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Renesas 70V7599S133BC8
- Part No.:
- 70V7599S133BC8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 256-LBGA
- Datasheet:
-
70V7599S133BC8.pdf
- Description:
- IC SRAM 4.5MBIT PAR 256CABGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,131
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Product details
Overview
70V7599S133BC8 from IDT (now Renesas) is a high-speed, 128K × 36 (4 Mbit), synchronous bank-switchable dual-ported SRAM with independent left/right ports, 133 MHz operation (7.5 ns clock cycle), pipelined or flow-through output modes, and selectable 2.5V/3.3V I/O interface per port. It enables concurrent memory access in telecom packet buffers and real-time DSP co-processing systems.
For engineers reviewing the 70V7599S133BC8 datasheet, 70V7599S133BC8 pinout, 70V7599S133BC8 application, or 70V7599S133BC8 equivalent, key selection criteria include bank-switchable arbitration control, JTAG IEEE 1149.1 compliance, dual chip enable for depth expansion, and industrial-grade (-40°C to +85°C) operation in the 256-pin BGA package.
Technical Context
This device implements a true synchronous SRAM core-not legacy dual-port-enabling deterministic timing with 1.5 ns address setup and 0.5 ns hold at 133 MHz. Each port features independent clock, control, and 36-bit I/O with bank decode via six BA pins (BA0–BA5), allowing 64 × 2K × 36 banks with collision detection logic.
It supports self-timed writes, counter-enabled burst addressing with REPEAT/CNTEN, and separate byte enables (BE0–BE3) for 9-bit byte granularity. Power management includes four standby modes (ISB1–ISB4), with full CMOS-level standby drawing only 10 mA typical.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36 (4 Mbit), organized as 64 independent 2K × 36 banks |
| Max Clock Frequency | 133 MHz - enables 7.5 ns clock cycle time in pipelined mode |
| Access Time | 4.2 ns (max) clock-to-data-out in flow-through mode - critical for low-latency read paths |
| I/O Voltage Support | Selectable 2.5V or 3.3V per port via OPTL/OPTR pins - allows mixed-voltage system interfacing |
| Operating Temperature | -40°C to +85°C - qualified for industrial embedded and telecom infrastructure use |
| Package | 256-pin BGA (BC256), 17 mm × 17 mm, 1.0 mm ball pitch - supports high-density PCB layout |
| Power Supply | 3.3V ±150 mV core (VDD); separate VDDQ rails per port - decouples I/O noise from core logic |
Pinout & Package
70V7599S133BC8 is housed in a 256-pin Ball Grid Array (BC256) package with 17 mm × 17 mm body and 1.0 mm ball pitch. All VDD pins require 3.3V supply; VDDQ pins must match OPT pin voltage (2.5V if OPT = VIL, 3.3V if OPT = VIH).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port-specific clock inputs | Synchronous edge-triggered timing reference for each port's registers and memory access |
| CE0L/CE1L, CE0R/CE1R | Dual chip enables per port | Enable depth expansion without external logic; CE0=VIL & CE1=VIH activates port |
| BA0L–BA5L, BA0R–BA5R | Bank address inputs | Select one of 64 banks (0–63); simultaneous same-bank access by both ports causes invalidation |
| I/O0L–I/O35L, I/O0R–I/O35R | 36-bit bidirectional data buses | Supports byte-wise reads/writes via BE0–BE3; high-Z state controlled by OEL/OER and CE |
| PL/FTL, PL/FTR | Pipeline/Flow-Through mode select | DC-level input determining output latency: pipelined = 1-cycle delay, flow-through = combinational |
Key Features
| Feature | Design Value |
|---|---|
| Bank-switchable architecture | Enables concurrent non-conflicting access across 64 independent 2K×36 banks - eliminates arbitration overhead in multi-threaded buffer designs |
| JTAG IEEE 1149.1 support | Provides boundary-scan testability and debug visibility for high-reliability telecom and aerospace PCBs |
| Configurable I/O voltage per port | OPTL/OPTR pins allow left port at 2.5V and right port at 3.3V - simplifies interconnection with heterogeneous ASIC/FPGA I/O banks |
| Counter-enabled burst addressing | CNTEN/REPEAT/ADSL signals implement auto-incrementing or repeat-address burst transfers - reduces address bus cycles in streaming applications |
| Four-tier standby power management | ISB1–ISB4 modes deliver 10 mA (full CMOS standby) to 675 mA (dynamic active) - optimizes thermal budget in fanless industrial systems |
Applications
| Telecom Packet Buffer | DSP Co-Processing Memory |
|---|---|
|
Use Scenario: Storing incoming/outgoing ATM or Ethernet frames in line cards with strict latency budgets. IC Role / Device Role / Timing Role: Dual-port SRAM serving as shared frame buffer between ingress parser and egress scheduler logic. Use Value: Bank-switchable arbitration prevents port contention during back-to-back frame bursts; 4.2 ns flow-through access meets sub-10 ns read latency targets. |
Use Scenario: Real-time FFT or filtering pipelines where DSP core and DMA engine concurrently access coefficient/data tables. IC Role / Device Role / Timing Role: Synchronous dual-port memory enabling zero-wait-state data exchange between processor and peripheral DMA. Use Value: Pipelined output mode delivers deterministic 4.2 ns tCD2 at 133 MHz - aligns with DSP core clock domain without added synchronization logic. |
| Industrial PLC Data Exchange | Avionics Sensor Fusion Hub |
|
Use Scenario: Sharing sensor history and control setpoints between safety-critical motion controller and HMI update engine. IC Role / Device Role / Timing Role: Industrial-temperature dual-port SRAM acting as deterministic shared memory region with hardware-enforced bank isolation. Use Value: -40°C to +85°C rating and ISB3 <30 mA full standby ensure reliability in uncontrolled cabinet environments; JTAG enables in-system verification. |
Use Scenario: Aggregating inertial, GPS, and barometric data streams for Kalman filter execution in flight control units. IC Role / Device Role / Timing Role: High-bandwidth, low-jitter memory buffer synchronizing asynchronous sensor interfaces to deterministic filter compute clock. Use Value: 14 Gbps aggregate bandwidth (200 MHz × 36 bits × 2 ports) sustains multi-sensor fusion throughput; BC256 package meets DO-254 layout density requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-133BZI | 128K × 36, 133 MHz, but uses traditional dual-port core (not bank-switchable); no JTAG; 208-pin TQFP only | Lacks bank arbitration and collision detection - requires external logic for conflict resolution in multi-access systems | Choose when legacy footprint compatibility is required and bank-switching logic is implemented externally |
| AS7C3256B-133BIN | 128K × 32 (not 36-bit), 133 MHz, single-port only; no dual-clock or bank control; 100-pin TQFP | No concurrent port access - unsuitable for true dual-master architectures requiring simultaneous read/write | Consider only for cost-sensitive, single-controller buffer applications where 4-bit width reduction is acceptable |
Compared with CY7C1362BV33-133BZI and AS7C3256B-133BIN, the 70V7599S133BC8 uniquely delivers bank-switchable arbitration, per-port voltage selection, and JTAG testability - making it the sole option for deterministic, low-latency, mixed-voltage dual-access memory subsystems in industrial and telecom equipment.
Availability
70V7599S133BC8 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial PLCs, and avionics sensor hubs requiring stable component supply, long-lifecycle support, and industrial temperature qualification.
Supply support for 70V7599S133BC8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, specializes in high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.
The 70V7599S product line was designed specifically for deterministic, low-latency dual-access memory applications in packet processing, real-time signal analysis, and safety-critical control systems - emphasizing bank arbitration, voltage flexibility, and testability.
FAQ
What is the maximum operating frequency of the 70V7599S133BC8?
The 70V7599S133BC8 is rated for up to 133 MHz operation, corresponding to a 7.5 ns clock cycle time in pipelined mode. This speed grade is validated for both commercial (0°C to +70°C) and industrial (-40°C to +85°C) temperature ranges and requires VDDQ = 3.3V (i.e., OPTL/OPTR = VIH) per port. The device also supports 166 MHz and 200 MHz variants under specific voltage and package constraints.
Does the 70V7599S133BC8 support independent I/O voltage on each port?
Yes, the 70V7599S133BC8 supports independent I/O voltage selection per port via the OPTL and OPTR pins. Setting OPTL = VIL configures the left port for 2.5V I/O operation (with VDDQL = 2.5V), while OPTR = VIH sets the right port to 3.3V (with VDDQR = 3.3V). This enables seamless interfacing with mixed-voltage FPGAs or ASICs without level-shifting circuitry.
How does bank switching work in the 70V7599S133BC8?
The 70V7599S133BC8 divides its 4 Mbit array into 64 independent 2K × 36 banks. Each port selects a target bank using its own BA0–BA5 inputs. If both ports attempt simultaneous access to the same bank, neither access is valid and data corruption may occur. This user-controlled bank arbitration eliminates internal bus contention and enables predictable latency in multi-master systems.
What power-saving modes does the 70V7599S133BC8 offer?
The 70V7599S133BC8 provides four distinct standby modes: ISB1 (both ports TTL-level disabled), ISB2 (one port active), ISB3 (full CMOS-level standby, 10 mA typical), and ISB4 (one port CMOS-standby). These are controlled via CE0/CE1 logic levels and input voltage thresholds, enabling granular power optimization in battery-backed or thermally constrained industrial designs.
Is JTAG debugging supported on the 70V7599S133BC8?
Yes, the 70V7599S133BC8 fully complies with IEEE 1149.1 JTAG standards, featuring dedicated TDI, TDO, TCK, TMS, and TRST pins. This enables boundary-scan testing, in-system programming verification, and real-time signal observation - critical for high-reliability applications in telecom and avionics where field diagnostics and traceability are mandated.
70V7599S133BC8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 256-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 3.15V ~ 3.45V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-CABGA (17x17)
70V7599S133BC8 FAQ
1.How can I place an order for 70V7599S133BC8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 70V7599S133BC8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70V7599S133BC8 reliable?
The price and inventory of 70V7599S133BC8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V7599S133BC8 is usually 5 days.
3.What payment methods are accepted for 70V7599S133BC8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70V7599S133BC8 transactions.
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4.How is shipping managed for 70V7599S133BC8?
70V7599S133BC8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 70V7599S133BC8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70V7599S133BC8?
For technical support, including 70V7599S133BC8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V7599S133BC8 requirements.
6.How does Aetrix verify that 70V7599S133BC8 is sourced from the original manufacturer or authorized distributors?
All 70V7599S133BC8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V7599S133BC8 meets industry standards.
7.What is the process for return or replacement of 70V7599S133BC8?
All 70V7599S133BC8 units undergo pre-shipment inspection (PSI). If there is an issue with 70V7599S133BC8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70V7599S133BC8 part is unused and in its original packaging.
Return procedure for 70V7599S133BC8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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