R–I/O35R	36-bit bidirectional data bus	Supports byte-wise writes via BE0–BE3; compatible with multiplexed or matched bus topologies
OPTL / OPTR	I/O voltage select	Set VIH (3.3 V) or VIL (0 V) to configure corresponding port's VDDQ to 3.3 V or 2.5 V
PL/FTL / PL/FTR	Output mode control	Select pipelined (low-latency burst reads) or flow-through (zero-cycle read latency) output behavior
TCK, TMS, TDI, TDO, TRST	JTAG test interface	Enable IEEE 1149.1 boundary-scan for production test and in-system validation

Key Features

Feature	Design Value
Bank-switchable dual-port architecture	Enables concurrent, non-blocking access to different 4K × 36 banks-ideal for producer/consumer FIFOs in packet engines
Selectable pipelined or flow-through output	Pipelined mode delivers 3.6 ns tCD2 at 166 MHz; flow-through eliminates output register delay for deterministic zero-cycle reads
Independent per-port I/O voltage	OPTL/OPTR pins allow left port at 3.3 V and right port at 2.5 V-supports mixed-voltage SoC interfacing without level shifters
Counter enable and repeat functions	CNTEN and REPEAT enable auto-incrementing address sequences and rapid re-access to last ADS-loaded address-reduces controller overhead in streaming applications
Dual chip enables with power-down	CE0/CE1 assertion places each port into low-power standby (ISB1 ≤ 340 mA typ), reducing dynamic current during idle cycles

Applications

Telecom Line Card Buffering	Network Processor Packet Memory
Use Scenario: Storing ingress/egress packet headers and payloads in multi-gigabit line cards with strict latency budgets. IC Role / Device Role / Timing Role: Dual-port SRAM acting as shared buffer between framer and switch fabric; left port handles ingress, right port handles egress. Use Value: 166 MHz operation and 3.6 ns access ensure sub-10 ns read/write turnaround, meeting OC-192/STM-64 timing constraints.	Use Scenario: Serving as on-chip packet memory for multi-core network processors performing classification, policing, and shaping. IC Role / Device Role / Timing Role: High-bandwidth memory resource accessed concurrently by multiple processing threads via dedicated ports. Use Value: Bank-switching avoids arbitration stalls; 14 Gbps aggregate bandwidth sustains full-duplex 10G Ethernet line-rate traffic.
Industrial Real-Time Control Buffer	Radar Signal Processing FIFO
Use Scenario: Buffering sensor fusion data streams in ruggedized PLCs and motion controllers requiring −40°C to +85°C operation. IC Role / Device Role / Timing Role: Deterministic dual-port memory for time-critical I/O co-processing-left port for ADC stream, right port for FPGA-based control logic. Use Value: Industrial temp grade and flow-through mode guarantee worst-case 4.2 ns tOE and zero-cycle read latency for jitter-sensitive loop closure.	Use Scenario: Capturing and staging digitized RF samples in phased-array radar systems before FFT processing. IC Role / Device Role / Timing Role: High-speed circular buffer with counter-repeat functionality to manage continuous sample acquisition and DMA transfer. Use Value: CNTEN/REPEAT enables seamless wraparound addressing across bank boundaries-eliminates software pointer management overhead.

Telecom Line Card Buffering

Network Processor Packet Memory

Use Scenario: Storing ingress/egress packet headers and payloads in multi-gigabit line cards with strict latency budgets.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as shared buffer between framer and switch fabric; left port handles ingress, right port handles egress.

Use Value: 166 MHz operation and 3.6 ns access ensure sub-10 ns read/write turnaround, meeting OC-192/STM-64 timing constraints.

Use Scenario: Serving as on-chip packet memory for multi-core network processors performing classification, policing, and shaping.

IC Role / Device Role / Timing Role: High-bandwidth memory resource accessed concurrently by multiple processing threads via dedicated ports.

Use Value: Bank-switching avoids arbitration stalls; 14 Gbps aggregate bandwidth sustains full-duplex 10G Ethernet line-rate traffic.

Industrial Real-Time Control Buffer

Radar Signal Processing FIFO

Use Scenario: Buffering sensor fusion data streams in ruggedized PLCs and motion controllers requiring −40°C to +85°C operation.

IC Role / Device Role / Timing Role: Deterministic dual-port memory for time-critical I/O co-processing-left port for ADC stream, right port for FPGA-based control logic.

Use Value: Industrial temp grade and flow-through mode guarantee worst-case 4.2 ns tOE and zero-cycle read latency for jitter-sensitive loop closure.

Use Scenario: Capturing and staging digitized RF samples in phased-array radar systems before FFT processing.

IC Role / Device Role / Timing Role: High-speed circular buffer with counter-repeat functionality to manage continuous sample acquisition and DMA transfer.

Use Value: CNTEN/REPEAT enables seamless wraparound addressing across bank boundaries-eliminates software pointer management overhead.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CY7C1362BV33-166AXC	256K × 36, 166 MHz, 2.5 V core, 2.5 V I/O only; no OPT-selectable I/O voltage; 256-pin BGA	Lacks per-port voltage flexibility and bank-switching arbitration logic; requires external level translation for mixed-voltage interfaces	Choose when system uses uniform 2.5 V signaling and board layout accommodates larger 256-pin footprint.
IDT70V9269S166PF8	256K × 36, 166 MHz, 3.3 V core/I/O, 208-pin fpBGA; no bank-switching-traditional dual-port architecture	No bank arbitration; simultaneous same-address access causes bus contention; no CNTEN/REPEAT features	Choose only if legacy design relies on standard dual-port timing and does not require streaming address generation or conflict-free bank access.

Compared with CY7C1362BV33-166AXC and IDT70V9269S166PF8, the 70V7519S166BF8 uniquely combines per-port I/O voltage selection, bank-switching arbitration, and hardware address counters-enabling lower system complexity and higher effective throughput in streaming, mixed-voltage, and real-time applications.

Availability

70V7519S166BF8 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial control, and radar signal processing applications requiring stable component supply, long-term lifecycle support, and guaranteed industrial temperature performance.

Supply support for 70V7519S166BF8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.

The 70V7519S166BF8 belongs to IDT's high-speed synchronous dual-port SRAM product line, engineered specifically for deterministic, low-latency, multi-protocol packet buffering and real-time data co-processing in bandwidth-constrained systems.

FAQ

What is the maximum operating frequency and access time for the 70V7519S166BF8?

The 70V7519S166BF8 is rated for 166 MHz operation with a maximum access time of 3.6 ns in pipelined mode. This specification applies across the full industrial temperature range (−40°C to +85°C) and is validated under VDD = 3.3 V ± 150 mV and appropriate VDDQ conditions. The device also supports 133 MHz operation with 4.2 ns access time for extended reliability margin.

Does the 70V7519S166BF8 support mixed-voltage I/O operation between its two ports?

Yes, the 70V7519S166BF8 supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL to VIH configures the left port for 3.3 V I/O, while setting OPTR to VIL configures the right port for 2.5 V I/O-enabling direct interfacing with heterogeneous SoCs without external level shifters. Both VDDQ supplies must match the OPT state.

How does bank-switching prevent port contention in the 70V7519S166BF8?

The 70V7519S166BF8 uses BA0L–BA5L and BA0R–BA5R to select among 64 independent 4K × 36 banks. If both ports attempt simultaneous access to the same bank, the access is invalidated and data corruption may occur. The architecture requires firmware or logic to ensure BA0L–BA5L ≠ BA0R–BA5R-enabling deterministic, lock-free concurrent access to disjoint memory regions.

What are the power consumption characteristics of the 70V7519S166BF8 at 166 MHz?

At 166 MHz with both ports active and outputs disabled, the 70V7519S166BF8 draws up to 790 mA (typical 675 mA) under commercial conditions. In full standby (CMOS-level inputs, both CE0/CE1 inactive), it consumes ≤ 30 mA. Industrial-grade units draw ≤ 830 mA active and ≤ 40 mA standby, maintaining performance across −40°C to +85°C.

Is JTAG boundary-scan supported on the 70V7519S166BF8, and what standard does it comply with?

Yes, the 70V7519S166BF8 integrates a fully compliant IEEE 1149.1 JTAG test access port with TCK, TMS, TDI, TDO, and TRST pins. This enables boundary-scan testing for interconnect verification, in-system programming, and manufacturing test-critical for high-reliability telecom and industrial PCB assemblies.

70V7519S166BF8 Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Series:: -

Package/Case:: 208-LFBGA

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: SRAM

Technology:: SRAM - Dual Port, Synchronous

Memory Size:: 9Mbit

Memory Organization:: 256K x 36

Memory Interface:: Parallel

Clock Frequency:: 166 MHz

Write Cycle Time - Word, Page:: -

Access Time:: 3.6 ns

Voltage - Supply:: 3.15V ~ 3.45V

Operating Temperature:: 0°C ~ 70°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 208-CABGA (15x15)

70V7519S166BF8 FAQ

1.How can I place an order for 70V7519S166BF8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 70V7519S166BF8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70V7519S166BF8 reliable?

The price and inventory of 70V7519S166BF8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V7519S166BF8 is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70V7519S166BF8 transactions.

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70V7519S166BF8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70V7519S166BF8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70V7519S166BF8?

For technical support, including 70V7519S166BF8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V7519S166BF8 requirements.

6.How does Aetrix verify that 70V7519S166BF8 is sourced from the original manufacturer or authorized distributors?

All 70V7519S166BF8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V7519S166BF8 meets industry standards.

7.What is the process for return or replacement of 70V7519S166BF8?

All 70V7519S166BF8 units undergo pre-shipment inspection (PSI). If there is an issue with 70V7519S166BF8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70V7519S166BF8 part is unused and in its original packaging.

Return procedure for 70V7519S166BF8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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