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Renesas 70V7519S166DR

Part No.:
70V7519S166DR
Manufacturer:
Renesas
Category:
Memory
Package:
208-BFQFP
Datasheet:
Aetrix70V7519S166DR.pdf
Description:
IC SRAM 9MBIT PARALLEL 208PQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,934

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Product details

Overview

70V7519S166DR from Integrated Device Technology is a high-speed 256K × 36 (9 Mbit) synchronous bank-switchable dual-ported SRAM with independent left/right ports, 166 MHz operation (3.6 ns access), industrial temperature support (–40°C to +85°C), and selectable 3.3 V or 2.5 V I/O interface per port. It enables concurrent read/write access to disjoint 4K × 36 memory banks in telecom switching fabric and packet buffer applications.

For engineers reviewing the 70V7519S166DR datasheet, 70V7519S166DR pinout, 70V7519S166DR application, or 70V7519S166DR equivalent, key selection criteria include dual-port bank-switching architecture, pipelined/flow-through output mode selection, JTAG IEEE 1149.1 compliance, 208-pin PQFP package, and differential timing margins for burst-mode data flow in high-throughput networking systems.

Technical Context

The 70V7519S166DR implements a true SRAM core with 64 independent 4K × 36 banks, enabling non-conflicting simultaneous access by left and right ports-provided bank address pins (BA0L–BA5L ≠ BA0R–BA5R) differ. Bank arbitration is user-controlled via dedicated bank address inputs, not internal arbitration logic.

It supports fully synchronous operation on both ports with register-controlled inputs (address, control, data), delivering 5 ns cycle time at 200 MHz and 3.4 ns clock-to-data-out in pipelined mode. The device integrates counter enable/repeat features, separate byte enables (BE0–BE3), and dual chip enables (CE0/CE1) for seamless depth expansion without external logic.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 256K × 36 (9 Mbit), organized as 64 independent 4K × 36 banks
Max Clock Frequency 166 MHz - enables 5 ns cycle time with full synchronous timing margin
Access Time 3.6 ns (max) at 166 MHz - defines minimum clock-to-data valid delay in pipelined mode
Operating Temperature –40°C to +85°C - qualified for industrial-grade embedded networking equipment
I/O Voltage Support Selectable 3.3 V or 2.5 V per port via OPTL/OPTR pins - allows mixed-voltage system interfacing
Package 208-pin PQFP (DR208) - 28 mm × 28 mm body, 0.65 mm lead pitch, surface-mount compatible
JTAG Compliance IEEE 1149.1 - enables boundary-scan testing and in-system debug of memory subsystems

Pinout & Package

70V7519S166DR is housed in a 208-pin Plastic Quad Flat Pack (PQFP), designated DR208. The package measures 28 mm × 28 mm × 3.5 mm with gull-wing leads and is RoHS-compliant. Power and ground pins are distributed across all four sides for low-noise supply routing.

Pin/Terminal Circuit Role Design Meaning
CLKL / CLKR Port-specific clock input Synchronizes all registered inputs and outputs per port; rising-edge triggered
CE0L/CE1L, CE0R/CE1R Dual chip enables per port Enable depth expansion: CE0X = L & CE1X = H activates port; both high disables port
BA0L–BA5L, BA0R–BA5R Bank address inputs Select one of 64 banks (0–63); conflict occurs if identical bank selected on both ports
I/O0L–I/O35L, I/O0R–I/O35R 36-bit bidirectional data bus per port Supports byte-wise access via BE0–BE3; each byte = 9 bits (I/O0–8, I/O9–17, etc.)
PL/FTL, PL/FTR Pipeline/Flow-Through mode select VIH = pipelined (1-cycle latency); VIL = flow-through (0-cycle latency, higher timing margin)
OPTL, OPTR I/O voltage option control VIL = 2.5 V I/O operation; VIH = 3.3 V I/O operation; sets VDDQL/VDDQR supply requirement
TMS, TCK, TDI, TDO, TRST JTAG test interface Enables IEEE 1149.1 boundary-scan; TRST resets TAP controller independently of power state

Key Features

Feature Design Value
Bank-switchable dual-port architecture Eliminates arbitration overhead: ports access disjoint banks simultaneously without contention or wait states
Selectable pipelined or flow-through output Optimizes system timing: pipelined mode achieves 166 MHz throughput; flow-through reduces latency for real-time response
Independent I/O voltage per port Enables direct interfacing with 2.5 V FPGAs and 3.3 V processors without level shifters or voltage translation
Dual chip enables (CE0/CE1) Permits seamless depth expansion across multiple devices using standard logic-no glue logic required
Counter enable and repeat functionality Supports burst transfers with auto-incremented addresses; REPEAT resets counter to last ADS-loaded address
JTAG IEEE 1149.1 compliance Provides production testability and in-system verification of memory interconnect integrity and signal integrity

Applications

Telecom Switching Fabric Network Packet Buffer

Use Scenario: High-speed line cards in carrier-grade routers require concurrent ingress/egress packet buffering with zero-latency arbitration.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as shared buffer between ingress ASIC and egress scheduler; left port handles write, right port handles read.

Use Value: 166 MHz operation and bank-switching allow sustained 14 Gbps bandwidth with deterministic access-critical for sub-100 ns packet processing deadlines.

Use Scenario: Multi-gigabit Ethernet switches buffer variable-length frames across priority queues before scheduling.

IC Role / Device Role / Timing Role: 70V7519S166DR serves as per-queue memory bank; pipelined mode ensures consistent 3.6 ns access during burst reads/writes.

Use Value: Independent 2.5 V/3.3 V I/O per port matches PHY (2.5 V) and MAC (3.3 V) voltage domains-reducing BOM count and layout complexity.

Real-Time Signal Processing Industrial Protocol Gateway

Use Scenario: Radar beamforming systems perform parallel FFT operations on streaming ADC data with strict sample alignment.

IC Role / Device Role / Timing Role: Left port captures ADC samples synchronously; right port feeds DSP engine with aligned frame buffers.

Use Value: Counter repeat feature enables rapid re-read of calibration tables or coefficient sets without address bus overhead-reducing CPU load by >40%.

Use Scenario: Fieldbus gateways translate Modbus TCP to PROFIBUS DP, requiring deterministic buffering of protocol payloads.

IC Role / Device Role / Timing Role: 70V7519S166DR stores segmented protocol packets; JTAG support enables field-upgradable firmware validation.

Use Value: Industrial temperature rating (–40°C to +85°C) and 208-pin PQFP package ensure long-term reliability in uncontrolled cabinet environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1362BV33-166AXC 256K × 36, 166 MHz, 2.5 V/3.3 V I/O, but uses traditional dual-port SRAM core (not bank-switchable); no counter repeat or ADS strobe Lacks bank-switching flexibility-requires arbitration logic for concurrent access; unsuitable for true zero-contention multi-processor sharing Choose only if legacy design compatibility or lower cost outweighs need for bank arbitration-free operation
AS7C3256B-166JCIN 256K × 36, 166 MHz, 3.3 V only (no 2.5 V option); no JTAG; PQFP package but no pipelined/flow-through mode selection No voltage flexibility limits interfacing with mixed-voltage SoCs; absence of JTAG increases test development effort Select when system uses uniform 3.3 V I/O and JTAG is unnecessary-ideal for cost-sensitive industrial controllers

Compared with CY7C1362BV33-166AXC and AS7C3256B-166JCIN, the 70V7519S166DR uniquely delivers bank-switchable concurrency, per-port voltage selection, and JTAG testability-making it the only option for high-reliability, mixed-voltage, test-critical dual-port memory systems.

Availability

70V7519S166DR is available at Aetrix Electronics and suitable for telecom switching fabric, network packet buffer, and real-time signal processing applications requiring stable component supply, long-lifecycle assurance, and industrial-grade thermal performance.

Supply support for 70V7519S166DR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and sensor solutions for communications, computing, and industrial markets.

The 70V7519S166DR belongs to IDT's high-speed synchronous dual-port SRAM product line, engineered specifically for zero-contention, high-bandwidth data buffering in telecom infrastructure, packet processing engines, and real-time embedded systems.

FAQ

What is the maximum operating frequency and access time for the 70V7519S166DR?

The 70V7519S166DR is rated for 166 MHz operation with a maximum access time of 3.6 ns in pipelined mode. This specification applies under industrial temperature conditions (–40°C to +85°C) and requires VDDQ = 3.3 V (i.e., OPTL/OPTR = VIH). At 2.5 V I/O, the maximum speed grade supported is 133 MHz.

Does the 70V7519S166DR support independent voltage operation on its two ports?

Yes, the 70V7519S166DR supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL = VIH configures the left port for 3.3 V operation (VDDQL = 3.3 V), while OPTR = VIL configures the right port for 2.5 V (VDDQR = 2.5 V). Core voltage (VDD) remains fixed at 3.3 V for both configurations.

How does bank-switching prevent port contention in the 70V7519S166DR?

The 70V7519S166DR avoids port contention by assigning each 4K × 36 memory block to one of 64 banks, with access controlled exclusively by BA0–BA5 address pins. If BA0L–BA5L ≠ BA0R–BA5R, both ports access disjoint banks concurrently. Identical bank selection invalidates both accesses-requiring software coordination, not hardware arbitration.

What is the function of the REPEAT pin in the 70V7519S166DR?

The REPEAT pin (REPEATL/REPEATR) resets the internal address counter to the last valid address loaded via ADS (Address Strobe Enable). This enables rapid re-access to calibration tables or lookup data without reloading the address bus-reducing control overhead in real-time signal processing loops where the 70V7519S166DR is deployed.

Is JTAG boundary-scan supported on the 70V7519S166DR, and what standard does it comply with?

Yes, the 70V7519S166DR includes full IEEE 1149.1-compliant JTAG test circuitry with TMS, TCK, TDI, TDO, and TRST pins. This enables boundary-scan testing of PCB interconnects, verification of memory subsystem signal integrity, and in-system programming support-critical for high-reliability telecom and industrial deployments of the 70V7519S166DR.

70V7519S166DR Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
208-BFQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
9Mbit
Memory Organization:
256K x 36
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.6 ns
Voltage - Supply:
3.15V ~ 3.45V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
208-PQFP (28x28)

70V7519S166DR FAQ

1.How can I place an order for 70V7519S166DR through Aetrix?

Please submit a Request for Quotation (RFQ) for 70V7519S166DR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70V7519S166DR reliable?

The price and inventory of 70V7519S166DR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V7519S166DR is usually 5 days.

3.What payment methods are accepted for 70V7519S166DR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70V7519S166DR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70V7519S166DR?

70V7519S166DR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70V7519S166DR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70V7519S166DR?

For technical support, including 70V7519S166DR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V7519S166DR requirements.

6.How does Aetrix verify that 70V7519S166DR is sourced from the original manufacturer or authorized distributors?

All 70V7519S166DR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V7519S166DR meets industry standards.

7.What is the process for return or replacement of 70V7519S166DR?

All 70V7519S166DR units undergo pre-shipment inspection (PSI). If there is an issue with 70V7519S166DR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70V7519S166DR part is unused and in its original packaging.

Return procedure for 70V7519S166DR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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