Renesas 70V7519S200BC

Overview

70V7519S200BC from Integrated Device Technology is a high-speed 256K × 36 (9 Mbit) synchronous bank-switchable dual-ported SRAM with true SRAM core architecture, 200 MHz operation, 3.4 ns clock-to-data-out (pipelined), and independent 3.3 V or 2.5 V I/O voltage selection per port - deployed in telecom packet buffers and FPGA co-processor memory subsystems.

For engineers reviewing the 70V7519S200BC datasheet, 70V7519S200BC pinout, 70V7519S200BC application, or 70V7519S200BC equivalent, this page delivers verified timing parameters, bank-addressed dual-port arbitration behavior, JTAG-compliant test interface support, and fpBGA-208 package-specific layout guidance for high-bandwidth memory interfacing.

Technical Context

The 70V7519S200BC implements a bank-switchable architecture with 64 independent 4K × 36 banks, enabling concurrent non-conflicting access by left and right ports - each controlled via dedicated BA0–BA5 address lines. Bank collision detection is user-managed; simultaneous access to the same bank invalidates both reads/writes.

It supports selectable pipelined (3.4 ns tCD2) or flow-through (10 ns tCD1) output modes, counter-enabled burst addressing with REPEAT/ADS/CNTEN logic, and full synchronous operation on both ports with 5 ns minimum cycle time at 200 MHz. Dual CE0/CE1 enables allow depth expansion without external logic.

Key Specifications

Pinout & Package

70V7519S200BC is housed in a 208-pin fine-pitch Ball Grid Array (BF208) package with 0.8 mm ball pitch, 15 mm × 15 mm footprint, and 1.4 mm height. Power and ground balls are distributed across the array for low-inductance decoupling; VDD (3.3 V core) and VDDQ (3.3 V or 2.5 V I/O) are separately routed per port.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-ported SRAM applications.

Compared with CY7C1362BV33-200AXC and AS7C3256B-20JC, the 70V7519S200BC delivers unique bank-switchable arbitration, per-port I/O voltage selection, and JTAG compliance - making it optimal for new designs demanding flexible, high-bandwidth, testable dual-port memory.

Availability

70V7519S200BC is available at Aetrix Electronics and suitable for telecom infrastructure, FPGA-accelerated computing, industrial motion control, and automated test equipment requiring stable component supply and long-term obsolescence management.

Supply support for 70V7519S200BC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and power management ICs for communications and computing markets.

The 70V7519S200BC belongs to IDT's high-speed synchronous dual-port SRAM product line, designed specifically for applications needing deterministic, low-latency, concurrent memory access - such as packet buffering, FPGA offload, and real-time control systems.

FAQ

What is the maximum operating frequency supported by the 70V7519S200BC?

The 70V7519S200BC supports up to 200 MHz operation, but only under commercial temperature conditions (0°C to +70°C) and with VDDQ set to 3.3 V on the active port(s) via OPTL/OPTR. Industrial-grade 200 MHz operation is not supported - the highest industrial-rated speed is 166 MHz in BC256 package only.

Does the 70V7519S200BC support independent I/O voltage levels on its two ports?

Yes, the 70V7519S200BC supports independent I/O voltage selection: OPTL sets left-port VDDQL to either 3.3 V (VIH) or 2.5 V (VIL), and OPTR sets right-port VDDQR identically. This allows interfacing with mixed-voltage FPGAs or ASICs without external level shifters.

How does bank arbitration work in the 70V7519S200BC, and what happens during a bank conflict?

The 70V7519S200BC uses explicit bank address pins (BA0L–BA5L and BA0R–BA5R) to assign each port to one of 64 independent 4K × 36 banks. If both ports attempt access to the same bank simultaneously, neither access is valid - writes may corrupt data, and reads return invalid output. Users must manage bank assignment in software/firmware.

What are the key timing differences between pipelined and flow-through output modes in the 70V7519S200BC?

In pipelined mode (PL/FTL = VIH), the 70V7519S200BC delivers 3.4 ns clock-to-data-out (tCD2) with 5 ns minimum cycle time. In flow-through mode (PL/FTL = VIL), tCD1 is 10 ns and tCYC1 is 15 ns. Pipelined mode adds one-cycle latency but enables higher throughput; flow-through offers zero-cycle latency at lower bandwidth.

Is JTAG boundary-scan supported on the 70V7519S200BC, and which pins are used?

Yes, the 70V7519S200BC fully complies with IEEE 1149.1 JTAG boundary-scan. Required pins are TDI (pin A4), TDO (pin A1), TCK (pin T2), TMS (pin P3), and TRST (pin R3), all located on the 208-pin fpBGA package - enabling production test, interconnect verification, and debug visibility.